Adhesive composition, laminate, and stripping method

Patent metadata

Field	Value
Publication number	US-9607875-B2
Application number	US-201514691262-A
Country	US
Kind code	B2
Filing date	Apr 20, 2015
Priority date	Apr 22, 2014
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent.

First claim

What is claimed is:

1. An adhesive composition for temporarily attaching a substrate to a support which supports the substrate, comprising:
a thermoplastic resin; and
at least one release agent selected from the group consisting of dimethyl silicone and modified silicones modified by introducing a functional group to at least one part of a terminal and a side chain of dimethyl silicone,
wherein a kinematic viscosity of the dimethyl silicone or the modified silicone at 25° C. is 20 mm 2 /s or greater.

2. The adhesive composition according to claim 1 ,
wherein the thermoplastic resin is at least one selected from the group consisting of a hydrocarbon resin and an elastomer.

3. The adhesive composition according to claim 2 , wherein the elastomer is a hydrogenated styrene elastomer.

4. The adhesive composition according to claim 1 , wherein the functional group is at least one functional group selected from the group consisting of a carbinol group, an epoxy group, an amino group, an acrylic group, a methacrylic group, a carboxyl group, a phenol group, a mercapto group, an alkyl group, an aralkyl group, a silanol group, diol, and a polyether.

5. The adhesive composition according to claim 2 , wherein the functional group is at least one functional group selected from the group consisting of a carbinol group, an epoxy group, an amino group, an acrylic group, a methacrylic group, a carboxyl group, a phenol group, a mercapto group, an alkyl group, an aralkyl group, a silanol group, diol, and a polyether.

6. The adhesive composition according to claim 3 , wherein the functional group is at least one functional group selected from the group consisting of a carbinol group, an epoxy group, an amino group, an acrylic group, a methacrylic group, a carboxyl group, a phenol group, a mercapto group, an alkyl group, an aralkyl group, a silanol group, diol, and a polyether.

7. The adhesive composition according to claim 1 ,
wherein the release agent is mixed in a range of 0.01% by weight to 10% by weight with respect to the total amount of the thermoplastic resin.

8. A laminate formed by attaching a substrate to a support which supports the substrate through an adhesive layer formed by using the adhesive composition according to claim 1 .

9. A stripping method, comprising:
removing at least a part of the outer peripheral portion of the adhesive layer in the laminate according to claim 8 ; and
stripping the support from the substrate in the laminate after removing at least a part of the outer peripheral portion of the adhesive layer.

10. A stripping method, comprising:
irradiating at least a part of the outer peripheral portion of the adhesive layer in the laminate according to claim 8 with light; and
stripping the support from the substrate in the laminate after irradiating at least a part of the outer peripheral portion of the adhesive layer.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Yoshioka Takahiro
• Tamura Koki
• Imai Hirofumi
• Kubo Atsushi
• Iwata Yasumasa
• Ishida Shingo

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title