Honeycomb formed body extruding die

US9486794B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9486794-B2
Application numberUS-201514885085-A
CountryUS
Kind codeB2
Filing dateOct 16, 2015
Priority dateNov 18, 2014
Publication dateNov 8, 2016
Grant dateNov 8, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A die has two surfaces, in a forming material supplying surface which is one surface, a plurality of back holes to introduce a forming material of a honeycomb formed body into the die are formed, and in a honeycomb formed body extruding surface which is the other surface, lattice-shaped slits corresponding to cell partition walls are formed, the back holes communicate with the slits in slit intersecting portions of the slits, polygonal cell blocks defined by the slits include chamfered portions in which parts of corner portions and the like are chamfered at a chamfering angle θ of 1.0 to 8.0° to the extruding direction, from the honeycomb formed body extruding surface toward a slit depth direction, and straight portions which are not chamfered, and a ratio of a length L of the straight portion to a slit depth D is from 20 to 60%.

First claim

Opening claim text (preview).

What is claimed is: 1. A honeycomb formed body extruding die to extrude a honeycomb formed body, the die having two surfaces, wherein in a forming material supplying surface which is one surface, a plurality of back holes to introduce a forming material of the honeycomb formed body into the die are formed in an extruding direction, in a honeycomb formed body extruding surface which is the other surface, lattice-shaped slits corresponding to cell partition walls of the honeycomb formed body are formed in the extruding direction, the back holes communicate with the slits in slit intersecting portions of the slits, polygonal cell blocks defined by the slits comprise: chamfered portions in which parts of corner portions are chamfered at a chamfering angle of 1.0 to 8.0° to the extruding direction, from the honeycomb formed body extruding surface toward a slit depth direction; and straight portions which are not chamfered, and a ratio of a length of the straight portion to a slit depth is from 20 to 60%. 2. The honeycomb formed body extruding die according to claim 1 , wherein widths of the slits are from 50 to 130 μm. 3. The honeycomb formed body extruding die according to claim 2 , wherein a ratio of a slit side intersection point width to a back hole side intersection point width in the slit intersecting portions is from 1.5 to 2.5. 4. The honeycomb formed body extruding die according to claim 1 , wherein a curvature radius of each of corner portions of the straight portion is from 0.03 to 0.08 μm. 5. The honeycomb formed body extruding die according to claim 1 , wherein an abrasion resistant layer is formed on the surface of each of the polygonal cell blocks. 6. The honeycomb formed body extruding die according to claim 1 , wherein the polygonal cell blocks are made of a cemented carbide material.

Assignees

Inventors

Classifications

  • Honeycomb dies · CPC title

  • For multi-channeled structures, e.g. honeycomb structures · CPC title

  • Operations & Transport · mapped topic

  • Operations & Transport · mapped topic

  • B01J35/04Primary

    Operations & Transport · mapped topic

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Frequently asked questions

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What does patent US9486794B2 cover?
A die has two surfaces, in a forming material supplying surface which is one surface, a plurality of back holes to introduce a forming material of a honeycomb formed body into the die are formed, and in a honeycomb formed body extruding surface which is the other surface, lattice-shaped slits corresponding to cell partition walls are formed, the back holes communicate with the slits in slit int…
Who is the assignee on this patent?
Ngk Insulators Ltd
What technology area does this patent fall under?
Primary CPC classification B01J35/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).