Methods and compositions including a curable resin and organophilically-modified clay for subterranean oil well applications
US-10144858-B2 · Dec 4, 2018 · US
US10428260B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10428260-B2 |
| Application number | US-201415513489-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 10, 2014 |
| Priority date | Dec 10, 2014 |
| Publication date | Oct 1, 2019 |
| Grant date | Oct 1, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Various embodiments disclosed relate to a curable composition and resin for treatment of a subterranean formation. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include placing in a subterranean formation a curable composition. The curable composition can include an epoxy silane monomer, a hardener, and carrier fluid. The curable composition can include an epoxy monomer, an amine silane hardener, and carrier fluid. The method can also include curing the curable composition to form an epoxy silane resin.
Opening claim text (preview).
What is claimed is: 1. A method of treating a subterranean formation, comprising: placing a curable composition into the subterranean formation as an alternative to cement, the curable composition comprising: 40 to 80 wt. %, based on the total weight of the curable composition, of an epoxy silane monomer; 5 to 50 wt. %, based on the total weight of the curable composition, of a hardener; and 1 to 40 wt. %, based on the total weight of the curable composition, of a carrier fluid; and curing the curable composition in the subterranean formation to form an epoxy silane resin, wherein the epoxy silane resin adheres to a casing disposed in the subterranean formation, thereby cementing or plugging the subterranean formation. 2. The method of claim 1 , wherein the epoxy silane monomer has the structure: wherein: at each occurrence, R 1 and R 2 are each independently chosen from —H and substituted or unsubstituted (C 1 -C 10 )hydrocarbyl; R 3 is independently chosen from —H, substituted or unsubstituted (C 1 -C 10 )hydrocarbyl, and the structure: R 4 is chosen from —H and substituted or unsubstituted (C 1 -C 10 )hydrocarbyl; at each occurrence, J is independently selected from a bond and substituted or unsubstituted (C 1 -C 5 )hydrocarbylene; at each occurrence, L is independently chosen from substituted or unsubstituted (C 1 -C 10 )hydrocarbylene interrupted or terminated by 0, 1, 2, or 3 groups independently chosen from —O— and —S—; and c is 0 to about 10. 3. The method of claim 2 , wherein at each occurrence, R 1 , R 2 , R 3 , and R 4 are each independently chosen from —H and (C 1 -C 5 )alkyl. 4. The method of claim 2 , wherein at each occurrence, R 1 , R 2 , R 3 , and R 4 are each independently chosen from —H and methyl. 5. The method of claim 2 , wherein at each occurrence J is independently chosen from a bond and a (C 1 -C 5 )alkylene, and wherein at each occurrence L is independently chosen from —OCH 2 (CH 2 ) 3 CH 2 —, —OCH 2 (CH 2 ) 2 CH 2 —, —OCH 2 CH 2 CH 2 —, —OCH 2 CH 2 —, and —OCH 2 —. 6. The method of claim 2 , wherein at each occurrence J is propylene, wherein at each occurrence L is —OCH 2 —, and wherein c is 0 to 3. 7. The method of claim 2 , wherein R 3 at each occurrence independently has the structure: wherein: at each occurrence, R 2 is independently chosen from —H and (C 1 -C 10 )alkyl; R 4 is independently chosen from —H and (C 1 -C 10 )alkyl; at each occurrence, J is independently chosen from a bond and a (C 1 -C 5 )alkylene; at each occurrence, L is independently chosen from —OCH 2 (CH 2 ) 3 CH 2 —, —OCH 2 (CH 2 ) 2 CH 2 —, —OCH 2 CH 2 CH 2 —, —OCH 2 CH 2 —, and —OCH 2 —; and c is 0 to 5. 8. The method of claim 2 , wherein R3 at each occurrence independently has the structure: wherein: at each occurrence, R 2 is independently chosen from —H and methyl; R 4 is independently chosen from —H and methyl; at each occurrence, J is —CH 2 CH 2 H 2 —; at each occurrence, L is —OCH 2 —; and c is 0 to 3. 9. The method of claim 1 , wherein the epoxy silane monomer has a structure chosen from: wherein: f is 0 to about 6, and at each occurrence R A is independently chosen from —H and —CH 3 , wherein the ratio of —H to —CH 3 is about 1 to 3 to about 3 to 1. 10. The method of claim 1 , wherein the epoxy silane monomer comprises about 55 wt % to about 70 wt % of the curable composition, and the hardener comprises about 15 wt % to about 35 wt % of the curable composition. 11. The method of claim 1 , wherein the hardener has the structure: wherein: at each occurrence, R 5 is independently chosen from substituted or unsubstituted (C 1 -C 10 )hydrocarbylene; at each occurrence, A is independently chosen from —O—, and —NH—; L 2 is independently chosen from a substituted or unsubstituted (C 1 -C 10 )hydrocarbylene; R 6 is independently chosen from —NH 2 , —Si(OR 7 ) 3 , and —OH, wherein at each occurrence, R 7 is independently chosen from a (C 1 -C 5 )hydrocarbyl; and i is 1 to about 80. 12. The method of claim 11 , wherein at each occurrence R 5 is independently chosen from —(CH 2 ) 2 — and —CH(CH 3 )CH 2 —, and wherein at each occurrence L 2 is independently chosen from —CH 2 CH(CH 3 )— and —(CH 2 ) 3 —. 13. The method of claim 11 , wherein at each occurrence R 6 is independently chosen from —Si(OR 7 ) 3 , wherein at each occurrence R 7 is independently chosen from —CH 3 , —CH 2 CH 3 , and —(CH 2 ) 2 CH 3 . 14. The method of claim 11 , wherein at each occurrence R 6 is —Si(OCH 3 ) 3 , and wherein i is 1 to about 75. 15. The method of claim 11 , wherein the hardener has a structure chosen from: wherein n is 1 to about 80. 16. The method of claim 1 , wherein the hardener comprises: wherein: y is 1 to about 10; and x+z is 1 to about 5. 17. The method of claim 1 , wherein the curable composition further comprises an epoxy silane resin-coated proppant, and wherein the placing of the curable composition in the subterranean formation comprises fracturing at least part of the subterranean formation to form a subterranean fracture. 18. A method of treating a subterranean formation, comprising: placing a curable composition into the subterranean formation as an alternative to cement, the curable composition comprising: an epoxy silane monomer having a structure chosen from: wherein the epoxy silane monomer comprises about 40 wt % to about 80 wt % of the curable composition; a hardener having a structure chosen from: wherein n is 1 to 5, wherein the hardener comprises about 5 wt % to about 50 wt % of the curable composition; and a carrier fluid comprising water, wherein the carrier fluid comprises about 1 wt % to about 40 wt % of the curable composition; and curing the curable composition in the subterranean formation to form an epoxy silane resin, wherein the epoxy silane resin adheres to a casing disposed in the subterranean formation, thereby cementing or plugging the subterranean formation.
Organo-silicon compounds · CPC title
containing organic binders only · CPC title
Polyepoxides · CPC title
obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds · CPC title
containing additives for specific purposes · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.