Mems module
US-2024059554-A1 · Feb 22, 2024 · US
MEMS pressure transducer assembly
US9090455B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9090455-B2 |
| Application number | US-201414450870-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 4, 2014 |
| Priority date | Feb 21, 2012 |
| Publication date | Jul 28, 2015 |
| Grant date | Jul 28, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An assembly ( 20 ) includes a MEMS die ( 22 ) having a pressure transducer device ( 40 ) formed on a substrate ( 44 ) and a cap layer ( 38 ). A packaging process ( 74 ) entails forming the device ( 40 ) on the substrate, creating an aperture ( 70 ) through a back side ( 58 ) of the substrate underlying a diaphragm ( 46 ) of the device ( 40 ), and coupling a cap layer ( 38 ) to the front side of the substrate overlying the device. A trench ( 54 ) is produced extending through both the cap layer and the substrate, and the trench surrounds a cantilevered platform ( 48 ) at which the diaphragm resides. The MEMS die is suspended above a substrate ( 26 ) so that a clearance space ( 60 ) is formed between the cantilevered platform and the substrate. The diaphragm is exposed to an external environment ( 68 ) via the aperture, the clearance space, and an external port.
First claim
Opening claim text (preview).
What is claimed is: 1. An assembly comprising: a device structure having a cantilevered platform formed therein, wherein a trench extends through said device structure surrounding said cantilevered platform; a microelectromechanical systems (MEMS) device formed at a front side of said device structure, said MEMS device having an active region residing on said cantilevered platform, and an aperture extends through said device structure underlying said active region of said MEMS d…
Assignees
Inventors
Classifications
Electricity · mapped topic
- B81B7/0048Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9090455B2 cover?
- An assembly ( 20 ) includes a MEMS die ( 22 ) having a pressure transducer device ( 40 ) formed on a substrate ( 44 ) and a cap layer ( 38 ). A packaging process ( 74 ) entails forming the device ( 40 ) on the substrate, creating an aperture ( 70 ) through a back side ( 58 ) of the substrate underlying a diaphragm ( 46 ) of the device ( 40 ), and coupling a cap layer ( 38 ) to the front side of…
- Who is the assignee on this patent?
- Freescale Semiconductor Inc, Freescale Semiconductor Inc
- What technology area does this patent fall under?
- Primary CPC classification B81B7/0048. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).