Power system-on-chip architecture

Patent metadata

Field	Value
Publication number	US-9560722-B2
Application number	US-201414779853-A
Country	US
Kind code	B2
Filing date	Mar 25, 2014
Priority date	Mar 25, 2013
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A lighting device is provided. The lighting device includes a substrate, integrated circuits ( 22′, 24 ), embedded passive components ( 26, 27 ), and a lighting component ( 22 ), the device being arranged in an architecture having three layers: an integrated circuits layer ( 11 ) including the integrated circuits ( 22′, 24 ), wherein the integrated circuits layer ( 11 ) is integrated on a first side of the substrate; an embedded passive components layer ( 12 ) including the embedded passive components ( 26, 27 ), wherein the embedded passive components ( 26, 27 ) are embedded in grooves formed in the substrate and wherein the embedded passive components are connected to the integrated circuits ( 22′, 24 ) through vias ( 28 ) in the substrate; and a bonded layer ( 13 ), including the lighting component ( 22 ), the lighting component ( 22 ) being connected to the integrated circuit layer ( 11 ) through flip-chip bonding or monolithic integration.

First claim

The invention claimed is:

1. A lighting device, comprising a substrate, integrated circuits, embedded passive components, and a lighting component, the device being arranged in an architecture comprising:
an integrated circuits layer comprising the integrated circuits, wherein the integrated circuits layer is integrated on a first side of the substrate;
an embedded passive components layer comprising the embedded passive components, wherein the embedded passive components are embedded in grooves formed in the substrate and wherein the embedded passive components are connected to the integrated circuits through vias in the substrate; and
a bonded layer, comprising the lighting component, the lighting component being connected to the integrated circuit layer through flip-chip bonding or monolithic integration.

2. The lighting device of claim 1 , wherein the integrated circuits of the integrated circuits layer comprise signal processing and control circuits.

3. The lighting device of claim 1 , wherein the integrated circuits of the integrated circuits layer comprise power management control circuits.

4. The lighting device of claim 1 , wherein the embedded passive components comprise at least one of the group consisting of: inductors, transformers, and capacitors.

5. The lighting device of claim 1 , wherein the integrated circuits of the integrated circuits layer are connected to the embedded passive components of the embedded passive components layer through vias disposed in the substrate.

6. The lighting device of claim 1 , wherein the bonded layer further comprises a semiconductor switch, wherein the semiconductor switch is connected to the integrated circuit layer through flip-chip bonding or monolithic integration.

7. The lighting device of claim 6 , wherein the semiconductor switch is a silicon-based power transistor or a compound power transistor.

8. The lighting device of claim 1 , wherein the lighting component is a GaN-based LED array.

9. The lighting device of claim 1 , wherein the device further comprises a thermal routing structure disposed in the substrate.

10. The lighting device of claim 1 , wherein the lighting component is connected to the integrated circuit layer through flip-chip bonding, and the device further comprises:
an under-fill between the lighting component of the bonded layer and the integrated circuits layer.

11. The lighting device of claim 1 , wherein the lighting component comprises an array of micro-lenses.

12. The lighting device of claim 1 , wherein the lighting device further comprises a pollutant sensor, and the lighting device is part of an intelligent traffic light system.

13. A method for fabricating a lighting device, the method comprising:
forming integrated circuits on a first side of a substrate;
etching vias in the substrate;
etching grooves on a second side of the substrate;
forming passive components in the grooves, wherein the passive components in the grooves are connected to the integrated circuits through the vias; and
forming a lighting component connected to the integrated circuits on the first side of the substrate, the lighting component being connected to the integrated circuits on the first side of the substrate through flip-chip bonding or monolithic integration.

14. The method of claim 13 , wherein the lighting component is connected to the integrated circuits through monolithic integration using an epitaxial process.

15. The method of claim 13 , further comprising:
forming a semiconductor switch connected to the integrated circuits on the first side of the substrate, wherein the semiconductor switch is connected to the integrated circuits on the first side of the substrate through flip-chip bonding or monolithic integration.

16. The method of claim 15 , wherein the semiconductor switch is connected to the integrated circuits through monolithic integration using an epitaxial process.

17. The method of claim 13 , further comprising:
forming an under-fill between the lighting component and the integrated circuits.

18. The method of claim 13 , wherein the lighting component is a GaN-based LED array.

19. The method of claim 13 , further comprising:
forming a thermal routing structure disposed in the substrate.

20. The method of claim 13 , wherein the lighting component comprises an array of micro-lenses.

Assignees

• Univ Hong Kong Science & Tech

Inventors

• Yue Chik Patrick
• Sin Johnny Kin On
• Lau Kei May

Classifications

• F21V9/00

  Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters (coloured shades F21V1/00; elements characterised by cooling arrangements F21V29/502) · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/635

  Through-vias · CPC title