Wafer inspection method and grinding and polishing apparatus

Patent metadata

Field	Value
Publication number	US-9616544-B2
Application number	US-201514837199-A
Country	US
Kind code	B2
Filing date	Aug 27, 2015
Priority date	Aug 29, 2014
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

Disclosed herein is a wafer inspection method of inspecting a wafer after polishing. The wafer inspection method includes the steps of polishing the wafer after grinding, imaging a polished surface of the wafer to thereby create image data including the characteristics of plural saw marks left on the polished surface of the wafer from a detected image, performing Fourier transform to the image data to thereby extract a frequency distribution corresponding to the saw marks, performing inverse Fourier transform to the frequency distribution extracted above to obtain an amplitude of each saw mark, and determining imperfect polishing of the wafer in the case that the amplitude is greater than a predetermined range.

First claim

What is claimed is:

1. A wafer inspection method of imaging a polished surface of a wafer to inspect the result of polishing of said wafer, said wafer inspection method comprising:
a polishing step of polishing an upper surface of said wafer held on a chuck table and ground by means of abrasive members;
an imaging step of imaging at least a predetermined area of said polished surface of said wafer about the center of said wafer at 360 degrees to thereby obtain image data; and
a determining step of performing Fourier transform to said image data to thereby extract a frequency distribution corresponding to saw marks, next performing inverse Fourier transform to said frequency distribution extracted above to obtain an amplitude of each saw mark, and next determining imperfect polishing of said wafer in the case that said amplitude is greater than a predetermined range.

2. A wafer inspection method of imaging a polished surface of a wafer to inspect the result of polishing of said wafer, said wafer inspection method comprising:
a polishing step of polishing an upper surface of said wafer held on a chuck table and ground by means of abrasive members;
an imaging step of imaging at least a predetermined area of said polished surface of said wafer about the center of said wafer at 360 degrees to thereby obtain image data; and
a determining step of performing Fourier transform to said image data to create a frequency distribution and next determining imperfect polishing of said wafer in the case that the intensity at a part of frequencies in said frequency distribution is greater than a predetermined threshold.

3. A grinding and polishing apparatus comprising:
a chuck table having a holding surface for holding a lower surface of a wafer;
rotating means for rotating said chuck table;
grinding means having abrasive members arranged annularly and adapted to abut against an upper surface of said wafer held on said chuck table, thereby grinding said upper surface of said wafer;
polishing means for polishing said upper surface of said wafer ground by said grinding means; and
a wafer inspection mechanism inspecting a polished surface of said wafer as said upper surface of said wafer polished by said polishing means;
said wafer inspection mechanism including:
an imaging camera imaging said polished surface of said wafer from the upper side thereof to obtain image data;
a light source horizontally applying light to a predetermined area of said polished surface of said wafer to be imaged by said imaging camera; and
determining means for determining imperfect polishing of said wafer from said image data.

4. The grinding and polishing apparatus according to claim 3 , wherein when said imperfect polishing is determined by said determining means of said wafer inspection mechanism, said upper surface of said wafer is polished again by said polishing means.

Assignees

• Disco Corp

Inventors

• Ito Yusaku
• Yano Hirohide

Classifications

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• B24B37/013 Primary

  Devices or means for detecting lapping completion · CPC title

• B24B37/34

  Accessories · CPC title