Package component
US-2024215150-A1 · Jun 27, 2024 · US
Transmission line via structure
US9123738B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9123738-B1 |
| Application number | US-201414280223-A |
| Country | US |
| Kind code | B1 |
| Filing date | May 16, 2014 |
| Priority date | May 16, 2014 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
In a transmission line via structure, a plurality of sub-structures are stacked in a via through the substrate along a longitudinal axis thereof. Each of the sub-structures includes a center conductor portion, an outer conductor portion, and at least one dielectric support member. The center conductor portion extends along the longitudinal axis. The outer conductor portion is disposed around the center conductor portion. The dielectric support member(s) separate the outer conductor portion and the center conductor portion and provide a non-solid volume between the outer conductor portion and the center conductor portion. Conductive paste is disposed between the center and outer conductor portions of successive ones of the plurality of sub-structures to form an outer conductor and a center conductor.
First claim
Opening claim text (preview).
What is claimed is: 1. A transmission line via structure in a substrate, comprising: a plurality of sub-structures stacked in a via through the substrate along a longitudinal axis thereof, each of the sub-structures including: a center conductor portion extending along the longitudinal axis; an outer conductor portion disposed around the center conductor portion; and at least one dielectric support member supporting the center conductor portion, separating the outer conductor…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K1/0251Primary
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9123738B1 cover?
- In a transmission line via structure, a plurality of sub-structures are stacked in a via through the substrate along a longitudinal axis thereof. Each of the sub-structures includes a center conductor portion, an outer conductor portion, and at least one dielectric support member. The center conductor portion extends along the longitudinal axis. The outer conductor portion is disposed around th…
- Who is the assignee on this patent?
- Xilinx Inc
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0251. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).