Method of manufacturing light-emitting apparatus, light-emitting module inspecting apparatus, and method of determining whether light-emitting module meets quality requirement

Patent metadata

Field	Value
Publication number	US-9543221-B2
Application number	US-201514937347-A
Country	US
Kind code	B2
Filing date	Nov 10, 2015
Priority date	Nov 11, 2014
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

A method of manufacturing a light-emitting apparatus includes disposing a substrate on a support; disposing a light-emitting package including a light-emitting device on the substrate so as to allow the light-emitting package to be positioned at a target position on the substrate; applying energy to the light-emitting package to make the light-emitting device emit light; and analyzing the light that is emitted from the light-emitting device due to the energy, and determining a position where the light-emitting package is actually disposed. Thus, the light-emitting apparatus may be easily and inexpensively manufactured, and may generate a limited number of spots and provide improved uniform brightness.

First claim

What is claimed is:

1. A method of manufacturing a light-emitting apparatus, the method comprising:
disposing a substrate on a support;
disposing a light-emitting package on the substrate so as to allow the light-emitting package to be positioned at a target position on the substrate, the light-emitting package comprising a light-emitting device;
applying energy to the light-emitting package to make the light-emitting device emit light; and
determining a position where the light-emitting package is actually disposed by analyzing the light that is emitted from the light-emitting device due to the energy.

2. The method of claim 1 , wherein applying the energy comprises irradiating light onto the light-emitting device.

3. The method of claim 2 , wherein irradiating the light comprises:
focusing a portion of the irradiated light; and
irradiating the focused portion of the irradiated light onto the light-emitting device.

4. The method of claim 3 , wherein focusing the portion of the irradiated light is performed by a light focusing optical system.

5. The method of claim 3 , wherein the light-emitting package has a window with a predetermined shape, and determining the position comprises:
sensing the light that is emitted from the light-emitting device; and
determining the position of the light-emitting package by determining a center of the window with the predetermined shape.

6. The method of claim 2 , wherein a wavelength of the light that is irradiated to the light-emitting device is shorter than a wavelength of the light that is emitted from the light-emitting device.

7. The method of claim 1 , wherein applying the energy comprises applying an electric power to the light-emitting device.

8. The method of claim 1 , further comprising disposing a lens on the light-emitting package based on the position where the light-emitting package is actually disposed.

9. The method of claim 8 , wherein the lens is disposed so that a center of the window of the light-emitting package is on a central axis of the lens.

10. The method of claim 8 , wherein disposing the lens comprises:
setting the position where the light-emitting package is actually disposed as a new target position for the lens; and
disposing the lens at the new target position.

11. The method of claim 1 , wherein the light-emitting package does not comprise a phosphor.

12. A method of manufacturing a light-emitting apparatus, the method comprising:
disposing a light-emitting package comprising a light-emitting device on a substrate so as to allow the light-emitting package to be positioned at a target position on the substrate, fiducial marks being provided on the substrate;
applying energy to the light-emitting device to make the light-emitting device emit light; and
obtaining image information about the light that is emitted from the light-emitting device.

13. The method of claim 12 , wherein obtaining the image information comprises obtaining information about a wavelength distribution of the light emitted from the light-emitting device.

14. The method of claim 13 , further comprising, after the obtaining of the image information, determining the light-emitting package as a non-defective product if a peak wavelength of the light emitted from the light-emitting device is within a predetermined range of a normal peak wavelength, or determining the light-emitting package as a defective product if the peak wavelength of the light emitted from the light-emitting device is not within the predetermined range of the normal peak wavelength.

15. The method of claim 12 , wherein obtaining the image information comprises extracting a contour of a window of the light-emitting package based on the light emitted from the light-emitting device.

16. The method of claim 15 , wherein the window of the light-emitting package has a predetermined shape, and
the method further comprises determining the light-emitting package as a defective product if the extracted contour of the window differs from the predetermined shape.

17. The method of claim 15 , wherein the window of the light-emitting package has a predetermined shape, and
the method further comprises:
detecting a position of a center of the window; and
storing the position of the center of the window as a position of the light-emitting package.

18. The method of claim 17 , further comprising calculating a distance between the position of the light-emitting package and the target position and determining that the light-emitting apparatus is non-defective or defective based on the calculated distance.

19. The method of claim 12 , wherein the light-emitting package does not comprise a phosphor.

20. A method of manufacturing a light-emitting apparatus, the method comprising:
disposing a substrate on a support; disposing a light-emitting package comprising a light-emitting device on the substrate;
applying energy to the light-emitting package to make the light-emitting device emit light; and
analyzing the light that is emitted from the light-emitting device due to the energy, and determining whether the light-emitting package meets a quality requirement based on the analyzed emitted light.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Dae-Seo
• Lee Ka-Ram
• Kim Choo-Ho

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H01L2224/16225

  Electricity · mapped topic