Heat spreading layer with high thermal conductivity
US-2015371919-A1 · Dec 24, 2015 · US
Heat radiating component and method of producing same
US9136200B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9136200-B2 |
| Application number | US-201113228992-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 9, 2011 |
| Priority date | Sep 14, 2010 |
| Publication date | Sep 15, 2015 |
| Grant date | Sep 15, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.
First claim
Opening claim text (preview).
The invention claimed is: 1. A heat radiating component, comprising: a base including a first metal; a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal; and a second plating layer formed on the first plating layer, wherein the first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal; and the second plating layer…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10W40/25Primary
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9136200B2 cover?
- A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the sec…
- Who is the assignee on this patent?
- Suwa Yoriyuki, Kawamura Kenji, Aoki Syuzo, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W40/25. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).