Lead-free solder alloy for vehicle glass

Patent metadata

Field	Value
Publication number	US-9610656-B2
Application number	US-201214001619-A
Country	US
Kind code	B2
Filing date	Feb 27, 2012
Priority date	Mar 2, 2011
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

A lead-free solder alloy for a vehicle glass according to the present invention contains 26.0 to 56.0 mass % of In, 0.1 to 5.0 mass % of Ag, 0.002 to 0.05 mass % of Ti, 0.001 to 0.01 mass % of Si and the balance being Sn. The lead-free solder alloy may optionally contain 0.005 to 0.1 mass % of Cu and 0.001 to 0.01 mass % of B. This solder alloy can suitably be applied vehicle glasses and show good joint strength to glass materials and high acid resistance, salt water resistance and temperature cycle resistance.

First claim

The invention claimed is:

1. A lead-free solder alloy for a vehicle glass, comprising:
26.0 to 56.0 mass % of In;
0.1 to 5.0 mass % of Ag;
0.005 to 0.1 mass % of Cu;
0.002 to 0.05 mass % of Ti;
0.001 to 0.05 mass % of Si;
0.001 to 0.01 mass % of B; and
the balance being Sn.

Assignees

• Nishi Mizuki
• Ogawa Takayuki
• Hori Mitsuo
• Central Glass Co Ltd

Inventors

• Nishi Mizuki
• Ogawa Takayuki
• Hori Mitsuo

Classifications

• B23K35/26

  with the principal constituent melting at less than 400°C · CPC title

• C22C13/00

  Alloys based on tin · CPC title

• B23K35/262 Primary

  Sn as the principal constituent · CPC title

• C22C28/00

  Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00 · CPC title

• C22C30/04

  containing tin or lead · CPC title