Apparatus for inspecting defect with time/spatial division optical system

Patent metadata

Field	Value
Publication number	US-9602780-B2
Application number	US-201113997496-A
Country	US
Kind code	B2
Filing date	Nov 2, 2011
Priority date	Dec 27, 2010
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

In a defect inspecting apparatus, the strength of a fatal defect signal decreases due to miniaturization. Thus, in order to assure a high SN ratio, it is necessary to reduce noises caused by scattered light from a wafer. Roughness of a pattern edge and surface roughness which serve as a scattered-light source are spread over the entire wafer. The present invention has discovered the fact that reduction of an illuminated area is a technique effective for decreasing noises. That is to say, the present invention has discovered the fact that creation of an illuminated area having a spot shape and reduction of the dimension of a spot beam are effective. A plurality of temporally and spatially divided spot beams are radiated to the wafer serving as a sample.

First claim

The invention claimed is:

1. Apparatus for inspecting a defect with time spatial division optical system, the apparatus comprising:
an illumination optical system for radiating light to the sample;
a detection optical system for detecting light from an illuminated area illuminated by the illumination optical system, wherein the detection optical system is an imaging system;
a sensor for carrying out photoelectrical conversion on the light detected by the detection optical system; and
a processing section for detecting the defect by making use of a detection result output by the sensor,
wherein the illumination optical system further includes a temporal/spatial-division optical system for creating on the sample a plurality of illuminated areas which are temporarily and spatially divided,
wherein a distance between any two adjacent ones of the illuminated areas on the sample is such a distance that Gauss profiles of the two adjacent ones overlap, and a result of the overlap is substantially flat on the side of the sensor if the two adjacent ones are illuminated at the substantially same time, and
wherein a distance between any two areas illuminated at the substantially same time is larger than resolution of the detection optical system.

2. The apparatus according to claim 1 , wherein the illumination optical system arranges the illuminated areas along a single line on the sample.

3. The apparatus according to claim 2 , wherein the apparatus includes a scanning section for scanning the sample in a direction perpendicular to the line.

4. The apparatus according to claim 1 , wherein the temporal/spatial-division optical system includes:
a pulse-beam generating section for creating a pulse beam;
a temporal-division unit for providing a temporal difference by dividing the pulse beam;
a spatial-division unit for providing a spatial difference by dividing the pulse beam; and
an integration unit for radiating the pulse beam temporally and spatially divided by the temporal-division unit and the spatial-division unit to the sample as a plurality of illuminated spots.

5. The apparatus according to claim 4 , wherein the spatial-division unit comprises a plurality of Wallaston prisms having optical characteristics different from each other.

6. The apparatus according to claim 1 , wherein at least one of the number of the illuminated areas, the dimension of the illuminated area and the distance between the illuminated areas can be changed.

7. The apparatus according to claim 1 , wherein the detection optical system is an optical system of a dark visual field type.

8. The apparatus according to claim 7 , wherein the illumination optical system creates the illuminated areas on the sample from a direction perpendicular to the sample.

9. The apparatus according to claim 7 , wherein the illumination optical system creates the illuminated areas on the sample from a slanting direction inclined with respect to the sample.

10. The apparatus according to claim 7 , wherein the apparatus includes a plurality of the detection optical systems and a plurality of image sensors and takes an image for each of the detection optical systems and each of the image sensors.

11. The apparatus according to claim 10 , wherein the apparatus carries out processing to integrate the taken images.

12. The apparatus according to claim 1 , wherein the detection optical system is an optical system of a bright visual field type.

13. The apparatus according to claim 1 , wherein:
the apparatus inspects a sample which has wires created on the sample; and
the apparatus includes a processing section for sampling a detection result from the sensor at a frequency computed from the pitch of the wires.

14. The apparatus according to claim 1 , wherein:
the sensor is a sensor having at least one pixel;
the apparatus includes a control section for changing a start time to start an image taking operation and an end time to end the image taking operation within a period corresponding to the size of one pixel of the sensor.

15. Apparatus for inspecting a defect with spatial division optical system, the inspection apparatus comprising:
an illumination optical system for radiating light to the sample;
a detection optical system for detecting light from an illuminated area illuminated by the illumination optical system, wherein the detection optical system is an imaging system;
a sensor for carrying out photoelectrical conversion on the light detected by detection optical system; and
a processing section for detecting the defect by making use of a detection result output by the sensor,
wherein the illumination optical system further includes a spatial-division optical system for creating a plurality of illuminated spots on the sample along a plurality of lines substantially parallel to each other, the plurality of illuminated spots separated away from each other,
wherein a distance between any two adjacent ones of the illuminated areas on the sample is such a distance that Gauss profiles of the two adjacent ones overlap, and result of the overlap is substantially flat on the side of the sensor if the two adjacent ones are illuminated at the substantially same time, and
wherein a distance between two areas illuminated at the substantially same time is larger than resolution of the detection optical system.

16. The apparatus according to claim 15 , wherein the illumination optical system includes:
a mask having a plurality of apertures laid out to form an array; and
a projection optical system for projecting an image of the apertures on the sample.

17. The apparatus according to claim 15 , wherein the illumination optical system includes:
an array-formed light source having a plurality of light emitting devices laid out to form an array; and
a projection optical system for projecting an image of the light emitting devices on the sample.

18. The apparatus according to claim 15 , wherein at least one of the number of the illuminated spots on the sample, the dimension of the illuminated spot and the distance between the illuminated spots can be changed.

19. The apparatus according to claim 15 , wherein the apparatus includes a scanning section for scanning the sample in a direction perpendicular to the lines.

20. The apparatus according to claim 15 , wherein the detection optical system is an optical system of a dark visual field type.

21. The apparatus according to claim 20 , wherein the illumination optical system radiates a spot beam flux to the sample from a direction perpendicular to the sample.

22. The apparatus according to claim 20 , wherein the illumination optical system radiates a spot beam flux to the sample from a slanting direction inclined with respect to the sample.

23. The apparatus according to claim 20 , wherein the apparatus includes a plurality of the detection optical systems and a plurality of image sensors and takes an image for each of the detection optical systems and each of the image sensors.

24. The apparatus according to claim 23 , wherein the apparatus carries out processing to integrate the taken images.

25. The apparatus according to claim 15 , wherein the detection optical system is an optical system of a bright visual field type.

26. The apparatus according to claim 15 , wherein:
the apparatus inspects a sample which has wires created on the sample; and
the apparatus includes a processing section f

Assignees

• Ito Masaaki
• Nishiyama Hidetoshi
• Jingu Takahiro
• Hitachi High Tech Corp

Inventors

• Ito Masaaki
• Nishiyama Hidetoshi
• Jingu Takahiro

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/00 Primary

  Testing or measuring during manufacture or treatment of wafers, substrates or devices · CPC title

• H04N7/18 Primary

  Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast · CPC title

• G01N21/47 Primary

  Scattering, i.e. diffuse reflection (G01N21/25, G01N21/41 take precedence {G01N21/55 takes precedence}) · CPC title

• G01N21/956

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title