Method and system for processing a semiconductor wafer using data associated with previously processed wafers

Patent metadata

Field	Value
Publication number	US-9523976-B1
Application number	US-201213678255-A
Country	US
Kind code	B1
Filing date	Nov 15, 2012
Priority date	Nov 15, 2012
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

A method of processing a wafer in a production tool includes receiving a wafer at a process tool, the wafer associated with a wafer process history, acquiring data associated with wafers processed by the process tool and having the wafer process history, when the amount of acquired data is insufficient, acquiring additional data associated with wafers processed by the process tool and having a process history differing from the wafer process history by a single factor, when the amount of acquired data is sufficient, determining a process parameter using the acquired data, and processing the wafer with the production tool using the process parameter.

First claim

What is claimed is:

1. A method of processing a wafer comprising:
receiving the wafer at a production tool, wherein the wafer is associated with a wafer process history;
accessing a database to find data associated with previous wafers processed by the production tool with a same wafer process history, the data including records each associated with a wafer and at least one stored process parameter, wherein the accessing the database comprises querying the database and comparing a sum of a number of records associated with the previous wafers with the same wafer process history and a number of records associated with previously-stored data to a threshold wherein the comparing excludes one or more records having a value of a stored process parameter outside of an expected range, and wherein the expected range is based on at least one of a deviation relative to a mean, a deviation relative to a median, and a set percentile;
determining, in response to the comparing meeting or exceeding the threshold, a process parameter using the data associated with the previous wafers with the same wafer process history;
determining, in response to the comparing being below the threshold, the process parameter using the previously-stored data associated with the previous wafers processed by the production tool based on a regression of model parameters using the data associated with the previous wafers with the same wafer process history and that have a different wafer process history from the wafer process history by at least a single factor and by a least absolute deviation objective function; and
processing the wafer with the production tool using the process parameter when a value of the process parameter exceeds a minimum amount relative to a previous value of the process parameter.

2. The method of claim 1 , wherein the determining the process parameter using the previously-stored data comprises retrieving, the previously-stored data associated with the previous wafers processed by the production tool from the database, wherein the previously-stored data has a different wafer process history from the wafer process history by two factors.

3. The method of claim 1 , wherein the determining the process parameter using the previously-stored data comprises retrieving, the previously-stored data associated with the previous wafers processed by the production tool from the database, wherein the different wafer process history is associated with a different process.

4. The method of claim 1 , wherein the determining the process parameter using the previously-stored data comprises retrieving, the previously-stored data associated with the previous wafers from the database, wherein the different wafer process history is associated with a different production tool.

5. The method of claim 4 , wherein the previous wafers processed by the different production tool have the same wafer process history.

6. The method of claim 1 , wherein the data associated with the previous wafers with the same wafer process history and with previous wafers with the different process history comprises critical dimension data and wherein the process parameter comprises an exposure parameter.

7. The method of claim 1 , wherein the data associated with the previous wafers with the same wafer process history and with previous wafers with the different process history comprises overlay history data and wherein the process parameter comprises a position adjustment parameter.

8. The method of claim 1 , wherein the processing the wafer comprises using a previous value of the process parameter when a value of the process parameter is less than the minimum amount relative to the previous value of the process parameter.

9. The method of claim 1 , wherein the regression is a slacked regression.

10. The method of claim 1 , wherein the least absolute deviation objective function is a weighted least absolute deviation objective function.

11. The method of claim 1 , wherein the regression utilizes a model that is a function of time, wherein the model parameters are associated with the function of time.

12. The method of claim 11 , wherein the model is a linear model having an intercept, the intercept being a function of time.

13. A semiconductor production system comprising:
a production tool to receive a wafer associated with a wafer process history;
a database to store tool history data; and
a controller in communication with the production tool and the database, the controller configured to:
access a database to find data, wherein the data is associated with previous wafers processed by the production tool and associated with a same wafer process history, the data including records each associated with a wafer and at least one stored process parameter, wherein the access to the database comprises a query of the database and a comparison of a sum of records associated with the previous wafers with the same wafer process history and a number of records associated with previously-stored data to a threshold wherein the comparison excludes one or more records having a value of a stored process parameter outside of an expected range, and wherein the expected range is based on at least one of a deviation relative to a mean, a deviation relative to a median, and a set percentile;
determine, in response to the comparison meeting or exceeding the threshold, a process parameter using the retrieved data from the database associated with the previous wafers with the same wafer process history;
determine, in response to the comparison being below the threshold, the process parameter using the previously-stored data from the database associated with the previous wafers processed by the production tool based on a regression of model parameters using the data associated with the previous wafers with the same wafer process history and that have a different wafer process history from the wafer process history by at least a single factor and by a least absolute deviation objective function; and
initiate processing of the wafer in the production tool in accordance with the determined process parameter when a value of the determined process parameter exceeds a minimum amount relative to a previous value of the determined process parameter.

14. The semiconductor production system of claim 13 , wherein the controller configured to determine, in response to the comparison being below the threshold, the process parameter using the previously-stored data is to, retrieve, the previously-stored data associated with the previous wafers processed by the production tool from the database, wherein the previously-stored data has a different wafer process history from the wafer process history by two factors.

15. The semiconductor production system of claim 13 , wherein the controller configured to determine, in response to the comparison being below the threshold, the process parameter using the previously-stored data is to, retrieve, the previously-stored data associated with the previous wafers processed by the production tool from the database, wherein the different wafer process history is associated with a different process.

16. The semiconductor production system of claim 13 , wherein the controller configured to determine, in response to the comparison being below the threshold, the process parameter using the previously-stored data is to, retrieve, the previously-stored data associated with the previous wafers from the database, wherein the different wafer process history is associated with a different production tool.

17. The semiconductor production system of

Assignees

• Spansion Llc
• Cypress Semiconductor Corp

Inventors

• Adams Iii Ernest D

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23 Primary

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• G05B19/02 Primary

  electric · CPC title