Curable organopolysiloxane compositions

US9617186B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9617186-B2
Application numberUS-201414915004-A
CountryUS
Kind codeB2
Filing dateAug 5, 2014
Priority dateAug 28, 2013
Publication dateApr 11, 2017
Grant dateApr 11, 2017

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  5. First independent claim

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Abstract

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An artificial stone can be prepared by binding a suitable stone filler with a binder which contains a silicon bonded, hydroxyl-functional silicone resin also optionally bearing silicon bonded alkoxy groups, and an organosilicon compound which is a silane or siloxane bearing silicon bonded alkoxy groups. The artificial stone is resistant to the effects of UV light as well as heat.

First claim

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The invention claimed is: 1. A curable resin composition, comprising: (A1) a silicone resin component comprising at least one organopolysiloxane resin consisting of units of the formula R a (OH) b (R 1 O) c SiO (4-a-b-c)/2   (I), wherein R each are identical or different, and denote a monovalent, SiC-bonded hydrocarbon radical optionally substituted by halogen, or denote a Si-bonded halogen atom, R 1 each are identical or different and denote a monovalent, optionally substituted hydrocarbon radical, a is 0, 1, 2 or 3, b is 0, 1, 2 or 3 and c is 0, 1, 2 or 3, with the provisos that: in formula (I) the sum a+b+c≦3, in the resin component (A1) b≧1 in at least 2% of all the units of formula (I), in the resin component (A1) c≧1 in not more than 10% of all the units of formula (I), in the resin component (A1) a=2 in at most 50% of the units of formula (I), and the resin component (A1) has a mean molecular weight Mw (weight average) of from 500 g/mol to 11,000 g/mol and a mean molecular weight Mn (number average) of from 500 g/mol to 5000 g/mol, and the polydispersity (Mw/Mn) of the resin component (A1) is from 1 to 5, (A2) an organosilicon component consisting of at least one organosilicon compound consisting of units of the formula R 2 d (OH) e (R 3 O) f SiO (4-d-e-f)/2   (II), wherein R 2 each are identical or different and denote a monovalent, SiC-bonded hydrocarbon radical optionally substituted by halogen, or denote a Si-bonded halogen atom, R 3 each are identical or different and denote a monovalent, optionally substituted hydrocarbon radical, d is 0, 1 or 2, e is 0, 1, 2 or 3 and f is 0, 1, 2 or 3, with the provisos that: in formula (II) the sum d+e+f≦4, in the organosilicon component (A2) f≧1 in at least 10% of all the units of formula (II), in the organosilicon component (A2) e≧1 in not more than 2% of all the units of formula (II), and in the organosilicon component (A2), in at most 50% of the units of formula (II) with d+e+f≦3, d=2, and (B) at least one filler. 2. The composition of claim 1 , wherein component (A1) is a resin component (A1-1) consisting of at least one organopolysiloxane resin consisting of units of the formulae RSiO 3/2   (III), and RSi(OH)O 2/2   (IV) and optionally units selected from the group consisting of units of the formulae RSi(OR 1 )O 2/2   (V), RSi(OR 1 ) 2 O 1/2   (VI), R 2 SiO 2/2   (VII), and R 2 Si(OH)O 1/2   (VIII), wherein R and R 1 have one of the above-mentioned meanings and with the provisos that: in the resin component (A1-1), the sum of the units of formulae (IV) and (VIII), based on the total number of all the units of formulae (III) to (VIII), is at least 2%, in the resin component (A1-1), the sum of the units of formulae (V) and (VI), based on the total number of all the units of formulae (III) to (VIII), is not more than 10%, in the resin component (A1-1), the sum of the units of formulae (VII) and (VIII), based on the total number of all the units of formulae (III) to (VIII), is at most 50%, and the resin component (A1-1) has a mean molecular weight Mw of from 500 g/mol to 11,000 g/mol and a mean molecular weight Mn of from 500 g/mol to 5000 g/mol, and the polydispersity (Mw/Mn) of the resin component (A1-1) is from 1 to 5. 3. The composition of claim 1 , wherein component (A1) is present, relative to component (A2), in a weight ratio of from 99:1 to 50:50. 4. The composition of claim 2 , wherein component (A1) is present, relative to component (A2), in a weight ratio of from 99:1 to 50:50. 5. The composition of claim 1 , wherein components (A1) and (A2) are present in a total amount of from 1 to 30 parts by weight, based on 100 parts by weight of the composition. 6. The composition of claim 2 , wherein components (A1) and (A2) are present in a total amount of from 1 to 30 parts by weight, based on 100 parts by weight of the composition. 7. The composition of claim 3 , wherein components (A1) and (A2) are present in a total amount of from 1 to 30 parts by weight, based on 100 parts by weight of the composition. 8. The composition of claim 1 , wherein filler(s) (B) are present in a total amount of from 70 to 99 parts by weight, based on 100 parts by weight of the composition. 9. The composition of claim 2 , wherein filler(s) (B) are present in a total amount of from 70 to 99 parts by weight, based on 100 parts by weight of the composition. 10. A method for producing a compositions of claim 1 , comprising mixing the individual components in any desired sequence. 11. The method of claim 10 , wherein the mixing takes place at a temperature that is at least 20 K below the boiling point of the organosilicon component (A2). 12. A molded body produced by crosslinking a composition of claim 1 . 13. A molded body produced by crosslinking a composition of claim 2 . 14. The molded body of claim 12 , which is an artificial stone. 15. A method for producing an artificial stone product, comprising molding and crosslinking a composition of claim 1 .

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What does patent US9617186B2 cover?
An artificial stone can be prepared by binding a suitable stone filler with a binder which contains a silicon bonded, hydroxyl-functional silicone resin also optionally bearing silicon bonded alkoxy groups, and an organosilicon compound which is a silane or siloxane bearing silicon bonded alkoxy groups. The artificial stone is resistant to the effects of UV light as well as heat.
Who is the assignee on this patent?
Wacker Chemie Ag
What technology area does this patent fall under?
Primary CPC classification C04B26/32. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 11 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).