Magnetic inertial sensor and method for operating the same

Patent metadata

Field	Value
Publication number	US-9618532-B2
Application number	US-201615081507-A
Country	US
Kind code	B2
Filing date	Mar 25, 2016
Priority date	Apr 2, 2012
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis.

First claim

The invention claimed is:

1. A system, comprising:
a first device that includes:
a movable mass;
a concentrator layer on the movable mass;

a second device coupled to the first device, the second device includes:
a substrate;
an application specific integrated circuit in the substrate;
a coil support layer on the substrate;
an excitation coil in the coil support layer;
a first sensing coil in the coil support layer, the concentrator layer being between the movable mass and the coil support layer; and
a second sensing coil in the coil support layer, the excitation coil being positioned between the first sensing coil and the second sensing coil.

2. The system of claim 1 wherein the concentrator layer is a magnetic-field concentrator.

3. The system of claim 2 wherein the concentrator layer is aligned horizontally along a planar bottom surface of the movable mass.

4. The system of claim 1 wherein the first device includes a support structure and a plurality of movable arms coupled between the support structure and the movable mass.

5. The system of claim 1 wherein the first device includes a support structure that forms a cavity in which the movable mass is suspended.

6. The system of claim 5 wherein the support structure is in direct contact with the coil support layer of the second device.

7. The system of claim 1 wherein the application specific integrated circuit includes a current generator configured to generate a flow of electric current and to provide the flow of electric current to the excitation coil and a current-sensing circuit configured to detect a value associated with a current induced in the first sensing coil.

8. The system of claim 1 wherein the second device includes a second, third, and fourth sensing coil.

9. The system of claim 8 wherein the excitation coil is between the first and second sensing coil and the excitation coil is between the third and fourth sensing coil.

10. The system of claim 9 wherein the first and second sensing coils are aligned with each other along a first axis and the third and fourth sensing coils are aligned with each other along a second axis that is transverse to the first axis.

11. The system of claim 10 wherein the movable mass is rectangular with a first side substantially parallel to the first axis and a second side substantially parallel to the second axis.

12. The system of claim 10 wherein the movable mass is rectangular where the first axis is diagonal with respect to a first corner and a third corner of the rectangular movable mass and the second axis is diagonal with respect to a second corner and a fourth corner of the rectangular movable mass, the first axis is substantially perpendicular to the second axis.

13. The system of claim 8 wherein the second device includes a fifth, sixth, seventh, and eighth sensing coil, the excitation coil being centrally positioned between the first, second, third, fourth, fifth, sixth, seventh, and eighth sensing coils.

14. A system, comprising:
a micro-electromechanical device that includes:
a movable mass;
a magnetic concentrator layer on the movable mass;

a substrate, the micro-electromechanical device coupled to the substrate;
a coil support layer on the substrate, the movable mass being spaced from the coil support layer by a distance;
an excitation coil in the coil support layer;
a first sensing coil in the coil support layer, the concentrator layer being between the movable mass and the coil support layer; and
a second sensing coil in the coil support layer, the excitation coil being positioned between the first sensing coil and the second sensing coil.

15. The system of claim 14 wherein the micro-electromechanical device includes a support structure that is positioned on the coil support layer.

16. The system of claim 15 wherein the micro-electromechanical device includes a plurality of springs positioned between walls of the support structure and the movable mass.

17. The system of claim 14 wherein the movable mass, in a resting position, overlaps portions of the first and second sensing coil.

18. The system of claim 14 wherein the movable mass has a surface having a surface area and the concentrator layer is on the surface and has a substantially similar surface area.

19. A method, comprising:
coupling a micro-electromechanical device to a substrate;
suspending a movable mass in the micro-electromechanical device, the movable mass being spaced from the substrate by a distance;
forming an excitation coil in a coil support layer on the substrate;
forming a first sensing coil in the coil support layer;
forming a second sensing coil in the coil support laver, the excitation coil being positioned between the first sensing coil and the second sensing coil; and
positioning a magnetic concentrator layer that is on the movable mass between the movable mass and the coil support layer.

20. The method of claim 19 , further comprising forming a third and fourth sensing coil in the coil support layer.

Assignees

• St Microelectronics Srl

Inventors

• Ricotti Giulio
• Pagani Alberto
• Fontana Fulvio Vittorio
• Mastromatteo Ubaldo

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• G01P15/0802

  Details · CPC title

• G01P15/105

  by magnetically sensitive devices · CPC title

• B81B7/008

  MEMS characterised by an electronic circuit specially adapted for controlling or driving the same (B81B7/0087 takes precedence; arrangements for starting, regulating, braking, or otherwise controlling an actuator H02N; control arrangements or circuits for visual indicators G09G3/00) · CPC title