Optoelectronic integrated circuit

Patent metadata

Field	Value
Publication number	US-9625647-B2
Application number	US-201414222841-A
Country	US
Kind code	B2
Filing date	Mar 24, 2014
Priority date	Jan 29, 2014
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

A semiconductor device employs an epitaxial layer arrangement including a first ohmic contact layer and first modulation doped quantum well structure disposed above the first ohmic contact layer. The first ohmic contact layer has a first doping type, and the first modulation doped quantum well structure has a modulation doped layer of a second doping type. At least one isolation ion implant region is provided that extends through the first ohmic contact layer. The at least one isolation ion implant region can include oxygen ions. The at least one isolation ion implant region can define a region that is substantially free of charge carriers in order to reduce a characteristic capacitance of the device. A variety of high performance transistor devices (e.g., HFET and BICFETs) and optoelectronic devices can employ this device structure. Other aspects of wavelength-tunable microresonantors and related semiconductor fabrication methodologies are also described and claimed.

First claim

What is claimed is:

1. A semiconductor device comprising:
a waveguide, comprising an active region, a coupling region, a tuning region, and first and second isolating passive waveguide regions, the waveguide divided into first through fourth sections, wherein:
the first and second sections are straight sections that are spaced apart and parallel to each other, wherein the coupling region includes the first section; and
the third and fourth sections are straight sections that are spaced apart and parallel to each other, and extend orthogonally to the first and second sections till ends of the first and second sections, wherein the fourth section is divided into fifth through ninth sections, wherein:
the fifth and sixth sections are first and second end portions of the fourth section, respectively, wherein the active region includes the second, third, fifth, and sixth sections; and
the eighth and ninth sections are formed adjacent to the fifth and sixth sections, respectively, wherein the eighth and ninth sections electrically isolate the seventh section from the fifth and sixth sections, respectively, wherein the tuning region includes the seventh section, and the first and second isolating passive waveguide regions are the eighth and ninth sections, respectively, wherein the waveguide comprises:
a first ohmic contact layer having a first doping type; and
a p-type modulation doped quantum well (QW) structure disposed above the first ohmic contact layer;

at least one first ion implant region formed in a first region of the first ohmic contact layer;
at least one second ion implant region formed on the at least one first ion implant region, and that is in electrical contact with the p-type modulation doped QW structure, wherein the at least one second ion implant region is a p-type ion implant region;
an anode terminal electrode disposed on the at least one second ion implant region;
a cathode terminal electrode disposed on a first mesa of the first ohmic contact layer; wherein the active region further includes the at least one first ion implant region, the anode terminal electrode, the at least one second ion implant region, and the cathode terminal electrode;
at least one third ion implant region formed in a second region of the first ohmic contact layer;
at least one fourth ion implant region formed on the at least one third ion implant region, and that is in electrical contact with the p-type modulation doped QW structure, wherein the at least one fourth ion implant region is a p-type ion implant region;
a first tuning electrode disposed on the at least one fourth ion implant region; and
a second tuning electrode disposed on a second mesa of the first ohmic contact layer, wherein the tuning region further includes the at least one third ion implant region, the first tuning electrode, the at least one fourth ion implant region, and the second tuning electrode.

2. The semiconductor device of claim 1 , wherein the at least one first-ion implant region and the at least one third ion implant region comprises oxygen ions, and wherein the at least one first ion implant region defines a current-blocking isolation region between the at least one second ion implant region and the first ohmic contact layer in the active region, and the at least one third ion implant region defines a current-blocking isolation region between the at least one fourth ion implant region and the first ohmic contact layer in the tuning region.

3. The semiconductor device of claim 1 , wherein the cathode and anode terminal electrodes are configured as terminals of a laser whereby an injected electrical current flows between the cathode and anode terminal electrodes thereby generating light and propagating the light within the waveguide.

4. The semiconductor device of claim 1 , wherein the cathode and anode terminal electrodes are configured as terminals of an optical detector that carry an electrical current caused by absorption of light propagating within the waveguide.

5. The semiconductor device of claim 1 , wherein the semiconductor device is configured as a switching thyristor laser.

6. The semiconductor device of claim 1 , wherein the semiconductor device is configured as a switching thyristor optical detector.

7. The semiconductor device of claim 1 , further comprising a resonant cavity defined by a rib waveguide, wherein the at least one first ion implant region and the at least one third ion implant region are disposed in a central region of the resonant cavity, wherein the at least one first ion implant region and the at least one third ion implant region are disposed on first and second sides of the rib waveguide, respectively, and wherein the resonant cavity supports propagation of an optical signal therein.

8. The semiconductor device of claim 7 , wherein the rib waveguide has a plurality of straight sections that are optically coupled together by bend sections.

9. The semiconductor device of claim 7 , further comprising a plurality of distributed bragg reflector (DBR) mirror layers formed below the first ohmic contact layer.

10. The semiconductor device of claim 9 , further comprising a plurality of dielectric mirror layers formed above the second ohmic contact layer.

11. The semiconductor device of claim 1 , wherein the semiconductor device is optically coupled to a zig-zag waveguide structure, wherein the semiconductor device is spaced from the zig-zag waveguide structure by a gap region.

12. The semiconductor device of claim 11 , wherein the coupling region further includes:
a fifth ion implant region formed in a third region of the first ohmic contact layer;
a sixth ion implant region disposed on the fifth ion implant region, and that is in electrical contact with the p-type modulation doped QW structure;
a first control electrode disposed on a third mesa of the first ohmic contact layer; and
a second control electrode disposed on the sixth ion implant region.

13. The semiconductor device of claim 1 , wherein the waveguide further includes:
at least one spacer layer disposed on the p-type modulation doped QW structure;
an n-type modulation doped QW structure disposed on the at least one spacer layer, wherein the p-type and n-type modulation doped QW structures include one or more QWs;
a fifth and a sixth ion implant regions disposed above the n-type
modulation doped QW structure; and
a second ohmic contact layer disposed above the n-type modulation doped QW structure, and in contact with the fifth and sixth ion implant regions, wherein the second ohmic contact layer has a p-type doping.

14. The semiconductor device of claim 13 , wherein the waveguide includes an N+ type doped layer for the first ohmic contact layer, a first plurality of layers that define the p-type modulation doped QW structure and a second plurality of layers that define the n-type modulation doped QW structure offset vertically above the p-type modulation doped QW structure.

15. The semiconductor device of claim 13 , wherein at least one of the fifth and sixth ion implant regions provides for lateral confinement of light within a resonant cavity of the semiconductor device.

Assignees

• Opel Solar Inc
• Univ Connecticut

Inventors

• Taylor Geoff W

Classifications

• H01S5/0425

  Electrodes, e.g. characterised by the structure · CPC title

• H01S5/04257

  having positive and negative electrodes on the same side of the substrate · CPC title

• H01S5/2063

  obtained by particle bombardment · CPC title

• G02B6/1347 Primary

  using ion implantation (ion implantation in glass C03C23/0055; ion implantation in general C23C) · CPC title

• H01S5/309

  doping of barrier layers that confine charge carriers in the laser structure, e.g. the barriers in a quantum well structure (barriers in quantum wells per se H01S5/3407) · CPC title