Thermally conductive silicone composition, production method thereof, and semiconductor device
US-12104113-B2 · Oct 1, 2024 · US
Polyamide resin composition and molded article comprising the same
US9624416B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9624416-B2 |
| Application number | US-201514875852-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 6, 2015 |
| Priority date | Sep 30, 2010 |
| Publication date | Apr 18, 2017 |
| Grant date | Apr 18, 2017 |
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- Title
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Abstract
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A polyamide resin composition containing a polyamide resin (A) and a property imparting component. The composition comprises relative to 100 parts by volume of the polyamide resin (A), as the property imparting component, 50 to less than 100 parts by volume of flake graphite (B), 5 to 40 parts by volume of carbon fibers (C), and 0.1 to 5 parts by volume of a polyhydric alcohol (D).
First claim
Opening claim text (preview).
The invention claimed is: 1. A thermally conductive polyamide resin composition comprising a polyamide resin (A) and a property imparting component, the composition being: a polyamide resin composition which comprises, relative to 100 parts by volume of the polyamide resin (A), as the property imparting component, 50 to less than 100 parts by volume of flake graphite (B) having an average particle size of 5 to 80 μm and an aspect ratio of 30 to 200 on average, 5 to less than 40 parts by volume of carbon fibers (C), and 0.1 to 5 parts by volume of a polyhydric alcohol (D) having a melting temperature of 150 to 280° C. 2. The thermally conductive polyamide resin composition according to claim 1 , wherein the carbon fibers (C) are PAN carbon fibers that are obtained by carbonizing polyacrylonitrile fibers. 3. The thermally conductive polyamide resin composition according to claim 1 , wherein a fiber diameter of the carbon fibers (C) is 5 to 15 μm. 4. The thermally conductive polyamide resin composition according to claim 1 , wherein a fiber length of the carbon fibers (C) is 0.1 to 20 mm. 5. The thermally conductive polyamide resin composition according to claim 1 , which is obtained by melt-kneading. 6. A molded article comprising the thermally conductive polyamide resin composition according to claim 1 .
Assignees
Inventors
Classifications
Polyamides or polyesteramides · CPC title
fibre-reinforced plastics, e.g. glass-reinforced plastics · CPC title
Additives being defined by their particle size in general · CPC title
of metals · CPC title
Nitrogen-containing compounds {(C08K5/0091 takes precedence)} · CPC title
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- What does patent US9624416B2 cover?
- A polyamide resin composition containing a polyamide resin (A) and a property imparting component. The composition comprises relative to 100 parts by volume of the polyamide resin (A), as the property imparting component, 50 to less than 100 parts by volume of flake graphite (B), 5 to 40 parts by volume of carbon fibers (C), and 0.1 to 5 parts by volume of a polyhydric alcohol (D).
- Who is the assignee on this patent?
- Ube Industries
- What technology area does this patent fall under?
- Primary CPC classification C09K5/08. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Apr 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).