Packages with thermal management features for reduced thermal crosstalk and methods of forming same

Patent metadata

Field	Value
Publication number	US-9269694-B2
Application number	US-201314103523-A
Country	US
Kind code	B2
Filing date	Dec 11, 2013
Priority date	Dec 11, 2013
Publication date	Feb 23, 2016
Grant date	Feb 23, 2016

Abstract

An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.

First claim

What is claimed is:

1. A package comprising:
a first die stack on a surface of a package component;
a second die stack on the surface of the package component;
a heat-dissipating contour lid covering the first die stack, wherein the heat-dissipating contour lid comprises an opening over the second die stack; and
a composite heat spreader comprising:
a first thermal conductive portion over the heat-dissipating contour lid and the first die stack; and
a second thermal conductive portion over the second die stack and extending into the opening, wherein the second thermal conductive portion extends beneath a top surface of the heat-dissipating contour lid.

2. The package of claim 1 , further comprising, a first thermal interface material (TIM) disposed on a top surface of the first die stack, wherein the heat-dissipating contour lid is in physical contact with the first TIM.

3. The package of claim 1 , further comprising:
a second thermal interface material (TIM) disposed on a top surface of the second die stack, wherein the second thermal conductive portion contacts the second TIM, and wherein the composite heat spreader further comprises a thermal barrier portion disposed between the first thermal conductive portion and the second thermal conductive portion.

4. The package of claim 3 , further comprising a third TIM disposed on a top surface of the heat-dissipating contour lid, wherein the first thermal conductive portion is in physical contact with the third TIM.

5. The package of claim 3 , wherein thermal barrier portion comprises a low thermal conductivity material having a thermal conductivity less than about 0.05 watts per meter kelvin, one or more air gaps, or a combination thereof.

6. The package of claim 1 , wherein the composite heat spreader further comprises a cooling element.

7. The package of claim 1 , further comprising a heat-dissipating contour ring surrounding the first die stack and the second die stack, wherein the heat-dissipating contour lid is over and attached to the heat-dissipating contour ring.

8. The package of claim 1 , wherein the heat-dissipating contour lid comprises aluminum, copper, nickel, cobalt, or a combination thereof.

9. The package of claim 1 , wherein the first die stack has a first height, and wherein the second die stack has a second height different than the first height.

10. A package comprising:
a first die stack on a surface of a package component;
a second die stack on the surface of the package component; and
a contour lid over the first die stack and second die stack, wherein the contour lid comprises:
a first thermal conductive portion over the first die stack;
a second thermal conductive portion over the second die stack; and
a first thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion, wherein the first thermal barrier portion comprises a low thermal conductivity material, and wherein the low thermal conductivity material contacts a sidewall of the first thermal conductive portion and a sidewall of the second thermal conductive portion.

11. The package of claim 10 , further comprising a first thermal interface material (TIM) on a top surface of the first die stack and a second TIM on a top surface of the second die stack, wherein the first thermal conductive portion is in physical contact with the first TIM, and wherein the second thermal conductive portion is in physical contact with the second TIM.

12. The package of claim 11 , wherein the first TIM is physically disconnected from the second TIM.

13. The package of claim 10 , wherein the first thermal barrier portion comprises an epoxy, an unsaturated polyester, a phenolic, an adhesive, or a combination thereof.

14. The package of claim 10 , wherein the first thermal barrier portion further comprises one or more through holes.

15. The package of claim 10 , wherein first thermal barrier portion further comprises a trench.

16. The package of claim 10 , further comprising a composite heat spreader over the contour lid, wherein the composite heat spreader comprises:
a third thermal conductive portion over the first thermal conductive portion;
a fourth thermal conductive portion over the second thermal conductive portion; and
a second thermal barrier portion between the third thermal conductive portion and the fourth thermal conductive portion, wherein the second thermal barrier portion comprises a low thermal conductivity material.

17. A method comprising:
electrically connecting a first die stack to a substrate;
electrically connecting a second die stack to the substrate;
dispensing a first thermal interface material (TIM) on a top surface of the first die stack;
forming a contour lid over the first die stack, wherein the contour lid comprises:
a first thermal conductive portion physically contacting the first TIM; and
an opening adjacent to the first thermal conductive portion; and

forming a composite heat spreader comprising:
a second thermal conductive portion over the contour lid and the first die stack;
a third thermal conductive portion over the second die stack, wherein the third thermal conductive portion extend beneath a top surface of the composite heat spreader into the opening; and
a thermal barrier between the second and third thermal conductive portions.

18. The method of claim 17 , wherein the contour lid further comprises a fourth thermal conductive portion physically contacting a second TIM on a top surface of a third die stack, wherein the opening is disposed between the first and fourth thermal conductive portions.

19. The method of claim 17 , wherein the thermal barrier contacts a sidewall of the second thermal conductive portion and a sidewall of the third thermal conductive portion.

20. The method of claim 17 , wherein the third thermal conductive portion extends beneath a bottom surface of the second thermal conductive portion.

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Chen Kim Hong
• Hung Wensen
• Huang Szu-Po
• Jeng Shin-Puu

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/291

  characterised by containers, encapsulations, or other housings for the stacked chips · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title