Micromechanical sensor device

Patent metadata

Field	Value
Publication number	US-9606141-B2
Application number	US-201414534860-A
Country	US
Kind code	B2
Filing date	Nov 6, 2014
Priority date	Nov 7, 2013
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A micromechanical sensor device, having a first unhoused sensor unit, and at least one second unhoused sensor unit, the sensor units being functionally connected to one another, the sensor units being essentially vertically configured one over the other so that a sensor unit having a larger footprint completely covers a sensor unit having a smaller footprint.

First claim

What is claimed is:

1. A micromechanical sensor device, comprising:
a first unhoused sensor unit; and
at least one second unhoused sensor unit, the second unhoused sensor unit having a smaller footprint than the first unhoused sensor unit;
wherein:
the sensor units are functionally connected to one another,
the sensor units are essentially vertically configured one over the other so that the first sensor unit completely covers the second sensor unit,
the sensor units are functionally connected to one another by first solder bumps,
the sensor device externally contactable by second solder bumps, and
a vertical extension of the second solder bumps is larger than an overall vertical extension of the first solder bumps and the second sensor unit.

2. The sensor device of claim 1 , wherein the first sensor unit includes a MEMS structure and an ASIC wafer.

3. The sensor device of claim 2 , wherein an electrically conductive bonded connection is provided between the first and second sensor units, wherein electrical vias are provided in the ASIC wafer, and wherein the first and second sensor units are electrically contactable to one another by the bonded connection and the vias.

4. The sensor device of claim 2 , wherein the ASIC wafer has an electrical redistribution device.

5. The sensor device of claim 1 , wherein the second sensor unit has at least one of a magnetic sensor, an ASIC chip, a radio module, and a microcontroller.

6. The sensor device of claim 1 , wherein the first sensor unit is a 9D sensor.

7. The sensor device of claim 3 , wherein the first sensor unit has a capping wafer, wherein the second sensor unit is situated on the capping wafer, wherein the capping wafer has electrical vias, and wherein the capping wafer is bonded onto the ASIC wafer by the bonded connection.

8. The sensor device of claim 7 , wherein the capping wafer is bonded by the bonded connection onto a micromechanical functional layer of the MEMS structure.

9. The sensor device of claim 7 , wherein the capping wafer includes another ASIC wafer.

10. A method for producing a micromechanical sensor device, the method comprising:
forming a first unhoused sensor unit;
forming at least one second unhoused sensor unit, the second unhoused sensor unit having a smaller footprint than the first unhoused sensor unit;
functionally connecting the sensor units; and
vertically configuring, relative to one another, the first and second sensor units, so that the first and second sensor units are essentially configured vertically one over the other so that first sensor unit completely covers the second sensor unit having a smaller footprint, wherein:
the sensor units are functionally connected to one another by first solder bumps,
the sensor device externally contactable by second solder bumps, and
a vertical extension of the second solder bumps is larger than an overall vertical extension of the first solder bumps and the second sensor unit.

11. The method of claim 10 , wherein the first sensor unit includes a MEMS substrate having a micromechanical functional layer and an ASIC wafer, and wherein the second sensor unit includes at least one of a magnetic sensor, an ASIC chip, a radio module, and a microcontroller.

Assignees

• Bosch Gmbh Robert

Inventors

• Frey Jens
• Kaelberer Arnd
• Reinmuth Jochen
• Classen Johannes

Classifications

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• G01P15/105 Primary

  by magnetically sensitive devices · CPC title

• G01P15/08

  with conversion into electric or magnetic values · CPC title

• Y10T29/49002

  Electrical device making · CPC title