Various stress free sensor packages using wafer level supporting die and air gap technique

Patent metadata

Field	Value
Publication number	US-9574959-B2
Application number	US-201414517387-A
Country	US
Kind code	B2
Filing date	Oct 17, 2014
Priority date	Sep 2, 2014
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.

First claim

What is claimed is:

1. A sensor package comprising:
a supporting die comprising a recess area, a support anchor protruding above the recess area, and a first pair of laterally opposite edges including a first supporting die edge adjacent the support anchor and a second supporting die edge; and
a sensor die bonded to the support anchor in a single-sided support cantilever configuration such that a hanging area of the sensor die extends laterally from a contact area of the sensor die directly over the support anchor and an air gap exists between the hanging area of the sensor die and the recess area, and the sensor die comprises a sensor positioned directly above the air gap and a second pair of laterally opposite edges including a first sensor die edge adjacent the contact area of the sensor die and a second sensor die edge along the hanging area of the sensor die;
wherein the single-sided support cantilever configuration is to divert stress away from the sensor, the first supporting die edge is coplanar with the first sensor die edge, and the second supporting die edge is coplanar with the second sensor die edge.

2. The sensor package of claim 1 , further comprising a stopper structure protruding above the recess area.

3. The sensor package of claim 2 , wherein the stopper structure and support anchor are integrally formed.

4. The sensor package of claim 1 ,
further comprising a second supporting die characterized by a second recess area and a second support anchor protruding above the second recess area;
wherein the supporting die is above and bonded to the second supporting die in a single-sided support cantilever configuration.

5. The sensor package of claim 1 , wherein the sensor die comprises a pressure sensor positioned directly above the air gap.

6. The sensor package of claim 5 , further comprising an integrated circuit (IC) die, and the supporting die is bonded to the IC die.

7. The sensor package of claim 6 , further comprising a surface mount substrate selected from the group consisting of a land grid array (LGA), quad flat no-leads (QFN), and ceramic substrate, and the IC die is bonded to the surface mount substrate.

8. The sensor package of claim 7 , further comprising a lid bonded to the surface mount substrate, wherein the lid surrounds the IC die, the supporting die, and the sensor die, and the lid includes a pressure inlet.

9. The sensor package of claim 7 , further comprising a wire bond electrically connecting the sensor die to the surface mount substrate.

10. The sensor package of claim 7 , further comprising a first wire bond electrically connecting the sensor die to the IC die, and a second wire bond electrically connecting the IC die to the surface mount substrate.

11. The sensor package of claim 1 , wherein the sensor die comprises a motion sensor positioned directly above the air gap; and further comprising an integrated circuit (IC) die bonded to the sensor die.

12. The sensor package of claim 11 , further comprising a wire bond electrically connecting the IC die to the sensor die.

13. The sensor package of claim 11 , further comprising a surface mount substrate selected from the group consisting of an LGA, QFN, and ceramic substrate, and the supporting die is bonded to the surface mount substrate.

14. The sensor package of claim 13 , further comprising a wire bond electrically connecting the IC die to the surface mount substrate.

15. The sensor package of claim 14 , further comprising a lid over the motion sensor die, wherein the lid is bonded to the surface mount substrate, and the lid surrounds the supporting die, the sensor die, and the IC die.

16. The sensor package of claim 1 , further comprising a through via extending through a base substrate of the supporting die.

17. The sensor package of claim 16 , wherein the supporting die is selected from the group consisting of an interposer and integrated circuit (IC) die.

18. The sensor package of claim 17 , wherein the supporting die is an IC die, and the sensor die comprises a pressure sensor positioned directly above the air gap.

19. The sensor package of claim 18 , wherein the pressure sensor comprise a diaphragm immediately adjacent the air gap.

20. The sensor package of claim 17 , wherein the supporting die is an interposer die, and the sensor die comprises a motion sensor positioned directly above the air gap.

21. The sensor package of claim 20 , further comprising an integrated circuit (IC) die bonded to the support anchor such that the air gap exists between the IC die and the recess area, and the sensor die is bonded to the IC die.

22. The sensor package of claim 21 , further comprising a second through via extending through the IC die.

Assignees

• Apple Inc

Inventors

• Han Caleb C
• Jiang Tongbi
• Zhai Jun

Classifications

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/5366

  the bond wires having kinks · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title