Multilayer structure, fingerprint identification device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9516759-B2
Application number	US-201414477300-A
Country	US
Kind code	B2
Filing date	Sep 4, 2014
Priority date	Sep 27, 2013
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A multilayer structure comprises an insulation material, a conductive layer and a protective film. The conductive layer is disposed on the insulation material. The protective film is disposed on the surface of the conductive layer, and the surface area of the protective film is less than that of the conductive layer. A fingerprint identification device and a manufacturing method thereof are also disclosed.

First claim

What is claimed is:

1. A multilayer structure, comprising:
an insulation material;
a conductive layer disposed on the insulation material; and
a protective film disposed on the surface of conductive layer, wherein the surface area of the protective film is less than that of the conductive layer, wherein the protective film comprises diamond-like carbon;
wherein the conductive layer has a remaining region surrounding the protective film, the surface of the remaining region and the surface of the protective film have a sectional difference therebetween, and the sectional difference is extended from the surface of the protective film to incline towards the surface of the remaining region.

2. The multilayer structure as recited in claim 1 , wherein the surface area of the conductive layer is substantially equal to that of the insulation material.

3. A fingerprint identification device, comprising:
a substrate;
a fingerprint sensing circuit disposed on the substrate;
an insulation material disposed on the fingerprint sensing circuit;
a conductive layer disposed on the insulation material; and
a protective film disposed on the surface of the conductive layer, wherein the surface area of the protective film is less than that of the conductive layer, wherein the protective film comprises diamond-like carbon;
wherein the conductive layer has a remaining region surrounding the protective film, the surface of the remaining region and the surface of the protective film have a sectional difference therebetween, and the sectional difference is extended from the surface of the protective film to incline towards the surface of the remaining region.

4. The fingerprint identification device as recited in claim 3 , wherein the surface area of the conductive layer is substantially equal to that of the insulation material.

Assignees

• Innolux Corp

Inventors

• Yang yi-xin
• Chen Din-Guo

Classifications

• Y10T428/24752

  Laterally noncoextensive components · CPC title

• H05K2201/0191

  wherein the thickness of the dielectric plays an important role · CPC title

• H05K3/28 Primary

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K3/285

  Permanent coating compositions · CPC title

• G06K9/00053

  Physics · mapped topic