Apparatus and method for preventing stiction of MEMS devices encapsulated by active circuitry

Patent metadata

Field	Value
Publication number	US-9556017-B2
Application number	US-201313926257-A
Country	US
Kind code	B2
Filing date	Jun 25, 2013
Priority date	Jun 25, 2013
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

One or more stopper features (e.g., bump structures) are formed in a standard ASIC wafer top passivation layer for preventing MEMS device stiction vertically in integrated devices having a MEMS device capped directly by an ASIC wafer. A TiN coating may be used on the stopper feature(s) for anti-stiction. An electrical potential may be applied to the TiN anti-stiction coating of one or more stopper features.

First claim

What is claimed is:

1. A method for forming stopper features on an ASIC wafer to prevent over-range movement of a movable MEMS structure coupled to the ASIC wafer, the ASIC wafer including a top circuitry layer, the method comprising:
forming an HDP-OX etch-stop layer above the top circuitry layer;
forming a passivation layer on the HDP-OX etch-stop layer;
selectively etching the passivation layer to form at least one selectively etched stopper feature comprising a remaining unetched portion of the passivation layer, wherein the HDP-OX etch-stop layer is an etch-stop layer for patterning the passivation layer; and
positioning the movable MEMS structure on the ASIC wafer so that the at least one selectively etched stopper feature is opposite the movable MEMS structure within a range of movement of the movable MEMS structure to prevent over-range movement of the movable MEMS structure.

2. A method according to claim 1 , wherein forming the passivation layer comprises forming a bottom oxide layer, a middle nitride layer, and a top oxide layer, and wherein selectively etching the passivation layer comprises:
using a CF4 etchant containing H2 to selectively etch through the top oxide layer and the middle nitride layer; and
introducing CHF3 or CH2F2 into the etchant to selectively etch through the bottom oxide layer to the HDP-OX layer.

3. A method according to claim 1 , further comprising:
forming a TiN anti-stiction coating on at least one stopper feature.

4. A method according to claim 3 , further comprising:
forming circuitry configured to place an electrical potential on the TiN anti-stiction coating.

5. A method according to claim 3 , wherein forming a TiN anti-stiction coating on at least one stopper feature comprises forming a TiN anti-stiction coating on each of a plurality of stopper features.

6. A method according to claim 5 , further comprising:
wherein forming a TiN anti-stiction coating on each of a plurality of stopper features comprises forming at least two stopper features having TiN anti-stiction coatings that are electrically connected to one another, and wherein the method further comprises forming circuitry configured to place an electrical potential on the electrically connected TiN anti-stiction coatings; or
forming a TiN anti-stiction coating on each of a plurality of stopper features comprises forming at least two stopper features having TiN anti-stiction coatings that are electrically isolated from one another, and wherein the method further comprises forming circuitry capable of placing different electrical potentials on the electrically isolated TiN anti-stiction coatings.

7. A method according to claim 1 , further comprising:
forming a plurality of AlCu standoffs.

8. An ASIC wafer having stopper features to prevent over-range movement of a movable MEMS structure coupled to the ASIC wafer, the ASIC wafer comprising:
a top circuitry layer;
an HDP-OX etch-stop layer formed above the top circuitry layer;
a passivation layer formed on the HDP-OX etch-stop layer and including at least one selectively etched stopper feature comprising a remaining unetched portion of the passivation layer; and
a movable MEMS structure positioned on the ASIC wafer so that the at least one selectively etched stopper feature is opposite the movable MEMS structure within a range of movement of the movable MEMS structure to prevent over-range movement of the movable MEMS structure.

9. An ASIC wafer according to claim 8 , wherein the passivation layer comprises:
a bottom oxide layer;
a middle nitride layer; and
a top oxide layer.

10. An ASIC wafer according to claim 8 , further comprising:
a TiN anti-stiction coating on at least one stopper feature.

11. An ASIC wafer according to claim 10 , further comprising:
circuitry configured to place an electrical potential on the TiN anti-stiction coating.

12. An ASIC wafer according to claim 10 , comprising a TiN anti-stiction coating on each of a plurality of stopper features, wherein:
at least two stopper features have TiN anti-stiction coatings that are electrically connected to one another and the ASIC wafer includes circuitry configured to place an electrical potential on the electrically connected TiN anti-stiction coatings; or
at least two stopper features have TiN anti-stiction coatings that are electrically isolated from one another and the ASIC wafer includes circuitry capable of placing different electrical potentials on the electrically isolated TiN anti-stiction coatings.

13. An ASIC wafer according to claim 8 , further comprising a plurality of AlCu standoffs.

14. An integrated wafer-level chip scale package device comprising an ASIC wafer coupled to a movable MEMS structure and wherein the ASIC wafer comprises:
a top circuitry layer;
an HDP-OX etch-stop layer formed above the top circuitry layer; and
a passivation layer formed on the HDP-OX etch-stop layer and including at least one selectively etched stopper feature comprising a remaining unetched portion of the passivation layer positioned opposite the movable MEMS structure within a range of movement of the movable MEMS structure to prevent over-range movement of the movable MEMS structure.

15. An integrated wafer-level chip scale package device according to claim 14 , wherein the passivation layer comprises:
a bottom oxide layer;
a middle nitride layer; and
a top oxide layer.

16. An integrated wafer-level chip scale package device according to claim 14 , further comprising:
a TiN anti-stiction coating on at least one stopper feature.

17. An integrated wafer-level chip scale package device according to claim 16 , further comprising:
circuitry configured to place an electrical potential on the TiN anti-stiction coating.

18. An integrated wafer-level chip scale package device according to claim 16 , comprising a TiN anti-stiction coating on each of a plurality of stopper features, wherein:
at least two stopper features have TiN anti-stiction coatings that are electrically connected to one another and the device includes circuitry configured to place an electrical potential on the electrically connected TiN anti-stiction coatings; or
at least two stopper features have TiN anti-stiction coatings that are electrically isolated from one another and the device includes circuitry capable of placing different electrical potentials on the electrically isolated TiN anti-stiction coatings.

19. An integrated wafer-level chip scale package device according to claim 14 , further comprising a plurality of AlCu standoffs.

20. A method according to claim 1 , wherein the movable MEMS structure is on a separate MEMS device wafer, and wherein positioning the movable MEMS structure on the ASIC wafer comprises bonding the separate MEMS device wafer to the ASIC wafer so that the at least one selectively etched stopper feature is opposite the movable MEMS structure within a range of movement of the movable MEMS structure to prevent over-range movement of the movable MEMS structure.

Assignees

• Analog Devices Inc

Inventors

• Chen Li
• Nunan Thomas Kieran
• Yang Kuang L

Classifications

• B81B3/0005 Primary

  Anti-stiction coatings · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title

• B81C2201/112

  Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts · CPC title

• B81C2203/0118

  Bonding a wafer on the substrate, i.e. where the cap consists of another wafer · CPC title

• B81B3/0059

  Constitution or structural means for controlling the movement not provided for in groups B81B3/0037 - B81B3/0056 · CPC title