Apparatus of etching glass substrate

Patent metadata

Field	Value
Publication number	US-9598310-B2
Application number	US-201113244118-A
Country	US
Kind code	B2
Filing date	Sep 23, 2011
Priority date	Oct 28, 2010
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

An apparatus for etching a glass substrate includes a vessel configured to contain an etchant; a first plate in the vessel and configured to receive a horizontally placed glass substrate thereon; and a circulating unit in the vessel facing the first plate and configured to create a flow of the etchant on a side of the first plate.

First claim

What is claimed is:

1. An apparatus for etching a glass substrate, the apparatus comprising:
a vessel configured to contain an etchant;
a first plate in the vessel and configured to receive a horizontally placed glass substrate thereon;
a circulating unit in the vessel facing the first plate, the circulating unit comprising
a body configured to create a flow of the etchant on a side of the first plate, and
a driving unit attached to the body and configured to control an operation of the body;

a sensor on a sidewall of the vessel and adjacent to the first plate and configured to measure a thickness of the glass substrate and generate a signal corresponding to the measured thickness; and
a control unit configured to receive the signal corresponding to the measured thickness from the sensor and provide a driving signal to the driving unit,
wherein the driving unit is configured to be moved horizontally with respect to the first plate, from one end of the vessel to an opposite end of the vessel, and configured to be vertically moved and horizontally moved with respect to the first plate in response to the driving signal, to adjust an etching rate of the glass substrate.

2. The apparatus of claim 1 , further comprising a collecting pipe connected to a bottom side of the vessel to discharge the etchant,
wherein a material or particles etched from the glass substrate are collected to the collecting pipe by the flow of the etchant.

3. The apparatus of claim 2 , further comprising:
a valve configured to control the flow of the etchant in the collecting pipe;
a filter configured to remove the material or particles from the etchant after the etchant passes through the valve;
a supply pipe configured to supply the etchant into the vessel; and
a pump configured to transfer the etchant to the supply pipe after the etchant passes through the filter.

4. The apparatus of claim 1 , wherein the circulating unit further comprises:
a horizontally movable blade attached to the body,
wherein the driving unit is configured to adjust a distance between the first plate and the body and a horizontal velocity of the body in response to the driving signal.

5. The apparatus of claim 4 , wherein the first plate has a rectangular shape in a plan view.

6. The apparatus of claim 1 , wherein the first plate comprises discharge holes formed through the first plate.

Assignees

• Lee Ah-Ram
• Han Kwan-Young
• Samsung Display Co Ltd

Inventors

• Lee Ah-Ram
• Han Kwan-Young

Classifications

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H01L21/67057

  Electricity · mapped topic

• C03C15/00

  Surface treatment of glass, not in the form of fibres or filaments, by etching (etching or surface-brightening compositions, in general C09K13/00) · CPC title

• C03C15/02 Primary

  for making a smooth surface · CPC title

• B08B3/102

  with means for agitating the liquid (by agitating the container B08B3/042, B08B3/044, B08B3/045, B08B3/06) · CPC title