Multi-layer ceramic vacuum to atmosphere electric feed through

Patent metadata

Field	Value
Publication number	US-9591770-B2
Application number	US-201414256828-A
Country	US
Kind code	B2
Filing date	Apr 18, 2014
Priority date	Apr 26, 2013
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

Embodiments of this invention use multi-layer ceramic substrate with one or more hermetically sealed and filled metal vias with smaller pitch and size in combination with flexible printed circuit cables and interposers to provide a custom electric feed through for vacuum to atmosphere chambers. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

First claim

What is claimed is:

1. An apparatus, comprising:
a feedthrough, wherein the feedthrough includes a ceramic structure having a first surface and a second surface at opposing ends of the ceramic structure, wherein the feedthrough includes conductors embedded in the ceramic structure and extending from the first surface to the second surface of the ceramic structure to form corresponding arrays of conductive contacts at the first surface and the second surface, and wherein the conductors are flush with the first surface of the ceramic structure; and
a cable, detachable from the feedthrough, electrically connected to the contacts at the first surface of the ceramic structure, wherein the cable has a contact array pattern that matches the array of conductive contacts on the first surface of the ceramic structure.

2. The apparatus of claim 1 , wherein the first surface of the feedthrough is provided in a low pressure environment and the second surface is provided in an atmosphere environment.

3. The apparatus of claim 1 , wherein the embedded conductors are formed from tungsten, silver, gold, manganese, molybdenum or combinations of two or more of these metals.

4. The apparatus of claim 1 , wherein the cable has a conductive material coated on a bottom layer.

5. The apparatus of claim 4 , wherein the conductive material has a thickness ranging from 0.5 mil to 1 mil.

6. The apparatus of claim 4 , wherein an electrically insulating coverlay is formed on top of the conductive material with a pattern of holes matching the array of conductive contacts on the first surface of the ceramic structure.

7. The apparatus of claim 6 , wherein the coverlay has a thickness of about 1 mil.

8. The apparatus of claim 1 , wherein an interposer is provided between the first surface of the feedthrough and the cable.

9. The apparatus of claim 8 , wherein the interposer includes springs for providing electrical connection between the feedthrough and the cable.

10. The apparatus of claim 1 , wherein the cable is aligned to pins on a clamp which clamps the cable to the feedthrough.

11. The apparatus of claim 1 , wherein each of the conductive contacts is about 0.65-0.75 mm diameter, and wherein at least one of the arrays of conductive contacts at the first and second surface has a pitch ranging from 1 mm to 4 mm.

12. The apparatus of claim 1 , wherein the conductors are flush with the second surface of the ceramic structure.

13. The apparatus of claim 1 , further comprising a second cable electrically connected to the second surface, wherein the second cable has a contact array pattern that matches the array of conductive contacts on the second surface of the ceramic structure.

14. The apparatus of claim 1 , wherein a pattern of the array of conductive contacts at the first surface is different from a pattern of the array of conductive contacts at the second surface.

15. A method comprising:
forming a feedthrough, wherein the forming the feedthrough includes:
forming a ceramic structure having a first surface and a second surface at opposing ends of the ceramic structure;
forming conductors embedded in the ceramic structure and extending from the first surface to the second surface of the ceramic structure to form corresponding arrays of conductive contacts at the first surface and the second surface, wherein the conductors are flush with the first surface of the ceramic structure; and
electrically connecting a cable to the contacts at the first surface of the ceramic structure, wherein the cable is detachable from the feedthrough and has a contact array pattern that matches the array of conductive contacts on the first surface of the ceramic structure.

16. The method of claim 15 , wherein the forming the ceramic structure and the forming the conductors includes:
forming one or more via holes in one or more green ceramic sheets;
filling each of the via holes with a conductive paste;
stacking each of the green ceramic sheets onto one another; and
co-firing the stack of ceramic sheets.

17. The method of claim 16 , wherein the one or more green ceramic sheets are a plurality of green ceramic sheets, wherein the forming the via holes includes changing a pattern of via holes in a first sheet of the plurality of sheets relative to a pattern of via holes in a second sheet of the plurality of sheets.

18. The method of claim 16 , wherein the one or more green ceramic sheets are a plurality of green ceramic sheets, wherein the forming the via holes includes transversely shifting at least one of the via holes in a first sheet of the plurality of sheets relative to a corresponding via hole in a second sheet that is adjacent to the first sheet, and wherein the forming the conductors further includes applying the conductive paste to a surface of the second sheet to form a conductive trace connecting the transversely shifted via hole in the first sheet to the corresponding via hole in the second sheet.

19. The method of claim 16 , wherein the one or more green ceramic sheets are a plurality of green ceramic sheets, wherein the forming the via holes includes combining at least two of the via holes in a first sheet of the plurality of sheets into one corresponding via hole in a second sheet that is adjacent to the first sheet, and wherein the forming the conductors further includes applying the conductive paste to a surface of the first or second sheet to form a conductive trace connecting the at least two via holes in the first sheet to the corresponding via hole in the second sheet.

20. The method of claim 15 , further comprising:
mounting the feedthrough to an opening in a plate of a chamber.

21. The method of claim 15 , wherein the mounting the feedthrough includes clamping the first surface of the ceramic structure to the plate and against a sealing member to make a seal to the plate.

Assignees

• Kla Tencor Corp

Inventors

• Haynes Robert
• Nasser-Ghodsi Mehran

Classifications

• H05K3/4629

  laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets · CPC title

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• H05K3/4061

  for via connections in inorganic insulating substrates · CPC title

• Y10T29/49165

  by forming conductive walled aperture in base · CPC title

• H05K2201/10265

  Metallic coils or springs, e.g. as part of a connection element · CPC title