Substrate treatment apparatus and substrate treatment method

Patent metadata

Field	Value
Publication number	US-9536797-B2
Application number	US-201514614834-A
Country	US
Kind code	B2
Filing date	Feb 5, 2015
Priority date	Jul 22, 2014
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

A substrate treatment apparatus includes a processing chamber configured to be capable of storing a substrate; a substrate holder disposed in the processing chamber and configured to be capable of holding the substrate; a sublimation removing unit configured to remove, by sublimation, a sublimating material filled between structures formed on a surface of a substrate held by the substrate holder, and a sublimation status detecting unit configured to detect a progress or an end point of sublimation removal of the sublimating material.

First claim

What is claimed is:

1. A substrate treatment apparatus comprising:
a processing chamber configured to be capable of storing a substrate;
a substrate holder disposed in the processing chamber and configured to be capable of holding the substrate;
a sublimation removing unit configured to remove, by sublimation, a sublimating material filled between structures formed on a surface of a substrate held by the substrate holder;
a sublimation status detecting unit configured to detect a progress or an end point of sublimation removal of the sublimating material;
a liquid supplying unit configured to supply, to a surface of the substrate, a sublimating material containing liquid containing a sublimating material; and
a precipitating unit configured to precipitate the sublimating material between the structures by vaporizing a portion of the sublimating material containing liquid supplied to the surface of the substrate.

2. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a flame ionization detector.

3. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a photo ionization detector.

4. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a photo detector configured to detect light absorption or florescence or light emission of gas produced by the sublimation of the sublimating material.

5. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a pressure detector configured to detect a variation of pressure of gas produced by the sublimation of the sublimating material.

6. The apparatus according to claim 1 , wherein the sublimation status detecting unit comprises a substrate weight detector configured to detect a variation of weight of the substrate caused by the sublimation of the sublimating material.

7. The apparatus according to claim 1 , wherein the processing chamber is configured to be capable of simultaneously storing two or more substrates, and
wherein the sublimation removing unit comprises a heating portion configured to be capable of heating an interior of the processing chamber, and
wherein the sublimation status detecting unit is configured to detect the progress or the end point of sublimation removal of the sublimating material based on a reflected light resulting from irradiation of light on a surface of a substrate most distant from the heating portion among the two or more substrates.

8. A method of treating a substrate comprising:
supplying a sublimating material containing liquid containing a sublimating material to a substrate having structures formed on a surface thereof;
precipitating the sublimating material between the structures by vaporizing the sublimating material containing liquid supplied to the surface of the substrate;
removing, by sublimation, the sublimating material existing between the structures; and
detecting a progress or an end point of removing the sublimating material by sublimation.

9. The method according to claim 8 , wherein the detecting includes detecting, by a flame ionization detector, a variation of a component of gas produced by sublimation of the sublimating material.

10. The method according to claim 8 , wherein the detecting includes detecting, by a photo ionization detector, a variation of a component of gas produced by sublimation of the sublimating material.

11. The method according to claim 8 , wherein the detecting includes detecting light absorption or florescence or light emission of gas produced by sublimation of the sublimating material.

12. The method according to claim 8 , wherein the detecting includes detecting a variation of pressure of gas produced by sublimation of the sublimating material.

13. The method according to claim 8 , wherein the detecting includes detecting a variation of a weight of the substrate caused by sublimation of the sublimating material.

Assignees

• Toshiba Kk

Inventors

• Igarashi Junichi
• Sato Katsuhiro
• Morita Keiko
• Hirabayashi Hideaki

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/238 Primary

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H01L22/26 Primary

  Electricity · mapped topic

• H01L22/12

  Electricity · mapped topic