Adhesive, thermally conductive, electrical insulators

Patent metadata

Field	Value
Publication number	US-9321949-B2
Application number	US-201313759741-A
Country	US
Kind code	B2
Filing date	Feb 5, 2013
Priority date	Aug 5, 2010
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

According to various aspects, exemplary embodiments are disclosed of adhesive, thermally conductive electrically insulators. In an exemplary embodiment, a thermally conductive, electrically insulating material includes 4 to 40 parts by weight of a macromolecular matrix material; 1 to 20 parts by weight of an adhesive additive; and 40 to 85 parts by weight of thermally conductive electrically insulating particles. The adhesive additive includes a reactive group that is the same as or similar to at least one curable active group in the macromolecular matrix material.

First claim

What is claimed is:

1. A thermally conductive electrically insulating material consisting only of:
4 to 40 parts by weight of a macromolecular matrix material;
1 to 20 parts by weight of an adhesive additive; and
40 to 85 parts by weight of thermally conductive electrically insulating particles.

2. The thermally conductive electrically insulating material of claim 1 , wherein:
the macromolecular matrix material comprises one or more of vinyl silicon resin, polyisobutylene polymer, organic silicon rubber, polyurethane, methyl methacrylate, organopolysiloxane, acrylate, and polyamide resin; and
the adhesive additive comprises one or more of MQ silicon resin, petroleum-based rosin resin, silicone resin, polyols, ethyl acrylate, rosin, and ethylene phenyl acetate resin.

3. The thermally conductive electrically insulating material of claim 1 , wherein the thermally conductive electrically insulating particles comprise one or more of aluminum oxide, boron nitride, aluminum nitride, magnesium oxide and zinc oxide.

4. The thermally conductive electrically insulating material of claim 1 , wherein the adhesive additive includes a reactive group that is the same as at least one curable active group in the macromolecular matrix material.

5. The thermally conductive electrically insulating material of claim 1 , wherein:
the macromolecular matrix material is vinyl silicon resin, the adhesive additive is vinyl MQ silicon resin, the thermally conductive electrically insulating particles are aluminum oxide particles; or
the macromolecular matrix material is polyisobutylene polymer, the adhesive additive is petroleum-based rosin resin, the thermally conductive electrically insulating particles are boron nitride and zinc oxide particles; or
the macromolecular matrix material is organic silicon rubber, the adhesive additive is silicon resin, the thermally conductive electrically insulating particles are boron nitride particles; or
the macromolecular matrix material is polyurethane, the adhesive additive is polyols, the thermally conductive electrically insulating particles are aluminum nitride particles; or
the macromolecular matrix material is methyl methacrylate, the adhesive additive is ethyl acrylate, the thermally conductive electrically insulating particles are magnesium oxide and zinc oxide particles; or
the macromolecular matrix material includes vinyl silicon resin, polyisobutylene polymer, and organic silicon rubber, and the adhesive additives include a MQ silicon resin and a petroleum-based rosin resin.

6. The thermally conductive electrically insulating material of claim 1 , wherein the thermally conductive electrically insulating material has a thermal resistance of 0.628 or less, a dielectric breakdown voltage of at least 7 kilovolts or more, and at least a peel off value of 5.6 grams per inch width or more.

7. The thermally conductive electrically insulating material of claim 1 , wherein both sides of the thermally conductive electrically insulating material have adhesive properties thereby allowing the thermally conductive electrically insulating material to be adhered between a heat sink and an electronic component.

8. An electronic device including a heat sink, an electronic component, and the thermally conductive electrically insulating material of claim 1 adhered between the heat sink and the electronic component without using double-sided adhesive tape.

9. A thermally conductive electrically insulating sheet comprising a support film and the thermally conductive electrically insulating material of claim 1 coated on the support film.

10. The thermally conductive electrically insulating sheet of claim 9 , wherein:
the macromolecular matrix material comprises one or more of vinyl silicon resin, polyisobutylene polymer, organic silicon rubber, polyurethane, methyl methacrylate, organopolysiloxane, acrylate and polyamide resin; and
the adhesive additive comprises one or more of MQ silicon resin, petroleum-based rosin resin, silicone resin, polyols, ethyl acrylate, rosin, and ethylene phenyl acetate resin.

11. The thermally conductive electrically insulating sheet of claim 9 , wherein the thermally conductive electrically insulating particles comprise one or more of aluminum oxide, boron nitride, aluminum nitride, magnesium oxide, and zinc oxide.

12. The thermally conductive electrically insulating sheet of claim 9 , wherein the support film comprises glass fiber cloth, polyethylene naphthalate (PEN) or polyimide (PI).

13. The thermally conductive electrically insulating sheet of claim 9 , wherein both sides of the thermally conductive electrically insulating sheet have adhesive properties, whereby the thermally conductive electrically insulating sheet may be adhered between a heat sink and an electronic component without using double-sided adhesive tape.

14. A method of preparing a thermally conductive electrically insulating material of claim 1 , the method comprising:
uniformly mixing the 4 to 40 parts by weight of the macromolecular matrix material uncured and the 1 to 20 parts by weight of the adhesive additive;
uniformly adding the 40 to 85 parts by weight of thermally conductive electrically insulating particles to the mixed macromolecular matrix material and adhesive additive; and
curing and shaping the mixture of the macromolecular matrix material and the adhesive additive added with the thermally conductive electrically insulating particles.

15. The method of claim 14 , wherein:
the macromolecular matrix material comprises one or more of vinyl silicon resin, polyisobutylene polymer, organic silicon rubber, polyurethane, methyl methacrylate, organopolysiloxane, acrylate, and polyamide resin; and
the adhesive additive comprises one or more of MQ silicon resin, petroleum-based rosin resin, silicone resin, polyol, ethyl acrylate, rosin, and ethylene phenyl acetate resin.

16. The method of claim 14 , wherein the thermally conductive electrically insulating particles comprise one or more of aluminum oxide, boron nitride, aluminum nitride, magnesium oxide, and zinc oxide.

17. The method of claim 14 , further comprising:
coating a support film with the mixture of the macromolecular matrix material and the adhesive additive added with the thermally conductive electrically insulating particles; and
curing and shaping the mixture coated on the support film.

18. The method of claim 14 , wherein the support film comprises glass fiber cloth, polyethylene naphthalate, or polyimide.

19. The method of claim 14 , wherein:
both sides of the thermally conductive electrically insulating material have adhesive properties; and
the method further comprises adhering the thermally conductive electrically insulating material between a heat sink and an electronic component without using double-sided adhesive tape.

Assignees

• Laird Technologies Inc

Inventors

• Wang Yousen
• Zhao Jingqi

Classifications

• C08L83/00

  Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers · CPC title

• C09K5/14

  Solid materials, e.g. powdery or granular · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• C08L83/04

  Polysiloxanes · CPC title