In situ method for forming thermally conductive thermal radical cure silicone composition

Patent metadata

Field	Value
Publication number	US-9593275-B2
Application number	US-201414766789-A
Country	US
Kind code	B2
Filing date	Feb 10, 2014
Priority date	Feb 11, 2013
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.

First claim

The invention claimed is:

1. A method for forming a thermally conductive thermal radical cure silicone composition, the method comprising:
(a) forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of:
a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups,
a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule,
a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more thermal radical curable groups,
in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst; and

(b) blending the thermally conductive clustered functional polymer with a radical initiator to form the thermally conductive thermal radical cure silicone composition, wherein forming the thermally conductive clustered functional polymer of (a) comprises:
(c) forming a first mixture comprising a thermally conductive filler, a filler treating agent, and a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups;
(d) heating the first mixture to a temperature from 50° C. to 300° C. to treat the thermally conductive filler with the filler treating agent in the presence of the polyorganosiloxane;
(e) cooling the first mixture to a temperature below 30° C.;
(f) introducing the following components to the first mixture to form a second mixture:
a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule
a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more thermal radical curable groups,
an isomer reducing agent, and
a hydrosilylation catalyst;

(g) shearing the second mixture; and
(h) heating the second mixture to a temperature ranging from 50° C. to 100° C. for a sufficient time such that substantially all of the Si—H groups of the second mixture have reacted.

2. The method according to claim 1 further comprising:
(i) cooling the second mixture to below 50° C.;
(j) mixing a silicone reactive diluent and an additional amount of the thermally conductive filler and an additional amount of filler treating agent with the thermally conductive clustered functional polymer after step (i) and prior to step (b) to form a third mixture;
(k) heating the third mixture to a temperature from 50° C. to 110° C. to in situ treat the additional amount of thermally conductive filler with the additional amount of filler treating agent in the presence of the silicone reactive diluent.

3. The method according to claim 2 , wherein the silicone reactive diluent comprises the reaction product of a reaction of:
a) a polyorganohydrogensiloxane having an average of 10 to 200 silicon atoms per molecule, and
b) a second reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups,
in the presence of c) a second isomer reducing agent and d) a second hydrosilylation catalyst and e) inhibitor for the second hydrosilylation catalyst.

4. The method according to claim 2 , wherein the silicone reactive diluent comprising the reaction product of a reaction of:
a) a siloxane compound according to the formula:

wherein:
R is a monovalent hydrocarbon having 1 to 6 carbon atoms,
R′ is a monovalent hydrocarbon having 3 to 12 carbon atoms,
R″ is H or CH 3′ and
the subscript m and n each independently have a value from 1 to 10, and

b) a second polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups,
in the presence of c) a second hydrosilylation catalyst and d) an inhibitor for the second hydrosilylation catalyst.

5. The method according to claim 1 further comprising:
(i) mixing a silicone reactive diluent with the thermally conductive clustered functional polymer after step (h) and prior to step (b)
(j) cooling the second mixture to below 50° C.;
(k) mixing an additional amount of the thermally conductive filler and an additional amount of filler treating agent with the thermally conductive clustered functional polymer after step (j) and prior to step (b) to form a third mixture;
(l) heating the third mixture to a temperature from 50° C. to 110° C. to in situ treat the additional amount of thermally conductive filler with the additional amount of filler treating agent in the presence of the silicone reactive diluent.

6. The method according to claim 5 , wherein the silicone reactive diluent comprises the reaction product of a reaction of:
a) a polyorganohydrogensiloxane having an average of 10 to 200 silicon atoms per molecule, and
b) a second reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups,

in the presence of c) a second isomer reducing agent and d) a second hydrosilylation catalyst and e) inhibitor for the second hydrosilylation catalyst.

7. The method according to claim 5 , wherein the silicone reactive diluent comprising the reaction product of a reaction of:
a) a siloxane compound according to the formula:

wherein:
R is a monovalent hydrocarbon having 1 to 6 carbon atoms,
R′ is a monovalent hydrocarbon having 3 to 12 carbon atoms,
R″ is H or CH 3′ and
the subscript m and n each independently have a value from 1 to 10, and

b) a second polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups,

in the presence of c) a second hydrosilylation catalyst and d) an inhibitor for the second hydrosilylation catalyst.

8. The method according to claim 1 further comprising
(m) blending at least one additional component with the thermally conductive clustered functional polymer prior to step (b), the at least one component selected from the group consisting of (V) a moisture cure initiator, (VI) a crosslinker, (VII) a moisture cure polymer, (VIII) a solvent, (IX) an adhesion promoter, (X) a colorant, (XI) a reactive diluent, (XII) a corrosion inhibitor, (XIII) a polymerization inhibitor, (XIV) an acid acceptor, and any combination thereof.

9. The method as set forth in claim 8 , wherein the (VI) crosslinker and the moisture cure polymer (VII) are both present in thermally conductive thermal radical cure silicone composition and wherein the amount of the crosslinker (VI) comprises from 0.001 to 50 weight percent of the total weight of moisture cure polymer (VII) and wherein the amount of the moisture cure polymer (VII) comprises from 0.1 to 5 weight percent of the total weight of thermally conductive thermal radical cure silicone composition.

10. The method according to claim 1 , wherein the thermally conductive filler comprises from 30 to 80 volume percent of the total volume of the thermally conductive thermal radical cure silicone composition.

11. The method as set forth in claim 10 , wherein the (VI) crosslinker and the moisture cure polymer (VII) are both present in thermally conductive thermal radical cure silicone composition and wherein the amount of the crosslinker (VI) comprises from 0.001 to 50 weight percent of the total weight of moisture cure polymer (VII) and wherein the amount of the moisture cure polymer (VII) comprises from 0.1 to 5 weight percent of the total weight of thermally conductive thermal radical cure silicone composition

Assignees

• Dow Corning

Inventors

• Tang Yin
• Tonge James
• Zarisfi Afrooz

Classifications

• C08K2003/222

  Magnesia, i.e. magnesium oxide · CPC title

• B05D3/007

  After-treatment · CPC title

• C09K5/08 Primary

  Materials not undergoing a change of physical state when used (C09K5/16, C09K5/20 take precedence) · CPC title

• C08K3/22

  of metals · CPC title

• C08L83/06

  containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence) · CPC title