Technique for measuring overlay between layers of a multilayer structure

US9530199B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9530199-B1
Application numberUS-201514798283-A
CountryUS
Kind codeB1
Filing dateJul 13, 2015
Priority dateJul 13, 2015
Publication dateDec 27, 2016
Grant dateDec 27, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

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A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.

First claim

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The invention claimed is: 1. A method for determining overlay between layers of a multilayer structure, the method comprising: obtaining a given image representing the multilayer structure; obtaining expected images of layers of the multilayer structure; generating a combined expected image of the multilayer structure as a combination of the expected images of said layers; performing registration of the given image against the combined expected image; providing segmentation of the given image to produce a segmented image and maps of the layers of said multilayer structure; and determining, by a computer processor, an overlay measurement between any two selected layers of the multilayer structure by processing the maps of the two selected layers with the corresponding expected images of said two selected layers. 2. The method according to claim 1 , wherein at least one of the combined expected image or the expected images of the layers are design images processed by simulation. 3. The method according to claim 1 , wherein the multilayer structure is a semiconductor structure three-dimensional integrated circuit (3D IC), the given image is a scanning electron microscope (SEM)-image of the 3D IC, the expected images are simulated design images of the layers, the combined expected image is formed by combining the simulated design images of the layers based on an order of the layers and expected occlusions, the segmentation is SEM-image segmentation to produce SEM-maps of the layers, and the overlay measurement between the two selected layers of the 3D IC is determined by processing the SEM-maps of the two selected layers using the expected images of said two selected layers. 4. The method according to claim 1 , wherein said segmentation is based on the expected images of the layers. 5. The method according to claim 1 , further comprising enhancing the segmentation by adjusting at least one of the expected images. 6. The method according to claim 1 , further comprising determining safe areas on the expected images and on the maps of the layers based on probable occlusions and distortions between the expected images and the given image. 7. The method according to claim 6 , wherein said determining of the overlay measurement between the two selected layers of the multilayer structure is performed by utilizing the determined safe areas. 8. The method according to claim 1 , wherein the determining of the overlay measurement between the two selected layers of the multilayer structure comprises: for each of the two selected layers, performing per-layer registration between the respective map of a specific layer of the two selected layers with the respective expected image of the specific layer; for each of the two selected layers, measuring a shift of the specific layer by comparing the respective map of the specific layer with the respective expected image of the specific layer to determine two shifts of the two selected layers respectively; and determining the overlay measurement between said two selected layers as a difference between said two shifts. 9. The method according to claim 8 , further comprising: determining safe areas on the expected images and on the maps of the layers based on probable occlusions and distortions between the expected images and the given image; and performing said per-layer registration based on the safe areas. 10. The method according to claim 6 , wherein said determining of the overlay measurement between the two selected layers of the multilayer structure comprises: choosing two map safe areas (MSAs) of pixels respectively appearing in the respective maps of the two selected layers; allocating two expected safe area (ESA) segments appearing in the respective expected images of the two selected layers, said two ESA segments respectively corresponding to said two MSAs of pixels; determining a vector of overlay S img for the two chosen MSAs by calculating a first difference between Centers of Gravity of the two chosen MSAs; determining a vector of overlay S exp for the two ESA segments by calculating a second difference between Centers of Gravity of the two chosen MSAs; and determining the overlay measurement between the two selected layers by calculating a difference between S img and S exp . 11. The method according to claim 1 , further comprising: using feedback pertaining to the determined overlay measurement to correct the segmentation. 12. The method according to claim 11 , further comprising: re-determining of the overlay measurement using the corrected segmentation. 13. The method according to claim 1 , further comprising: determining a respective overlay measurement for each layer of the multilayer structure with respect to remaining layers of the multilayer structure. 14. A system for image processing comprising: a memory configured to store a given image of a multilayer structure and expected images of layers of the multilayer structure; and a processor configured to: generate a combined expected image of the multilayer structure as a combination of the expected images of said layers; register the given image against the combined expected image; segment the given image to produce a segmented image and maps of the layers of the multilayer structure; and determine an overlay measurement between any two selected layers of the multilayer structure by processing the maps of the two selected layers with the corresponding expected images of said two selected layers. 15. A computer software product including a non-transitory computer-readable medium storing instructions, when executed by a computer processor, cause the computer processor to perform operations comprising: obtaining a given image representing a multilayer structure; obtaining expected images of layers of the multilayer structure; generating a combined expected image of the multilayer structure as a combination of the expected images of said layers; performing registration of the given image against the combined expected image; providing segmentation of the given image to produce a segmented image and maps of the layers of said multilayer structure; and determining, by the computer processor, an overlay measurement between any two selected layers of the multilayer structure by processing the maps of the two selected layers with the corresponding expected images of said two selected layers.

Assignees

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Classifications

  • having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title

  • Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales · CPC title

  • Monitoring the printed patterns · CPC title

  • G06T7/001Primary

    using an image reference approach · CPC title

  • using a design-rule based approach · CPC title

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What does patent US9530199B1 cover?
A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combine…
Who is the assignee on this patent?
Applied Materials Israel Ltd, Applied Materials Israel Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/70616. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).