Packages with thermal management features for reduced thermal crosstalk and methods of forming same

Patent metadata

Field	Value
Publication number	US-9595506-B2
Application number	US-201614997826-A
Country	US
Kind code	B2
Filing date	Jan 18, 2016
Priority date	Dec 11, 2013
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.

First claim

What is claimed is:

1. A package comprising:
a first die bonded to a substrate;
a second die adjacent the first die and bonded to the substrate;
a contour lid over the first die; and
a heat spreader comprising:
a first portion over the first die, wherein the contour lid is disposed between the first portion and the first die; and
a second portion extending beneath a top surface of the contour lid and directly attach to the second die.

2. The package of claim 1 , wherein the heat spreader further comprises a thermal barrier disposed between the first portion and the second portion.

3. The package of claim 2 , wherein thermal barrier comprises a low thermal conductivity material having a thermal conductivity less than about 0.05 watts per meter kelvin, one or more air gaps, or a combination thereof.

4. The package of claim 3 , wherein the thermal barrier comprises a plurality of through-holes extending through the heat spreader, wherein high thermal conductivity material having a thermal conductivity greater than the low thermal conductivity material is disposed between each of the plurality of through-holes.

5. The package of claim 3 , wherein the thermal barrier comprises a continuous trench extending continuously from between opposing sides of the first die in a top down view.

6. The package of claim 1 , wherein the first die has a first height, and wherein the second die has a second height different than the first height.

7. The package of claim 1 further comprising a first thermal interface material (TIM) and a second TIM physically separated from the first TIM, wherein the first TIM attaches the first portion of the heat spreader to the contour lid, and wherein the second TIM attaches the second portion of the heat spreader to the second die.

8. A package comprising:
a first die bonded to a surface of a package component;
a second die adjacent the first die; and
a lid over the first die and second die, wherein the lid comprises:
a first thermal conductive portion;
a second thermal conductive portion; and
a first thermal barrier contacting a first sidewall of the first thermal conductive portion and a second sidewall of the second thermal conductive portion, wherein the first thermal barrier comprises a different material than that first thermal conductive portion and the second thermal conductive portion, and wherein the first thermal barrier is disposed directly over a spacing between the first die and the second die.

9. The package of claim 8 , further comprising a first thermal interface material (TIM) on a top surface of the first die and a second TIM on a top surface of the second die, wherein first TIM attaches the first thermal conductive portion to the first die, and wherein second TIM attaches the second thermal conductive portion to the second die.

10. The package of claim 9 , wherein the first TIM does not contact the second TIM.

11. The package of claim 8 , wherein the first thermal barrier comprises an epoxy, an unsaturated polyester, a phenolic, an adhesive, or a combination thereof.

12. The package of claim 8 , wherein the first thermal barrier comprises one or more through holes.

13. The package of claim 8 , wherein the first thermal barrier comprises a trench.

14. The package of claim 8 further comprising an air gap between the first thermal conductive portion and the second thermal conductive portion.

15. The package of claim 8 , further comprising a composite heat spreader over the lid, wherein the composite heat spreader comprises:
a third thermal conductive portion over the first thermal conductive portion;
a fourth thermal conductive portion over the second thermal conductive portion; and
a second thermal barrier between the third thermal conductive portion and the fourth thermal conductive portion, wherein the second thermal barrier comprises a different material than the third thermal conductive portion and the fourth thermal conductive portion.

16. A method comprising:
bonding a first die to a substrate;
bonding a second die to the substrate and adjacent the first die;
attaching a contour lid over the first die and the second die, wherein the contour lid comprises:
a first thermal conductive portion over the first die;
a second thermal conductive portion over the second die; and
a first thermal barrier contacting the first thermal conductive portion and the second thermal conductive portion, wherein the first thermal barrier comprises a different material than the first thermal conductive portion and the second thermal conductive portion.

17. The method of claim 16 , wherein the first thermal barrier comprises a plurality of through-holes extending through the contour lid, wherein a low thermal conductivity material of the first thermal barrier is disposed within the plurality of through-holes.

18. The method of claim 16 , wherein attaching the contour lid comprises:
attaching the first thermal conductive portion to the first die using a first thermal interface material (TIM); and
attaching the second thermal conductive portion to the second die using a second TIM physically separated from the first TIM.

19. The method of claim 16 , wherein the first thermal barrier comprises an epoxy, an unsaturated polyester, a phenolic, an adhesive, or a combination thereof.

20. The method of claim 16 further comprising attaching a composite heat spreader over the contour lid, wherein the composite heat spreader comprises:
a third thermal conductive portion over the first thermal conductive portion;
a fourth thermal conductive portion over the second thermal conductive portion; and
a second thermal barrier between the third thermal conductive portion and the fourth thermal conductive portion, wherein the second thermal barrier comprises a different material than the third thermal conductive portion and the fourth thermal conductive portion.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Kim Hong
• Hung Wensen
• Huang Szu-Po
• Jeng Shin-Puu

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/291

  characterised by containers, encapsulations, or other housings for the stacked chips · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title