Two-component mortar mass and use thereof
US-10501372-B2 · Dec 10, 2019 · US
US9617186B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9617186-B2 |
| Application number | US-201414915004-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 5, 2014 |
| Priority date | Aug 28, 2013 |
| Publication date | Apr 11, 2017 |
| Grant date | Apr 11, 2017 |
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An artificial stone can be prepared by binding a suitable stone filler with a binder which contains a silicon bonded, hydroxyl-functional silicone resin also optionally bearing silicon bonded alkoxy groups, and an organosilicon compound which is a silane or siloxane bearing silicon bonded alkoxy groups. The artificial stone is resistant to the effects of UV light as well as heat.
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The invention claimed is: 1. A curable resin composition, comprising: (A1) a silicone resin component comprising at least one organopolysiloxane resin consisting of units of the formula R a (OH) b (R 1 O) c SiO (4-a-b-c)/2 (I), wherein R each are identical or different, and denote a monovalent, SiC-bonded hydrocarbon radical optionally substituted by halogen, or denote a Si-bonded halogen atom, R 1 each are identical or different and denote a monovalent, optionally substituted hydrocarbon radical, a is 0, 1, 2 or 3, b is 0, 1, 2 or 3 and c is 0, 1, 2 or 3, with the provisos that: in formula (I) the sum a+b+c≦3, in the resin component (A1) b≧1 in at least 2% of all the units of formula (I), in the resin component (A1) c≧1 in not more than 10% of all the units of formula (I), in the resin component (A1) a=2 in at most 50% of the units of formula (I), and the resin component (A1) has a mean molecular weight Mw (weight average) of from 500 g/mol to 11,000 g/mol and a mean molecular weight Mn (number average) of from 500 g/mol to 5000 g/mol, and the polydispersity (Mw/Mn) of the resin component (A1) is from 1 to 5, (A2) an organosilicon component consisting of at least one organosilicon compound consisting of units of the formula R 2 d (OH) e (R 3 O) f SiO (4-d-e-f)/2 (II), wherein R 2 each are identical or different and denote a monovalent, SiC-bonded hydrocarbon radical optionally substituted by halogen, or denote a Si-bonded halogen atom, R 3 each are identical or different and denote a monovalent, optionally substituted hydrocarbon radical, d is 0, 1 or 2, e is 0, 1, 2 or 3 and f is 0, 1, 2 or 3, with the provisos that: in formula (II) the sum d+e+f≦4, in the organosilicon component (A2) f≧1 in at least 10% of all the units of formula (II), in the organosilicon component (A2) e≧1 in not more than 2% of all the units of formula (II), and in the organosilicon component (A2), in at most 50% of the units of formula (II) with d+e+f≦3, d=2, and (B) at least one filler. 2. The composition of claim 1 , wherein component (A1) is a resin component (A1-1) consisting of at least one organopolysiloxane resin consisting of units of the formulae RSiO 3/2 (III), and RSi(OH)O 2/2 (IV) and optionally units selected from the group consisting of units of the formulae RSi(OR 1 )O 2/2 (V), RSi(OR 1 ) 2 O 1/2 (VI), R 2 SiO 2/2 (VII), and R 2 Si(OH)O 1/2 (VIII), wherein R and R 1 have one of the above-mentioned meanings and with the provisos that: in the resin component (A1-1), the sum of the units of formulae (IV) and (VIII), based on the total number of all the units of formulae (III) to (VIII), is at least 2%, in the resin component (A1-1), the sum of the units of formulae (V) and (VI), based on the total number of all the units of formulae (III) to (VIII), is not more than 10%, in the resin component (A1-1), the sum of the units of formulae (VII) and (VIII), based on the total number of all the units of formulae (III) to (VIII), is at most 50%, and the resin component (A1-1) has a mean molecular weight Mw of from 500 g/mol to 11,000 g/mol and a mean molecular weight Mn of from 500 g/mol to 5000 g/mol, and the polydispersity (Mw/Mn) of the resin component (A1-1) is from 1 to 5. 3. The composition of claim 1 , wherein component (A1) is present, relative to component (A2), in a weight ratio of from 99:1 to 50:50. 4. The composition of claim 2 , wherein component (A1) is present, relative to component (A2), in a weight ratio of from 99:1 to 50:50. 5. The composition of claim 1 , wherein components (A1) and (A2) are present in a total amount of from 1 to 30 parts by weight, based on 100 parts by weight of the composition. 6. The composition of claim 2 , wherein components (A1) and (A2) are present in a total amount of from 1 to 30 parts by weight, based on 100 parts by weight of the composition. 7. The composition of claim 3 , wherein components (A1) and (A2) are present in a total amount of from 1 to 30 parts by weight, based on 100 parts by weight of the composition. 8. The composition of claim 1 , wherein filler(s) (B) are present in a total amount of from 70 to 99 parts by weight, based on 100 parts by weight of the composition. 9. The composition of claim 2 , wherein filler(s) (B) are present in a total amount of from 70 to 99 parts by weight, based on 100 parts by weight of the composition. 10. A method for producing a compositions of claim 1 , comprising mixing the individual components in any desired sequence. 11. The method of claim 10 , wherein the mixing takes place at a temperature that is at least 20 K below the boiling point of the organosilicon component (A2). 12. A molded body produced by crosslinking a composition of claim 1 . 13. A molded body produced by crosslinking a composition of claim 2 . 14. The molded body of claim 12 , which is an artificial stone. 15. A method for producing an artificial stone product, comprising molding and crosslinking a composition of claim 1 .
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