Metal nitride material for thermistor, method for producing same, and film type thermistor sensor

US9625326B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9625326-B2
Application numberUS-201414455541-A
CountryUS
Kind codeB2
Filing dateAug 8, 2014
Priority dateAug 12, 2013
Publication dateApr 18, 2017
Grant dateApr 18, 2017

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: (M 1 - v A v ) x Al y (N 1-w O w ) z (where “M” represents at least one of Ti, V, Cr, Mn, Fe, and Co, “A” represents at least one of Sc, Zr, Mo, Nb, and W, 0.0<v<1.0, 0.70≦y/(x+y)≦0.98, 0.45≦z≦0.55, 0<w≦0.35, and x+y+z=1), wherein the crystal structure thereof is a hexagonal wurtzite-type single phase.

First claim

Opening claim text (preview).

What is claimed is: 1. A metal nitride material for a thermistor, consisting of a metal nitride represented by the general formula: (M 1-v A v ) x Al y (N 1-w O w ) z (where “M” represents at least one of Ti, V, Cr, Mn, Fe, and Co, “A” represents at least one of Sc, Zr, Mo, Nb, and W, 0.0<v<1.0, 0.70≦y/(x+y) ≦0.98, 0.45≦z≦0.55, 0w≦0.35, and x+y+z=1), wherein the crystal structure thereof is a hexagonal wurtzite-type single phase. 2. The metal nitride material for a thermistor according to claim 1 , wherein the metal nitride material, is deposited as a film and is a columnar crystal, extending in a vertical direction with respect to the surface of the film. 3. The metal nitride material for a thermistor according to claim 2 , wherein the metal nitride material is deposited as a film and is more strongly oriented along a c-axis than an a-axis in a vertical direction with respect to the surface of the film. 4. A film type thermistor sensor comprising: an insulating film; a thin film thermistor portion made of the metal nitride material for a thermistor according to claim 2 on the insulating film; and a pair of pattern electrodes formed at least on the top or the bottom of the thin film thermistor portion. 5. A method for producing the metal nitride material for a thermistor according to claim 2 , the method comprising: a deposition step of performing film deposition by reactive sputtering in a nitrogen- and oxygen-containing atmosphere using an M-A-Al (where “M” represents at least one of Ti, V, Cr, Mn, Fe, and Co, and “A” represents at least one of Sc, Zr, Mo, Nb, and W) alloy sputtering target. 6. The metal nitride material, for a thermistor according to claim 1 , wherein the metal nitride material is deposited as a film and is more strongly oriented along a c-axis than, an a-axis in a vertical direction with respect to the surface of the film. 7. A film type thermistor sensor comprising: an insulating film; a thin film thermistor portion made of the metal nitride material for a thermistor according to claim 6 on the insulating film; and a pair of pattern electrodes formed at least on the top or the bottom of the thin film thermistor portion. 8. A film type thermistor sensor comprising: an insulating film; a thin film thermistor portion made of the metal nitride material for a thermistor according to claim 1 on the insulating film; and a pair of pattern electrodes formed at least on the top or the bottom of the thin firm thermistor portion. 9. A method for producing the metal nitride material for a thermistor according to claim 6 , the method comprising: a deposition step of performing film deposition by reactive sputtering in a nitrogen- and oxygen-containing atmosphere using an M-A-Al (where “M” represents at least one of Ti, V, Cr, Mn, Fe, and Co, and “A” represents at least one of Sc, Zr, Mo, Nb, and alloy sputtering target. 10. A method for producing the metal nitride material for a thermistor according to claim 1 , the method comprising: a deposition step of performing film deposition by reactive sputtering in a nitrogen- and oxygen-containing atmosphere using an M-A-Al (where “M” represents at least one of Ti, V, Cr, Mn, Fe, and Co, and “A” represents at least one of Sc, Zr, Mo, Nb, and W) alloy sputtering target.

Assignees

Inventors

Classifications

  • Products containing multiple oriented crystallites, e.g. columnar crystallites · CPC title

  • Thermistors (H01C7/02 - H01C7/06 take precedence) · CPC title

  • by reactive sputtering · CPC title

  • Nitrides · CPC title

  • having negative temperature coefficient · CPC title

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What does patent US9625326B2 cover?
The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: (M 1 - v A v ) x Al y (N 1-w O w ) z (where “M” represents at least one of Ti, V, Cr, Mn, Fe, and Co, “A” represents at least one of Sc, Zr, Mo, Nb, and W, 0.0<v<1.0, 0.70≦y/(x+y)≦0.98, 0.45≦z≦0.55, 0<w≦0.35, and x+y+z=1), wherein the crystal structure thereof is a hexagonal wurtzite-typ…
Who is the assignee on this patent?
Mitsubishi Materials Corp
What technology area does this patent fall under?
Primary CPC classification G01K7/22. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).