Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
US9510460B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9510460-B2 |
| Application number | US-201414488691-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 17, 2014 |
| Priority date | Sep 17, 2014 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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Official abstract text for this publication.
For aligning an electronic component to a required orientation, the electronic component is picked up and it is inspected while it is being held to determine its initial orientation. A précising mechanism is then rotated to correspond to the initial orientation of the electronic component. After the electronic component is secured on the précising mechanism in the initial orientation, the précising mechanism is rotated to align the electronic component to the required orientation. Thereafter, the electronic component that has been aligned to the required orientation may be picked up for further testing and/or processing.
Opening claim text (preview).
The invention claimed is: 1. A method for aligning an electronic component to a required orientation, comprising the steps of: picking up the electronic component; inspecting the electronic component to determine its initial orientation; rotating a précising mechanism to correspond to the initial orientation of the electronic component; securing the electronic component on the précising mechanism in the initial orientation; rotating the précising mechanism to align the electronic component to the required orientation; and thereafter picking up the electronic component that has been aligned to the required orientation. 2. The method as claimed in claim 1 , wherein the step of inspecting the electronic component to determine its initial orientation comprises the step of viewing the electronic component with a camera while the electronic component is being held in front of the camera. 3. The method as claimed in claim 2 , wherein the camera is in operative communication with the précising mechanism such that the précising mechanism is rotated based on information concerning the initial orientation of the electronic component so as to correspond therewith. 4. The method as claimed in claim 1 , wherein the step of rotating the précising mechanism further comprises the step of actuating a rotary motor that is operatively connected to the précising mechanism. 5. The method as claimed in claim 1 , wherein the précising mechanism comprises jaws which are configured to clamp onto side walls of the electronic component, and the step of rotating the précising mechanism to correspond to the initial orientation of the electronic component further comprises the step of rotating the jaws such that angular orientations of the jaws correspond to angular orientations of the side walls of the electronic component. 6. The method as claimed in claim 5 , wherein the step of securing the electronic component on the précising mechanism further comprises the step of clamping the side walls of the electronic component with the jaws, and prior to the step of picking up the electronic component that has been aligned to the required orientation, the electronic component is unclamped by the jaws.
for positioning, orientation or alignment · CPC title
electrically connecting electric components or wires to printed circuits · CPC title
for work-holder for assembly or disassembly · CPC title
Means to align and advance work part · CPC title
with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools · CPC title
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