Optical fiber pressure sensor with uniform diaphragm and method of fabricating same

Patent metadata

Field	Value
Publication number	US-9528893-B2
Application number	US-201013381256-A
Country	US
Kind code	B2
Filing date	Jun 29, 2010
Priority date	Jun 29, 2009
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

An optical fiber sensor ( 100 ) can be used to measure pressure with high sensitivity and fine resolution. As a ( 108 ) at the end of the sensor expands or contracts, the spectrum of a beam reflected from the end of fiber shifts, producing a change linked to pressure exerted on the sensor. Novel aspects of the present inventive sensor include the direct bonding of a silica thin film diaphragm ( 110 ) to the optical fiber with localized or confined heating and a uniform thickness of the diaphragm. The resulting sensor has a diameter that matches the diameter of the optical fiber. Because the sensor is all silica, it does not from temperature-induced error. In addition, the sensor can be very sensitive because the diaphragm can be very thin; it can also make highly repeatable measurements due to its very uniform thickness.

First claim

What is claimed is:

1. A sensor comprising:
a) an optical fiber; and
b) a diaphragm of silica, which is formed by etching a silica-on-silicon wafer to remove the silicon, and having a surface in contact with the optical fiber and a thickness that varies by up to and including five percent, wherein a cavity is defined by a surface of the optical fiber and an inner surface of the diaphragm.

2. The sensor of claim 1 , wherein an optical distance between the surface of the optical fiber and the inner surface of the diaphragm is about (m+½)(λ/4), where m is an integer equal to or greater than zero and λ is a wavelength of light transmitted through the optical fiber.

3. The sensor of claim 1 , wherein the optical fiber further includes a core aligned along a major axis of the optical fiber and a cladding disposed radially over at least a portion of the core.

4. The sensor of claim 3 , wherein the surface of the optical fiber includes a surface of the core normal to the major axis of the optical fiber.

5. The sensor of claim 3 , wherein the surface of the diaphragm in contact with the optical fiber is in contact with the cladding.

6. The sensor of claim 1 , wherein the optical fiber and the diaphragm each include materials with nominal coefficients of thermal expansion.

7. The sensor of claim 1 , wherein the diaphragm is formed using dry etching.

8. The sensor of claim 1 , wherein the diaphragm is less than about three microns thick.

9. The sensor of claim 1 , wherein the diaphragm is equal to or less than about one micron thick.

10. The sensor of claim 1 , wherein at least a portion of the surface of the optical fiber is recessed within the optical fiber.

11. The sensor of claim 1 , wherein at least a portion of the inner surface of the diaphragm is recessed within the diaphragm.

12. The sensor of claim 1 , wherein the optical fiber is a multimode optical fiber and further including a single-mode fiber connected to the multimode optical fiber.

13. The sensor of claim 1 , further including a coil surrounding the diaphragm and at least a portion of the optical fiber.

14. The sensor of claim 13 , wherein the coil includes a tightly wound section disposed about the diaphragm.

15. The sensor of claim 14 , wherein the coil includes a loosely wound section that extends distal to the tightly wound section.

16. The sensor of claim 1 , wherein the inner surface of the diaphragm is smooth, with a root-mean-square roughness of about 0.2 nm over an area of about 20 μm×20 μm.

17. The sensor of claim 1 , wherein the sensor is formed by a method comprising the steps of:
(a) forming a thin film having a thickness that varies by up to and including five percent;
(b) supporting the thin film on a holder; and
(c) bonding the thin film to the optical fiber while the thin film is being supported on the holder, to thereby form the sensor with the diaphragm defining one side of the cavity.

18. The sensor of claim 17 , wherein the thin film and the optical fiber are heated to at least 700 degrees Celsius to thermally bond the thin film to the optical fiber.

19. The sensor of claim 1 , wherein the diameter of the diaphragm is the same as the diameter of the optical fiber.

20. The sensor of claim 1 , wherein the silica diaphragm has a root-mean-square roughness of about 0.2 nm over an area of about 20 μm×20 μm.

Assignees

• Wang Wenhui
• Wang Xingwei Vivian
• Sun Kai
• Wu Nan
• Univ Massachusetts

Inventors

• Wang Wenhui
• Wang Xingwei Vivian
• Sun Kai
• Wu Nan

Classifications

• G01L7/086 Primary

  with optical transmitting or indicating means · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• Y10T156/1052

  with cutting, punching, tearing or severing · CPC title

• B23K26/361

  for deburring or mechanical trimming (B23K26/351 takes precedence) · CPC title

• A61B5/0082

  adapted for particular medical purposes · CPC title