Dual medium filter for ion and particle filtering during semiconductor processing

Patent metadata

Field	Value
Publication number	US-9607864-B2
Application number	US-201213479087-A
Country	US
Kind code	B2
Filing date	May 23, 2012
Priority date	May 23, 2012
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

The present disclosure is directed to fluid filtering systems and methods for use during semiconductor processing. One or more embodiments are directed to fluid filtering systems and methods for filtering ions and particles from a fluid as the fluid is being provided to a semiconductor wafer processing tool, such as to a semiconductor wafer cleaning tool.

First claim

The invention claimed is:

1. A system comprising:
a fluid source;
a semiconductor wafer fabrication tool;
a fluid path having a first end in fluid communication with the fluid source and a second end in fluid communication with the semiconductor wafer fabrication tool, the fluid path configured to deliver fluid from the fluid source to the semiconductor wafer fabrication tool; and
a dual medium filter located in the fluid flow path and having a housing with an inlet and an outlet, the inlet being in fluid communication with the fluid source and configured to receive fluid from the fluid source via the fluid path, the outlet being in fluid communication with the semiconductor wafer fabrication tool and configured to provide fluid to the semiconductor wafer fabrication tool via the fluid path, the dual medium filter including an ion exchange medium and a particle filter medium located inside the housing, the ion exchange medium being configured to remove ions from the fluid, and the particle filter medium being configured to remove particles from the fluid, the ion exchange medium including a main portion and a funnel shaped inlet portion that is spaced apart from an inner surface of the housing, the funnel shaped inlet portion having a surface area that is greater than a cross sectional area of the main portion of the ion filter medium.

2. The system of claim 1 , wherein the ion exchange medium is located in the first chamber in the housing that is proximate the inlet.

3. The system of claim 2 , wherein the inlet of the dual medium filter has an inverse funnel shape.

4. The system of claim 2 , wherein the particle filter medium is located in the second chamber in the housing that is proximate the outlet.

5. The system of claim 1 , wherein the second end of the fluid path is in fluid communication with a plurality of semiconductor wafer fabrication tools, and wherein the outlet of the dual medium filter is in fluid communication with the plurality of semiconductor wafer fabrication tools and configured to provide fluid to the plurality of semiconductor fabrication tools via the fluid path.

6. The system of claim 1 , wherein the housing of the dual medium filter is transparent.

7. The system of claim 1 , wherein the ion exchange medium is a cation exchange medium configured to remove positively charged ions from the fluid.

8. The system of claim 1 , wherein the ion exchange medium is an anion exchange medium configured to remove negatively charged ions from the fluid.

9. The system of claim 6 , wherein the dual medium filter is a first dual medium filter and the ion exchange medium is a cation exchange medium, the system further comprising a second dual medium filter in fluid communication with the first dual medium filter and located upstream from the semiconductor wafer fabrication tool and downstream from the first dual medium filter, the second dual medium filter comprising an anion exchange medium and a particle filter medium.

10. The system of claim 1 , further comprising:
a first membrane support net, the ion exchange medium being held in place in the first chamber by the first membrane support net; and
a second membrane support net, the particle filter medium being held in place in the second chamber by the second membrane support net.

11. The system of claim 1 wherein the housing has a top portion forming a first chamber and a bottom portion forming a second chamber, the top portion and bottom portion being removably secured to each other, wherein the ion exchange medium is located in the first chamber and the particle filter medium is located in the second chamber.

12. The system if claim 1 , wherein the ion exchange medium is a resin that is configured to remove metal ions from the fluid.

13. The system if claim 1 , wherein the outlet is funnel shaped, the particle filter being spaced from the funnel shaped outlet.

14. The system if claim 13 , wherein the dual medium filter is configured to filter the fluid at approximately the same rate at which the fluid is delivered to the semiconductor wafer fabrication tool.

15. A system comprising:
a fluid source;
a semiconductor wafer fabrication tool configured to receive fluid;
a fluid path having a first end in fluid communication with the fluid source and a second end in fluid communication to the semiconductor wafer fabrication tool, the fluid path configured to deliver fluid from the fluid source to the semiconductor wafer fabrication tool;
a first dual medium filter located in the fluid path upstream from the semiconductor wafer fabrication tool and downstream from the fluid source, the first dual medium filter including a housing with an inlet having an inverted funnel shape, the inlet being configured to receive fluid from the fluid source, the first dual medium filter including a first ion exchange medium configured to remove ions from the fluid received from the fluid source and a first particle filter medium configured to remove particles from the fluid received from the fluid source, the first dual medium filter having a top portion with a first chamber and a bottom portion with a second chamber, the top portion and bottom portion being removably secured to each other, the first chamber containing the ion exchange medium and the second chamber containing the particle filter medium, the ion filter medium having a main portion and a funnel shaped inlet portion having a surface that is shaped to correspond with the inverted funnel shape and spaced apart from an inner surface of the housing, the funnel shaped inlet portion having a surface area exposed to the inlet that is greater than a cross sectional area of the first dual medium filter; and
a second dual medium filter located in the fluid path upstream from the semiconductor wafer fabrication tool and downstream from the first dual medium filter, the dual medium filter having an inlet configured to receive fluid from the first dual medium filter, the second dual medium filter including a second ion exchange medium configured to remove ions from the fluid received from the first dual medium filter and a second particle filter medium configured to remove particles from the fluid received from the first dual medium filter.

16. The system of claim 15 , wherein the fluid source is a liquid.

17. The system of claim 15 , wherein the first ion exchange medium is a cation exchange medium, and the second ion exchange medium is an ion exchange medium.

18. The system of claim 17 , wherein the first ion exchange medium is an ion exchange medium, and the second ion exchange medium is a cation exchange medium.

Assignees

• Zhang John H
• Economikos Laertis
• Tseng Wei-Tsu
• Ticknor Adam
• St Microelectronics Inc
• IBM

Inventors

• Zhang John H
• Economikos Laertis
• Tseng Wei-Tsu
• Ticknor Adam

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• B01D2221/14

  Separation devices for workshops, car or semiconductor industry, e.g. for separating chips and other machining residues · CPC title

• B01D24/002

  with multiple filtering elements in parallel connection · CPC title