Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device

Patent metadata

Field	Value
Publication number	US-9620403-B2
Application number	US-201414783339-A
Country	US
Kind code	B2
Filing date	Apr 3, 2014
Priority date	Apr 9, 2013
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

The present invention provides an adhesive sheet used in manufacture of a semiconductor device, containing a filler having an average particle size of 0.3 μm or less and an acrylic resin, wherein the content of the filler is in the range of 20 to 45% by weight with respect to the entire adhesive sheet, and the content of the acrylic resin is in the range of 40 to 70% by weight with respect to entire resin components.

First claim

The invention claimed is:

1. An adhesive sheet used in manufacture of a semiconductor device, comprising a filler having an average particle size of less than 0.1 μm and an acrylic resin, wherein
the content of the filler is in the range of 20 to 45% by weight with respect to the entire adhesive sheet, and
the content of the acrylic resin is in the range of 40 to 70% by weight with respect to entire resin components.

2. The adhesive sheet according to claim 1 , that is a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip bonded onto an adherend.

3. The adhesive sheet according to claim 1 , wherein the maximum particle size of the filler is 0.5 μm or less.

4. The adhesive sheet according to claim 1 , wherein the filler is a silica filler.

5. The adhesive sheet according to claim 1 , wherein the tensile storage elastic modulus at 23° C. of the adhesive sheet in an uncured state is 1.0 GPa to 3.0 GPa.

6. An adhesive sheet integrated with a dicing tape, comprising a dicing tape and the adhesive sheet according to claim 1 laminated on the dicing tape, wherein
the dicing tape has a structure including a base and a pressure-sensitive adhesive layer laminated on the base, and
the adhesive sheet is laminated on the pressure-sensitive adhesive layer.

7. A semiconductor device that is manufactured by using the adhesive sheet integrated with a dicing tape according to claim 6 .

8. A method of manufacturing a semiconductor device using the adhesive sheet integrated with a dicing tape according to claim 6 , comprising the steps of:
pasting a semiconductor wafer onto the adhesive sheet of the adhesive sheet integrated with a dicing tape,
dicing the semiconductor wafer to form a semiconductor element,
peeling the semiconductor element from the pressure-sensitive adhesive layer of the dicing tape together with the adhesive sheet integrated with a dicing tape, and
flip-chip bonding the semiconductor element onto an adherend.

Assignees

• Nitto Denko Corp

Inventors

• Shiga Goji
• Takamoto Naohide

Classifications

• H10P72/7404

  the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer · CPC title

• H10W46/607

  Located on parts of packages, e.g. on encapsulations or on package substrates · CPC title

• H10W46/401

  for identification or tracking · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10P72/7438

  with parts of the auxiliary support remaining in the finished device · CPC title