Thermal inkjet printhead stack with amorphous thin metal protective layer

Patent metadata

Field	Value
Publication number	US-9511585-B2
Application number	US-201314787711-A
Country	US
Kind code	B2
Filing date	Jul 12, 2013
Priority date	Jul 12, 2013
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising an insulated substrate, a resistor applied to the insulated substrate, a resistor passivation layer applied to the resistor, and an amorphous thin metal protective layer applied to the resistor passivation layer. The amorphous thin metal protective layer can comprise from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron. The film can also include a first and second metal, each comprising from 5 atomic % to 90 atomic % of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum. The second metal is different than the first metal, and the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.

First claim

What is claimed is:

1. A thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising:
an insulated substrate;
a resistor applied to the insulated substrate;
a resistor passivation layer applied to the resistor; and
an amorphous thin metal protective layer applied to the resistor passivation layer, the amorphous thin metal protective layer, comprising:
5 atomic % to 90 atomic % of a metalloid, wherein the metalloid is carbon, silicon, or boron,
5 atomic % to 90 atomic % of a first metal, wherein the first metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, and
5 atomic % to 90 atomic % of a second metal, wherein the second metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, wherein the second metal is different than the first metal,

wherein the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.

2. The thermal inkjet printhead stack of claim 1 , wherein the amorphous thin metal protective layer further comprises from 5 atomic % to 85 atomic % of a third metal, wherein the third metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, and wherein the second metal is different than the first metal and the second metal.

3. The thermal inkjet printhead stack of claim 1 , further comprising a pair of conductors electrically coupled with the resistor, the pair of conductors also including conductor passivation layers applied to a top surface of the pair of conductors.

4. The thermal inkjet printhead stack of claim 1 , wherein the amorphous thin metal protective layer further comprises from 0.1 atomic % to 15 atomic % of a dopant, the dopant being nitrogen, oxygen, or mixtures thereof.

5. The thermal inkjet printhead stack of claim 1 , wherein the amorphous thin metal protective layer has a surface RMS roughness of less than 1 nm.

6. The thermal inkjet printhead stack of claim 1 , wherein the amorphous thin metal protective layer has a thermal stability of at least 400° C. and has an oxidation temperature of at least 700° C.

7. The thermal inkjet printhead stack of claim 1 , wherein the amorphous thin metal protective layer has an oxide growth rate of less than 0.05 nm/min.

8. The thermal inkjet printhead stack of claim 1 , wherein the amorphous thin metal protective layer has an atomic dispersity of at least 12% between at least two of the metalloid, the first metal, and the second metal relative to one another.

9. The thermal inkjet printhead stack of claim 1 , wherein the amorphous thin metal protective layer has an atomic dispersity of at least 12% between each of the metalloid, the first metal, and the second metal relative to one another.

10. The thermal inkjet printhead stack of claim 1 , wherein the amorphous thin metal protective layer is applied at a thickness ranging from 0.8 micron to 2 microns.

11. A method of manufacturing a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising:
applying an amorphous thin metal protective layer to a passivation-layer coated thermal inkjet resistor to provide chemical protection for the resistor, the amorphous thin metal protective layer, comprising:
5 atomic % to 90 atomic % of a metalloid, wherein the metalloid is carbon, silicon, or boron;
5 atomic % to 90 atomic % of a first metal, wherein the first metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum; and
5 atomic % to 90 atomic % of a second metal, wherein the second metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, and wherein the second metal is different than the first metal.

12. The method of claim 11 , wherein the step of applying the amorphous thin metal protective layer includes:
mixing the metalloid, the first metal, and the second metal form a blend, and
sputtering the blend onto the insulated substrate.

13. The method of claim 11 , wherein the amorphous thin metal protective layer further comprises from 5 atomic % to 85 atomic % of a third metal, wherein the third metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, wherein the second metal is different than the first metal and the second metal.

14. The method of claim 11 , wherein the amorphous thin metal protective layer is applied at a thickness ranging from 0.8 micron to 2 microns.

15. The method of claim 11 , wherein the amorphous thin metal protective layer has a surface RMS roughness of less than 1 nm, a thermal stability of at least 400° C., an oxidation temperature of at least 700° C., and an oxide growth rate of less than 005 nm/min.

16. A thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising:
an insulated substrate;
a resistor applied to the insulated substrate;
a pair of conductors positioned on each side of the resistor and electrically coupled with the resistor;
at least one passivation layer applied to a top surface of the resistor and a top surface of the each of the pair of conductors;
an amorphous thin metal protective layer applied to the at least one passivation layer and disposed over the resistor, the amorphous thin meta protective layer being electrically insulated from the resistor by the at least one passivation layer, and the amorphous thin metal protective layer comprising:
5 atomic % to 90 atomic % of a metalloid, wherein the metalloid is carbon, silicon, or boron,
5 atomic % to 90 atomic % of a first metal, wherein the first literal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, and
5 atomic % to 90 atomic % of a second metal, wherein the second metal is titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, wherein the second metal is different than the first metal,

wherein the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.

17. The thermal inkjet printhead stack of claim 16 , wherein the amorphous thin metal protective layer has a thickness of greater than 0.8 micron.

18. The thermal inkjet printhead stark of claim 17 , wherein the resistor has a thickness range of 0.02 micron to 0.5 micron.

Assignees

• Hewlett Packard Development Co Lp

Inventors

• Abbott Jr James Elmer
• Agarwal Arun K
• Pugliese Roberto A
• Long Greg Scott
• Horvath Stephen
• Keszler Douglas A
• Wager John
• Olsen Kristopher
• Mcglone John

Classifications

• B41J2/14112 Primary

  Resistive element · CPC title

• B41J2/14129 Primary

  Layer structure · CPC title

• B41J2/1646

  thin film formation by sputtering · CPC title

• B41J2/1648

  Production of print heads with thermal bend detached actuators · CPC title

• B41J2202/11

  characterised by specific geometrical characteristics · CPC title