Apparatus for providing and directing heat energy in a process chamber

Patent metadata

Field	Value
Publication number	US-9543172-B2
Application number	US-201314043091-A
Country	US
Kind code	B2
Filing date	Oct 1, 2013
Priority date	Oct 17, 2012
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

Apparatus for providing heat energy to a process chamber are provided herein. The apparatus may include a process chamber body of the process chamber, a solid state source array having a plurality of solid state sources, disposed on a first substrate, to provide heat energy to the process chamber to heat a target component disposed in the process chamber body, and at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the target component.

First claim

The invention claimed is:

1. An apparatus for providing heat energy to a process chamber, the apparatus comprising:
a process chamber body of the process chamber;
a solid state source array having a plurality of solid state sources, disposed on a first substrate, to heat a target component disposed in the process chamber body; and
at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the target component, wherein the at least one reflector has a geometric configuration in a form of a triangular prism.

2. The apparatus of claim 1 , wherein a surface of the at least one reflector is angled to reflect radiated solid state sourcelight toward the target component.

3. The apparatus of claim 1 , wherein the at least one reflector (a) is disposed between at least two of the plurality of solid state sources and (b) directs the heat energy provided by the at least two of the plurality of solid state sources towards the component.

4. The apparatus of claim 1 , wherein the at least one reflector (a) is disposed about a periphery of the solid state source array and (b) directs heat energy provided by the solid state source array towards the component.

5. The apparatus of claim 1 , wherein the at least one reflector includes a plurality of reflectors, and wherein the plurality of reflectors are disposed about a periphery of each of the plurality of the solid state sources.

6. The apparatus of claim 1 , wherein the plurality of solid state sources are light emitting diodes (LEDs).

7. The apparatus of claim 6 , wherein each of the LEDs provide energy at wavelengths ranging from about 100 to about 2000 nanometers.

8. The apparatus of claim 6 , wherein each of the LEDs is comprised of at least one of gallium nitride or aluminum nitride.

9. The apparatus of claim 6 , wherein each of the LEDs provides energy at wavelengths ranging from about 300 to about 5000 nanometers.

10. The apparatus of claim 6 , wherein each of the LEDs is a wire-bond-free direct attach LED.

11. The apparatus of claim 1 , wherein each of the plurality of solid state sources are LASERS.

12. The apparatus of claim 1 , wherein the at least one reflector is mounted directly to the first substrate.

13. The apparatus of claim 1 , wherein the at least one reflector is grown directly on the first substrate.

14. The apparatus of claim 1 , wherein the at least one reflector is formed by a stamping process to create a desired shape and angle of reflector surfaces.

15. The apparatus of claim 1 , wherein the at least one reflector is formed by at least one of laser cutting, etching, wire-cut Electrical Discharge Machining (EDM), or electro-forming.

16. An apparatus for providing heat energy to a process chamber, the apparatus comprising:
a process chamber body of the process chamber;
a solid state source array having a plurality of solid state sources, disposed on a first substrate, to heat a target component disposed in the process chamber body; and
at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the target component,
wherein a reflective acrylic dam is disposed around a perimeter of the solid state source array and configured to contain an epoxy poured over each of the plurality of solid state sources and the at least one reflector.

17. The apparatus of claim 1 , wherein the at least one reflector is a reflector array having a plurality of reflector cavities which direct heat energy provided by the plurality of solid state sources towards the component, and wherein the reflector array is formed via a potassium hydroxide (KOH) etching process.

18. An apparatus for providing heat energy to a process chamber, the apparatus comprising:
a process chamber body of the process chamber;
a solid state source array having a plurality of solid state sources disposed on a first substrate to heat a process chamber component disposed in the process chamber;
a plurality of lateral reflectors mounted on the first substrate and substantially perpendicular to the first substrate, and arrayed substantially parallel to each other, each having a plurality of slots disposed along a first lateral edge; and
a plurality of transverse reflectors mounted on the first substrate and substantially perpendicular to the first substrate, and arrayed substantially parallel to each other, each having a plurality of slots disposed along a first lateral edge,
wherein the slots disposed along the first lateral edges of the plurality of transverse reflectors engage the slots disposed along the first lateral edges of the plurality of lateral reflectors to create a reflector array including at least one rectangular reflector cavity, and
wherein each of the at least one rectangular reflector cavity is disposed about at least one of the plurality of solid state sources in the solid state source array to direct heat energy provided by at least one of the plurality of solid state sources towards the process chamber component.

19. An apparatus for providing heat energy to a process chamber, the apparatus comprising:
a process chamber body of the process chamber;
a solid state source array having a plurality of solid state sources, disposed on a first substrate, to heat a process chamber component disposed in the process chamber;
at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the component; and
at least one lens disposed between the solid state source array and the process chamber component to be heated, wherein each of the at least one lens directs heat energy provided by at least one of the plurality of solid state sources towards the process chamber component.

Assignees

• Applied Materials Inc

Inventors

• Johnson Joseph
• Ranish Joseph M
• Gerling John
• Abraham Mathew
• Hunter Aaron Muir
• Nainani Aneesh

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H01L21/67115 Primary

  Electricity · mapped topic

• H01L21/67109

  Electricity · mapped topic