Die for forming honeycomb structure and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-9616637-B2
Application number	US-201414556564-A
Country	US
Kind code	B2
Filing date	Dec 1, 2014
Priority date	Jun 4, 2012
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

A die for forming a honeycomb structure, including: a second plate-shaped portion that is formed of iron and the like and has back holes; and a first plate-shaped portion that is formed of tungsten carbide based cemented carbide and has cavities communicating with the back holes and slits communicating with the cavities, with the first plate-shaped portion having a first layer arranged in the second plate-shaped portion side and a second layer arranged on the first layer, the cavities are opened on both sides of the first layer, and the slits are opened on both sides of the second layer.

First claim

The invention claimed is:

1. A die for forming a honeycomb structure, comprising:
a second plate-shaped portion having back holes for introducing a forming raw material; and
a first plate-shaped portion that has cavities communicating with the back holes and slits communicating with the cavities and is formed of tungsten carbide based cemented carbide,
wherein the second plate-shaped portion is formed of a material containing at least one selected from a group consisting of iron, steel, aluminum alloy, copper alloy, titanium alloy, and nickel alloy,
the first plate-shaped portion has a first layer that contacts the second plate-shaped portion and a second layer arranged on the first layer,
the cavities are opened on both sides of the first layer, a bottom portion of the cavity on a side of the second layer has a flat shape, a flat shape of which corners are straightly chamfered, or an outwardly convex curved shape on a cross section perpendicular to a surface of the first plate-shaped portion, and
the slits are opened on both sides of the second layer.

2. The die for forming a honeycomb structure according to claim 1 , wherein the first layer has a thickness of 0.1 to 90 mm.

3. The die for forming a honeycomb structure according to claim 1 , wherein the second layer has a thickness of 0.5 to 10 mm.

4. The die for forming a honeycomb structure according to claim 2 , wherein the second layer has a thickness of 0.5 to 10 mm.

5. The die for forming a honeycomb structure according to claim 1 , wherein a diameter of the cavity is different from that of the back hole.

6. The die for forming a honeycomb structure according to claim 2 , wherein a diameter of the cavity is different from that of the back hole.

7. The die for forming a honeycomb structure according to claim 3 , wherein a diameter of the cavity is different from that of the back hole.

8. The die for forming a honeycomb structure according to claim 4 , wherein a diameter of the cavity is different from that of the back hole.

9. The die for forming a honeycomb structure according to claim 5 , wherein the cavity has a diameter larger than a diameter of the back hole, and the diameter of the cavity is 1.01 to 1.50 times of the diameter of the back hole.

10. The die for forming a honeycomb structure according to claim 5 , wherein the back hole has a diameter larger than a diameter of the cavity, and the diameter of the back hole is 1.01 to 1.50 times of the diameter of the cavity.

11. The die for forming a honeycomb structure according to claim 1 , wherein a physical property of the tungsten carbide based cemented carbide of the first layer is different from a physical property of the tungsten carbide based cemented carbide of the second layer.

12. The die for forming a honeycomb structure according to claim 11 , wherein the first layer is formed of tungsten carbide based cemented carbide having a Vickers hardness of 300 to 2000 HV and a Young's modulus of 200 to 600 GPa,
the second layer is formed of tungsten carbide based cemented carbide having a Vickers hardness of 500 to 3000 HV and a Young's modulus of 400 to 700 GPa, and
the Vickers hardness and the Young's modulus of the second layer are higher than the Vickers hardness and the Young's modulus of the first layer.

13. The die for forming a honeycomb structure according to claim 1 , further comprising a buffer portion which is a space that is formed along an end of the slit in a first bonded surface side of the first plate-shaped portion, communicates with the slit, and has a width larger than a width of the slit.

14. The die for forming a honeycomb structure according to claim 1 , wherein a bottom portion of the slit on a side of a first bonded surface has a flat shape, a flat shape having straightly chamfered corners, an outwardly convex curved shape, or an outwardly convex V-shape on a cross section perpendicular to the slit.

15. The die for forming a honeycomb structure according to claim 13 , wherein a bottom portion of the buffer portion on a side of the first bonded surface has a flat shape, a flat shape having straightly chamfered corners, an outwardly convex curved shape, or an outwardly convex V-shape on a cross section perpendicular to the slit.

Assignees

• Ngk Insulators Ltd

Inventors

• Kitamura Kazumasa
• Hosokawa Hirofumi
• Nagae Tomoki

Classifications

• B28B3/269 Primary

  For multi-channeled structures, e.g. honeycomb structures · CPC title

• B29C48/3001

  characterised by the material or their manufacturing process · CPC title

• B29C48/345

  Extrusion nozzles comprising two or more adjacently arranged ports, for simultaneously extruding multiple strands, e.g. for pelletising · CPC title

• B29C48/3003

  Materials, coating or lining therefor · CPC title

• B29C48/2515

  in the die zone · CPC title