Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer
US-9899322-B2 · Feb 20, 2018 · US
Chen yi wei is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen yi wei |
| Total patents | 3 |
| First publication | Feb 15, 2018 |
| Latest publication | Feb 20, 2018 |
Publications ranked by popularity score, then publication date.
US-9899322-B2 · Feb 20, 2018 · US
US-9899523-B2 · Feb 20, 2018 · US
US-2018048127-A1 · Feb 15, 2018 · US
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| United Microelectronics Corp | 2 |
| Lite On Electronics Guangzhou | 1 |
| Lite On Tech Corp | 1 |
Most common classification codes across this inventor's patents.