Rectangular mold-forming substrate

Patent metadata

Field	Value
Publication number	US-9505166-B2
Application number	US-201314068983-A
Country	US
Kind code	B2
Filing date	Oct 31, 2013
Priority date	Nov 1, 2012
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

A rectangular substrate is used as a mold after it is provided with a topological pattern. The substrate has A-side and B-side opposed surfaces, the A-side surface being provided with the topological pattern. The A-side surface includes a central rectangular region of 1 to 50 mm by 1 to 50 mm having a flatness of up to 350 nm. Use of the mold-forming substrate prevents the occurrence of a pattern misalignment or pattern error between the step of forming a pattern on a mold-forming substrate and the transfer step. Transfer of a fine size and complex pattern is possible.

First claim

The invention claimed is:

1. A rectangular substrate which is to be provided with a topological pattern for use as a mold, the substrate having A-side and B-side opposed surfaces, the A-side surface is to be provided with the topological pattern, wherein
the A-side surface includes a central rectangular region which is sized 1 to 50 mm by 1 to 50 mm and to be provided with the topological pattern, the central rectangular region having a flatness of up to 350 nm,
the distance t 1 ′ between the central rectangular region of the A-side surface and the B-side surface is greater than the distance t 1 between a peripheral region of the A-side surface excluding the central rectangular region and the B-side surface (t 1 ′>t 1 ),
an average plane for the central rectangular region of the A-side surface is substantially parallel to an average plane for the B-side surface excluding a central rectangular region of 50 to 100 mm by 50 to 100 mm, and
an angle between normal vectors to the two average planes is equal to or less than 5 seconds.

2. The substrate of claim 1 wherein the B-side surface includes an inner rectangular region extending inward from an inside position spaced 3 mm apart from the periphery of the B-side surface, the inner rectangular region having a flatness of up to 3 μm.

3. The substrate of claim 1 wherein the B-side surface includes an inner rectangular region extending inward from an inside position spaced 3 mm apart from the periphery of the B-side surface, but excluding a central rectangular region of 50 to 100 mm by 50 to 100 mm in the B-side surface, the inner rectangular region having a flatness of up to 3 μm.

4. The substrate of claim 1 wherein the central rectangular region of the A-side surface has a birefringence of up to 3 nm/cm.

5. A rectangular substrate which is to be provided with a topological pattern for use as a mold, the substrate having A-side and B-side opposed surfaces, the A-side surface is to be provided with the topological pattern, wherein
the A-side surface includes a central rectangular region which is sized 1 to 50 mm by 1 to 50 mm and to be provided with the topological pattern, the central rectangular region having a flatness of up to 350 nm,
the B-side surface is provided with a recess or channel,
the distance t 2 ′ between the central rectangular region of the A-side surface and a region of the B-side surface where the recess or channel is not formed is greater than the distance t 2 between a peripheral region of the A-side surface excluding the central rectangular region and the region of the B-side surface where the recess or channel is not formed (t 2 ′>t 2 ),
an average plane for the central rectangular region of the A-side surface is substantially parallel to an average plane for the B-side surface excluding the recess or channel, and
an angle between normal vectors to the two average planes is equal to or less than 5 seconds.

6. The substrate of claim 5 wherein the B-side surface includes an inner rectangular region extending inward from an inside position spaced 3 mm apart from the periphery of the B-side surface and excluding the recess or channel, the inner rectangular region having a flatness of up to 3 μm.

7. The substrate of claim 5 wherein the central rectangular region of the A-side surface has a birefringence of up to 3 nm/cm.

Assignees

• Shinetsu Chemical Co

Inventors

• Harada Daijitsu
• Okafuji Daiyu
• Yamazaki Hiroyuki
• Takeuchi Masaki

Classifications

• B29C59/026

  of layered or coated substantially flat surfaces · CPC title

• C03C15/02

  for making a smooth surface · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B29C59/16

  by wave energy or particle radiation {, e.g. infrared heating (B29C59/007 takes precedence)} · CPC title

• B29C59/022 Primary

  characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title