Base film for dicing sheet and dicing sheet

Patent metadata

Field	Value
Publication number	US-9546302-B2
Application number	US-201214235844-A
Country	US
Kind code	B2
Filing date	Sep 5, 2012
Priority date	Sep 16, 2011
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object without imparting physical energy, such as electron beam or γ ray. The base film for a dicing sheet comprises a resin layer. The resin layer comprises: a ring-containing resin that is a thermoplastic resin having a monomer, as a constitutional unit, having at least one type of an aromatic ring and an aliphatic ring; and an acyclic olefin-based resin that is an olefin-based thermoplastic resin other than the ring-containing resin. The ring-containing resin in the resin layer has a content of more than 3.0 mass %. A dicing sheet is also provided which comprises: the base film for a dicing sheet; and a pressure-sensitive adhesive layer placed on the base film.

First claim

The invention claimed is:

1. A dicing-sheet base film, the dicing-sheet base film comprising a resin layer, wherein
the resin layer comprises: a ring-containing resin that is a thermoplastic resin having at least one of an aromatic ring and an aliphatic ring; and an acyclic olefin-based resin that is an olefin-based thermoplastic resin other than the ring-containing resin,
wherein the resin layer contains more than 3.0 mass % and 60 mass % or less of the ring-containing resin,
the ring-containing resin has a fluidization temperature of 235° C. or less,
the resin layer comprises a phase separation structure that includes a phase comprising the ring-containing resin and a phase comprising the acyclic olefin-based resin, and
the resin layer has an internal haze value of 7.0% or more and 98.4% or less.

2. The dicing-sheet base film as recited in claim 1 , wherein the acyclic olefin-based resin comprises an ethylene-based polymer.

3. The dicing-sheet base film as recited in claim 2 , wherein the ring-containing resin has a tensile elastic modulus at 23° C. of more than 1.5 GPa.

4. The dicing-sheet base film as recited in claim 2 , wherein the resin layer has the internal haze value of 7.0% or more and 80% or less.

5. A dicing sheet comprising: the dicing-sheet base film as recited in claim 2 ; and a pressure-sensitive adhesive layer placed on the dicing-sheet base film.

6. The dicing-sheet base film as recited in claim 1 , wherein the ring-containing resin has a tensile elastic modulus at 23° C. of more than 1.5 GPa.

7. The dicing-sheet base film as recited in claim 6 , wherein the resin layer has the internal haze value of 7.0% or more and 80% or less.

8. A dicing sheet comprising: the dicing-sheet base film as recited in claim 6 ; and a pressure-sensitive adhesive layer placed on the dicing-sheet base film.

9. The dicing-sheet base film as recited in claim 1 , wherein the resin layer has the internal haze value of 7.0% or more and 80% or less.

10. A dicing sheet comprising: the dicing-sheet base film as recited in claim 1 ; and a pressure-sensitive adhesive layer placed on the dicing-sheet base film.

11. The dicing-sheet base film as recited in claim 1 , wherein the acyclic olefin-based resin is polyethylene.

12. A method for dicing a cut object, the method comprising:
applying a surface of a dicing sheet to the cut object, the dicing sheet comprising the dicing-sheet base film as recited in claim 1 and a pressure-sensitive adhesive layer placed on the dicing-sheet base film, and the surface of the dicing sheet being a surface of the pressure-sensitive adhesive layer that is opposite to a surface adhered to the dicing-sheet base, and
cutting the cut object on the dicing sheet.

13. The method for dicing a cut object as recited in claim 12 , wherein the ring-containing resin has a tensile elastic modulus at 23° C. of more than 1.5 GPa.

14. The method for dicing a cut object as recited in claim 12 , wherein the acyclic olefin-based resin is polyethylene.

15. The method for dicing a cut object as recited in claim 12 , wherein the resin layer has the internal haze value of 7.0% or more and 80% or less.

Assignees

• Taya Naoki
• Ueda Masashi
• Sato Yosuke
• Ito Masaharu
• Lintec Corp

Inventors

• Taya Naoki
• Ueda Masashi
• Sato Yosuke
• Ito Masaharu

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/7404

  the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer · CPC title

• C09J7/385 Primary

  Acrylic polymers · CPC title

• C09J175/14

  Polyurethanes having carbon-to-carbon unsaturated bonds · CPC title