Method of removing waste of substrate and waste removing device thereof

Patent metadata

Field	Value
Publication number	US-9545691-B2
Application number	US-201314138181-A
Country	US
Kind code	B2
Filing date	Dec 23, 2013
Priority date	Dec 23, 2013
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

According to an exemplary embodiment of the disclosure, a method of removing a waste part of a substrate is provided. The method includes: using a laser to partially drill the substrate to define the waste part; and applying megasonic vibration to the substrate to remove the waste part from the substrate.

First claim

What is claimed is:

1. A method comprising:
forming a film, having a thickness, over a portion of a surface of a substrate;
using a laser to drill, into the substrate, a trench that
extends downward from the substrate's surface partially through the substrate,
extends around the film to define a waste part from the substrate, and
forms, at a bottom of the trench, a weakened connection between the waste part and the substrate;

placing a tape on the substrate and the film;
rolling a roller over the tape such that force from the roller against the film, due to the film's thickness, forces the waste part downward below the substrate's surface, which causes the weakened connection to break; and
detaching the tape from the substrate to remove the waste part from the substrate.

2. The method of claim 1 , further comprising, after the drilling of the trench and before the placing of the tape:
performing a cleaning process on the substrate.

3. The method of claim 1 , wherein the film is made of photoresist or polyimide.

4. The method of claim 1 , wherein the using of the roller attaches the tape to the substrate and to the film.

5. The method of claim 1 , wherein the waste part is disposed below the film.

6. A method comprising:
forming a protrusion, having a thickness, over a surface of a portion of the substrate;
performing a process to define a waste part from the substrate, by forming a weakened connection between the waste part and the substrate;
placing a tape on the substrate and the protrusion;
pushing a pushing component over the tape such that force from the pushing component against the protrusion, due to the protrusion's thickness, forces the waste part downward below the substrate's surface which causes the weakened connection to break; and
detaching the tape from the substrate to remove the waste part from the substrate.

7. The method of claim 6 , further comprising, after the performing of the process and before the placing of the tape:
performing a cleaning process on the substrate to remove particles generated by the process defining the waste part.

8. The method of claim 6 , wherein the protrusion comprises photoresist or polyimide.

9. The method of claim 6 , wherein the performing of the process to define the waste part comprises using a laser to partially drill the substrate around the protrusion.

10. The method of claim 6 , wherein the pushing component is a roller that rolls over the tape.

11. The method of claim 10 , wherein the using of the roller attaches the tape to the substrate and to the protrusion.

12. The method of claim 6 , wherein the waste part is disposed below the protrusion.

13. The method of claim 6 , wherein the pushing of the pushing component attaches the protrusion to the waste part.

14. The method of claim 6 , wherein the pushing of the pushing component attaches the protrusion to the substrate.

15. The method of claim 6 , wherein the process includes drilling around the protrusion.

16. The method of claim 6 , wherein the substrate and the waste part are located above a cavity, such that the pushing pushes the waste part partially into the cavity.

17. A method comprising:
forming a film, having a thickness, over a portion of a top surface of a substrate of a micro-fluidic structure;
using a laser to drill, into the substrate, a trench that
extends downward from the substrate's surface partially through the substrate,
extends around the film to define a waste part from the substrate, and
forms, at a bottom of the trench, a weakened connection between the waste part and the substrate;

placing a tape on the top substrate and the film;
rolling a roller over the tape such that force from the roller against the film, due to the film's thickness, forces the waste part downward below the substrate's surface, which causes the weakened connection to break; and
detaching the tape from the top substrate to remove the waste part from the top substrate.

18. The method of claim 17 , wherein the waste part sticks to the tape and does not drop into a channel disposed between the top substrate and the bottom substrate.

19. The method of claim 17 , further comprising, after the drilling of the trench and before placing of the tape:
performing a cleaning process on the micro-fluidic structure.

20. The method of claim 17 , wherein the film comprises photoresist or polyimide.

21. The method of claim 17 , wherein the waste part is disposed below the film.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Cho Chin-Yi
• Teng Yi-Chuan
• Tsai Shang-Ying
• Hung Li-Min
• Huang Yao-Te
• Peng Jung-Huei

Classifications

• B28D5/0076 Primary

  for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work · CPC title

• B23K26/364

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• B23K26/365 Primary

  Operations & Transport · mapped topic

• C03B33/0222

  Scoring using a focussed radiation beam, e.g. laser · CPC title

• B08B7/02

  by distortion, beating, or vibration of the surface to be cleaned {(B08B7/0007 takes precedence)} · CPC title