Substrate for suspension, and production process thereof

Patent metadata

Field	Value
Publication number	US-9516747-B2
Application number	US-201414278490-A
Country	US
Kind code	B2
Filing date	May 15, 2014
Priority date	Jun 29, 2010
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.

First claim

The invention claimed is:

1. A substrate for suspension comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, a wiring layer formed on the insulating layer, and a cover layer formed to cover the wiring layer,
wherein the substrate for suspension comprises
a first structural part including the metal supporting substrate, the insulating layer, the wiring layer, and the cover layer, and a second structural part in which at least the insulating layer is continuously formed from the first structural part, in a planer view from a laminate direction of the metal supporting substrate, the insulating layer, the wiring layer and the cover layer, and the second structural part has no metal supporting substrate, and
wherein the first structural part and the second structural part are adjacent in a longitudinal direction of the wiring layer in a planer view from the laminate direction, and
at least one of a width from an edge of the wiring layer to an edge of the insulating layer and a width from the edge of the wiring layer to an edge of the cover layer is larger in an area including a boundary between the first structural part and the second structural part than other areas in a planar view from the laminate direction.

2. The substrate for suspension according to claim 1 , wherein a position of the edge of the insulating layer coincides with a position of the edge of the cover layer in the area including the boundary between the first structural part and the second structural part.

3. The substrate for suspension according to claim 1 , wherein a curved structural section is formed so as to include the boundary between the first structural part and the second structural part in planar view from the laminate direction, on at least one of the insulating layer and the cover layer.

4. A substrate for suspension comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, a wiring layer formed on the insulating layer, and a cover layer formed to cover the wiring layer,
wherein the substrate for suspension comprises
a first structural part including the metal supporting substrate, the insulating layer, the wiring layer, and the cover layer, and
a second structural part in which at least the insulating layer is continuously formed from the first structural part in a planer view from a laminate direction of the metal supporting substrate, the insulating layer, the wiring layer and the cover layer, and the second structural part has no metal supporting substrate, and
wherein the first structural part and the second structural part are adjacent in a longitudinal direction of the wiring layer in a planer view from the laminate direction, and
an auxiliary wiring layer not connected to an outside is formed between an edge of the wiring layer and an edge of the insulating layer so as to cross the boundary between the first structural part and the second structural part in planar view from the laminate direction.

5. The substrate for suspension according to claim 4 , wherein a surface of the auxiliary wiring layer is covered with the cover layer.

6. The substrate for suspension according to claim 4 , wherein a wiring plating section is formed on a surface of the auxiliary wiring layer.

7. The substrate for suspension according to claim 4 , wherein at least one of a width from the edge of the wiring layer to the edge of the insulating layer and a width from the edge of the wiring layer to an edge of the cover layer is larger in an area including a boundary between the first structural part and the second structural part than other areas in planer view from the laminated layer direction.

8. The substrate for suspension according to claim 1 , wherein the metal supporting substrate has a tongue section for mounting a device and an outrigger section positioned outside the tongue section; and the wiring layer is formed between the tongue section and the outrigger section in planar view.

9. The substrate for suspension according to claim 4 , wherein the metal supporting substrate has a tongue section for mounting a device and an outrigger section positioned outside the tongue section; and the wiring layer is formed between the tongue section and the outrigger section in planar view.

10. The substrate for suspension according to claim 8 , wherein the metal supporting substrate has a crossbar connecting the tongue section with the outrigger section; and the metal supporting substrate of the first structural part is the crossbar.

11. The substrate for suspension according to claim 9 , wherein the metal supporting substrate has a crossbar connecting the tongue section with the outrigger section; and the metal supporting substrate of the first structural part is the crossbar.

12. The substrate for suspension according to claim 8 , wherein the metal supporting substrate has a trace support tab on an end surface of the tongue section side of the outrigger section; and the metal supporting substrate of the first structural part is the trace support tab.

13. The substrate for suspension according to claim 9 , wherein the metal supporting substrate has a trace support tab on an end surface of the tongue section side of the outrigger section; and the metal supporting substrate of the first structural part is the trace support tab.

14. The substrate for suspension according to claim 8 , wherein the metal supporting substrate has a base part supporting a bottom of the outrigger section; and the metal supporting substrate of the first structural part is the base part.

15. The substrate for suspension according to claim 9 , wherein the metal supporting substrate has a base part supporting a bottom of the outrigger section; and the metal supporting substrate of the first structural part is the base part.

16. The substrate for suspension according to claim 8 , wherein the metal supporting substrate of the first structural part is the tongue section.

17. The substrate for suspension according to claim 9 , wherein the metal supporting substrate of the first structural part is the tongue section.

Assignees

• Dainippon Printing Co Ltd

Inventors

• Miura Yoichi
• Yamazaki Tsuyoshi

Classifications

• Y10T428/1171

  with defined laminate structural detail · CPC title

• H05K2201/0394

  Conductor crossing over a hole in the substrate or a gap between two separate substrate parts · CPC title

• H05K2201/09781

  Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• Y10T428/1179

  Head with slider structure · CPC title