Circuit board, electronic device, and production method for circuit board
US-12156346-B2 · Nov 26, 2024 · US
Wiring board
US9179552B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9179552-B2 |
| Application number | US-201314235729-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 10, 2013 |
| Priority date | May 16, 2012 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body, a filling member filled up between the plurality of connecting terminals, and a solder resist layer laminated on the laminated body. The filling member is in contact with at least a part of each side surface of the plurality of connecting terminals. The solder resist layer includes an opening that exposes the plurality of connecting terminals. The filling member has a surface roughness rougher than a surface roughness of a top surface of the solder resist layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated, the wiring board comprising: a plurality of connecting terminals formed separately from one another on the laminated body; a filling member filled up between the plurality of connecting terminals, the filling member being in contact with at least a part of each side surface of the plurality of connecting terminals; and a…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K3/28Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9179552B2 cover?
- To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from o…
- Who is the assignee on this patent?
- Ngk Spark Plug Co, Nrk Spark Plug Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K3/28. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).