Patterning device defect detection systems and methods
US-2024210336-A1 · Jun 27, 2024 · US
US9612540B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9612540-B2 |
| Application number | US-201514628544-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 23, 2015 |
| Priority date | Oct 8, 2012 |
| Publication date | Apr 4, 2017 |
| Grant date | Apr 4, 2017 |
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A method of operating a microlithographic apparatus comprises the steps of providing an illumination system comprising an array of tiltable mirrors, wherein a light irradiance distribution on the array varies by at least 50% along a first line; specifying a scan integrated target angular light distribution and a target light energy for a point moving through an illumination field along a second line that extends parallel to a scan direction and is an image of the first line; determining a group of those mirrors through which the first line extends; determining tilt angles of the mirrors of the group such that a real angular light distribution and a real light energy for the point approximate the respective target values; producing the illumination field by forming an image of the array on a mask; and imaging a portion of the mask on a surface while the mask moves along the scan direction.
Opening claim text (preview).
The invention claimed is: 1. A method of operating a microlithographic apparatus comprising an illumination system which comprises an array of reflective optical elements, each reflective optical element being tiltable by a title angle around a tilt axis, the illumination system configured to produce a light irradiance distribution on the array for reflective optical elements that are illuminated, the light irradiance distribution for the illuminated reflective optical elements varying by at least 50% along a first line, the method comprising: a) specifying: i) a scan integrated target angular light distribution for a point that moves through an illumination field of the illumination system along a second line extending parallel to a scan direction of the microlithographic apparatus; and ii) a scan integrated target light energy for the point, the second line being an image of the first line; b) determining a group of the reflective optical elements through which the first line extends; c) determining tilt angles of the reflective optical elements of the group so that a scan integrated real angular light distribution for the point and a scan integrated real light energy for the point approximate the target angular light distribution for the point and the target light energy for the point, respectively; d) setting the tilt angles determined in c); and e) producing the light irradiance distribution on the array for the illuminated reflective optical elements. 2. The method of claim 1 , further comprising: f) producing the illumination field by forming a real image of the array on a mask; and g) imaging a portion of the mask illuminated by the illumination field on a surface while the mask moves along the scan direction. 3. The method of claim 1 , wherein c) comprises: c1) specifying maximum deviations by which the scan integrated real angular light distribution and the scan integrated real light energy for the point are allowed to differ from the scan integrated target angular light distribution and the scan integrated target light energy, respectively; and c2) determining, for each reflective optical element of the group, a tilt angle so that the maximum deviations are not exceeded. 4. The method of claim 3 , comprising performing c2) via an optimization algorithm involving the solution of a mixed integer linear problem. 5. The method of claim 1 , wherein the tilt angles are not changed if the light distribution on the array changes during e). 6. The method of claim 5 , wherein c) comprises: c1) specifying maximum deviations by which the scan integrated real angular light distribution and the scan integrated real light energy for the point are allowed to differ from the scan integrated target angular light distribution and the scan integrated target light energy, respectively; c2) specifying maximum shifts of the irradiance distribution on the array that may occur during e); and c3) determining, for each reflective optical element of the group, a tilt angle so that the maximum deviations are not exceeded if the maximum shifts of the irradiance distribution on the array occur. 7. The method of claim 6 , wherein c3) comprises determining the tilt angle for each reflective optical element in the group so that changes of the irradiance distribution on the array have a minimum effect on the scan integrated real angular light distribution and the scan integrated real light energy. 8. The method of claim 7 , wherein c3) comprises using an optimization algorithm involving the solution of a mixed integer linear problem. 9. The method of claim 8 , comprising using a Variable Neighborhood Descent as a heuristic approach to solve the mixed integer linear problem. 10. The method of claim 6 , wherein c3) comprises using an optimization algorithm involving the solution of a mixed integer linear problem. 11. The method of claim 10 , comprising using a Variable Neighborhood Descent as a heuristic approach to solve the mixed integer linear problem. 12. The method of claim 1 , wherein the irradiance distribution on the array is at least substantially constant along a direction perpendicular to the first line. 13. The method of claim 1 , wherein the irradiance distribution on the array varies along the first line at least substantially according to a Gauss distribution or a superGauss distribution. 14. The method of claim 1 , wherein each reflective optical element has a continuous range of tilt angles. 15. The method of claim 1 , wherein the group comprises at least eight reflective optical elements, and at least five different irradiances occur on the at least eight reflective optical elements. 16. A method of operating an illumination system comprising an array of reflective optical elements, each reflective optical element being tiltable by a title angle around a tilt axis, the illumination system configured to produce a light irradiance distribution on the array for reflective optical elements that are illuminated, the light irradiance distribution varying by at least 50% along a first line for the illuminated reflective optical elements, the method comprising: setting tilt angles of reflective optical elements of a group of the reflective optical elements through which the first line extends so that a scan integrated real angular light distribution of a point that moves through an illumination field of the illumination system along a second line and a scan integrated real light energy for the point approximate a target angular light distribution for the point and a target light energy for the point, respectively, the second line being an image of the first line. 17. The method of claim 16 , further comprising using the illumination system to produce the illumination field. 18. An apparatus, comprising: an illumination system, comprising: a light source; an array of reflective optical elements, each reflective optical element being tiltable by a tilt angle around a tilt axis; a first optical system in a light path between the light source and the array, the first optical system configured to collect the light emitted by the light source and to produce a light irradiance distribution on the array for reflective optical elements that are illuminated which varies by at least 50% along a first line; and a second optical system along the light path between the array and a mask to be illuminated, the second optical system configured to produce an illumination field on the mask, the illumination field being a real image of the array of reflective optical elements; a control unit; and a projection objective configured to image an illuminated portion of the mask onto a surface, wherein: during use of the apparatus, the first line is imaged on a second line on the mask, the second line extending parallel to a scan direction of the apparatus; and the control unit is configured so that, during use of the apparatus, the control unit: receives: i) a scan integrated target angular light distribution for a point that moves through the illumination field along the second line; and ii) a scan integrated target light energy for the point; determines, for each reflective optical element through which the first line extends, tilt angles so that a scan integrated real angular light distribution for the point and a scan integrated real light energy for the point approximate the scan integrated target angular light distribution for the point and the scan integrated target light energy for the point, respectively; and sets the determined tilt angles.
Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection · CPC title
Scanned exposure beam, e.g. raster-, rotary- and vector scanning (mask projection exposure involving relative movement of patterned beam and workpiece during imaging G03F7/70358) · CPC title
Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets · CPC title
Measurement of illumination distribution, in pupil plane or field plane · CPC title
Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption · CPC title
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