Conductive silicone materials and uses

Patent metadata

Field	Value
Publication number	US-9428680-B2
Application number	US-201414774401-A
Country	US
Kind code	B2
Filing date	Mar 11, 2014
Priority date	Mar 14, 2013
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 12 weight percent, all based on weight of the curable silicone composition; wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition remains curable to a conductive silicone material having a concentration of the Cu—Ag core-shell particles of from 88.0 to 92 weight percent and having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method, and a thermal conductivity of greater than or equal to 2.9 Watts per meter*Kelvin (W/(m*K)) measured according to Thermal Properties Test Method.

First claim

What is claimed is:

1. A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, a mechanical thixotropic filler that is carbon nanotubes, and hydrocarbon vehicle; the curable silicone composition being characterized by: a concentration of the Cu—Ag core-shell particles of from 80 to 89 weight percent and a total concentration of silver of from 7 to 12 weight percent, all based on weight of the curable silicone composition; wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition remains curable to a conductive silicone material having a concentration of the Cu—Ag core-shell particles of from 88.0 to 92 weight percent and having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method and a thermal conductivity of greater than or equal to 2.9 Watts per meter*Kelvin measured according to Thermal Properties Test Method; wherein the curable silicone composition is characterized by a Thixotropic Index(η 1 /η 10 ) of from 3 to 10.

2. A curable silicone composition comprising a blend of the following ingredients:
a hydrocarbon vehicle at a concentration of from 1 to 15 weight percent based on weight of the curable silicone composition, wherein the hydrocarbon vehicle is characterized by a boiling point from 100 to 360 degrees Celsius;
a curable organosiloxane composition at a concentration of from 8 to 16 weight percent based on weight of the curable silicone composition;
Cu—Ag core-shell particles at a concentration of from 70 to 89 weight percent based on weight of the curable silicone composition; and
a mechanical thixotropic filler that is carbon nanotubes;
wherein the total concentration of silver is from 9 to 12 weight percent based on weight of the curable silicone composition; wherein the curable silicone composition has a concentration of the Cu—Ag core-shell particles and hydrocarbon vehicle such that the curable silicone composition remains curable to a conductive silicone material having a concentration of the Cu—Ag core-shell particles of from 88.0 to 92 weight percent and having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method and a thermal conductivity of greater than or equal to 2.9 Watts per meter*Kelvin (W/(m*K)) measured according to Thermal Properties Test Method; and
wherein the curable silicone composition is characterized by a Thixotropic Index(η 1 /η 10 ) of from 3 to 10.

3. The curable silicone composition of claim 2 characterized by a volume resistivity less than 0.0010 Ohm-centimeter measured according to Volume Resistivity Test Method and a thermal conductivity of greater than or equal to 3 Watts per meter*Kelvin measured according to Thermal Properties Test Method.

4. The curable silicone composition of claim 2 characterized by the following limitations:
wherein the hydrocarbon vehicle is an alkanes mixture of different molecules wherein the lowest boiling alkanes molecules have an initial boiling point greater than 150 degrees Celsius and the highest boiling alkanes molecules have an end boiling less than 300 degrees Celsius and the hydrocarbon vehicle is at a concentration of from 1 to 15 weight percent based on weight of the curable silicone composition;
wherein the curable organosiloxane composition comprises at least one diorganosiloxane compound, a catalyst, and an adhesion promoter; wherein the at least one diorganosiloxane compound has on average per molecule at least 1 reactive moiety, wherein each reactive moiety independently is an alkenyl moiety, Si—H moiety, Si—OH moiety, Si—OR moiety, wherein R is (C 1 -C 10 )hydrocarbyl, —C(O)(C 1 -C 10 )hydrocarbyl, or —N═CR 1 R 2 , wherein each of R 1 and R 2 independently is (C 1 -C 10 )hydrocarbyl or R 1 and R 2 are taken together to form a (C 2 -C 10 )hydrocarbylene; and wherein the at least one diorganosiloxane compound is at least 50 weight percent of the curable organosiloxane composition;
wherein the Cu—Ag core-shell particles are unsintered and are at a concentration of from 75 to 89 weight percent based on weight of the curable silicone composition;
wherein the total concentration of silver is from 9.1 to 12 weight percent based on weight of the curable silicone composition;
wherein the mechanical thixotropic filler is carbon nanotubes, wherein the carbon nanotubes are at a concentration of from 0.1 to 5.0 weight percent based on weight of the curable silicone composition; and
wherein the curable silicone composition is characterized by a volume resistivity less than 0.0010 Ohm-centimeter measured according to Volume Resistivity Test Method and a thermal conductivity of greater than or equal to 4 Watts per meter*Kelvin measured according to Thermal Properties Test Method.

5. The curable silicone composition of claim 4 , characterized by the following limitations:
wherein the hydrocarbon vehicle is an alkanes mixture;
wherein the curable organosiloxane composition comprises at least one diorganosiloxane compound, at least one organohydrogensilicon compound, a hydrosilylation catalyst, and an epoxy-functional adhesion promoter; wherein the at least one diorganosiloxane compound has on average per molecule at least 1 alkenyl moiety and the organohydrogensilicon compound has on average per molecule at least 1 Si—H moiety; and wherein the at least one diorganosiloxane compound is from 60 to 80 wt % of the curable organosiloxane composition;
wherein the Cu—Ag core-shell particles are at a concentration of from 79.5 to 86.4 weight percent based on weight of the curable silicone composition;
wherein the total concentration of silver is from 9.5 to 12 weight percent based on weight of the curable silicone composition; and
wherein the carbon nanotubes are single-walled carbon nanotubes, multi-walled carbon nanotubes, derivatized carbon nanotubes or a combination of any two or more of the single-walled carbon nanotubes, multi-walled carbon nanotubes, and derivatized carbon nanotubes; and the concentration of carbon nanotubes is from 0.2 to 2 weight percent based on weight of the curable silicone composition.

6. The curable silicone composition of claim 5 , characterized by the following limitations:
wherein the alkanes mixture is an isoalkanes mixture comprising at least two of (C 9 -C 12 )isoalkanes, at least two of (C 12 -C 16 )isoalkanes or at least two of (C 16 -C 22 )isoalkanes and the hydrocarbon vehicle is at a concentration of from 1.5 to 15 weight percent based on weight of the curable silicone composition;
wherein the curable organosiloxane composition is hydrosilylation curable and comprises the at least one diorganosiloxane compound, the at least one trimethylsiloxy-terminated dimethyl organohydrogensilicon compound, a microencapsulated hydrosilylation catalyst, and a bis(alpha,omega-glycidoxyalkyl)-dialkyl/(alkyl,alkenyl)siloxane; wherein the alkenyl of the diorganosiloxane is vinyl and the at least one diorganosiloxane compound has on average per molecule at least 1.1 vinyl moieties, the at least one trimethylsiloxy-terminated dimethyl organohydrogensilicon compound is and has on average per molecule at least 1.1 Si—H moieties, or the least one diorganosiloxane compound has on average per molecule at least 1.1 vinyl moieties and the at least one organohydrogensilicon compound has on average per molecule at least 1.1 Si—H moieties; wherein the at least one diorganosiloxane compound having vinyl moieties is from 70 to 75 wt % of the curable organosiloxane composition; wherein the at least one trimethylsiloxy-terminated dimethyl organohydrogensilicon compound is from 1 to 5 weight percent, the microencapsulated hydrosilylation cat

Assignees

• Dow Corning

Inventors

• Zambova Adriana Petkova

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title