Electrocaloric effect materials and thermal diodes

Patent metadata

Field	Value
Publication number	US-9508913-B2
Application number	US-99968410-A
Country	US
Kind code	B2
Filing date	Jun 18, 2010
Priority date	Jun 18, 2010
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

Examples are generally described that include a substrate, an electrocaloric effect material at least partially supported by the substrate, and a thermal diode at least partially supported by the electrocaloric effect material.

First claim

What is claimed is:

1. A device, comprising:
a substrate;
an electrocaloric effect material at least partially supported by the substrate; and
a thermal diode at least partially supported by the electrocaloric effect material, the thermal diode comprising two materials having different temperature coefficients of thermal conductivity, wherein the two materials are in thermal communication with one another.

2. The device of claim 1 , wherein the two materials comprise two metallic oxide crystalline materials.

3. The device of claim 1 , wherein the two materials comprise two cobalt oxide materials.

4. The device of claim 1 , wherein the two materials comprise lanthanum cobalt oxide and lanthanum strontium cobalt oxide.

5. The device of claim 1 , wherein the electrocaloric effect material comprises lead zirconate titanate.

6. The device of claim 1 , wherein the thermal diode comprises a first thermal diode, and wherein the device further comprises:
a second thermal diode between the substrate and the electrocaloric effect material.

7. The device of claim 1 , wherein the electrocaloric effect material comprises a first electrocaloric effect material and the thermal diode comprises a first thermal diode, and wherein the device further comprises:
a second electrocaloric effect material at least partially supported by the first thermal diode; and
a second thermal diode at least partially supported by the second electrocaloric effect material.

8. The device of claim 1 , further comprising a package that at least partially encloses the substrate, wherein the package is in thermal communication with the thermal diode.

9. The device of claim 1 , further comprising:
at least two electrodes positioned to apply an electric field across the electrocaloric effect material, wherein the electrocaloric effect material is configured to change temperature responsive to a change in the electric field, and wherein the thermal diode is configured to conduct heat away from the electrocaloric effect material.

10. The device of claim 9 , wherein the substrate defines a first face and a second face, and wherein at least one of the at least two electrodes comprises an interconnect that extends from the first face through the substrate to the second face.

11. A method to transfer heat to or from a surface, the method comprising:
applying an electric field across an electrocaloric effect material in thermal contact with the surface; and
transporting heat through a thermal diode in thermal contact with the electrocaloric effect material to a heat dump, wherein the thermal diode comprises two materials having different temperature coefficients of thermal conductivity, wherein the two materials are in thermal communication with one another.

12. The method of claim 11 , further comprising:
removing the electric field across the electrocaloric effect material; and
resisting heat transfer from the heat dump to the electrocaloric effect material with the thermal diode.

13. The method of claim 11 , wherein applying the electric field comprises pulsing the electric field across the electrocaloric effect material; and
wherein transporting comprises transporting heat through the thermal diode in a first direction during a pulse of the electric field.

14. The method of claim 11 , wherein transporting heat includes operating the thermal diode to allow heat transfer away from the surface.

15. A method to make a heat transfer device, the method comprising:
depositing an electrocaloric effect material on a surface of a substrate;
depositing a first layer of a thermal diode on the electrocaloric effect material, the first layer of the thermal diode having a first temperature coefficient of thermal conductivity; and
depositing a second layer of the thermal diode on the first layer of the thermal diode, the second layer of the thermal diode having a second temperature coefficient of thermal conductivity different than the first temperature coefficient of thermal conductivity.

16. The method of claim 15 , wherein depositing the electrocaloric effect material comprises depositing lead zirconate titanate.

17. The method of claim 15 , wherein depositing the first layer comprises depositing lanthanum cobalt oxide and depositing the first layer comprises depositing the first layer using pulsed laser or sputter deposition.

18. The method of claim 16 , wherein depositing the second layer comprises depositing lanthanum strontium cobalt oxide and depositing the second layer comprises depositing the second layer using diketonate based vapor deposition.

19. The method of claim 15 , further comprising patterning the electrocaloric effect material and the first and second layers of the thermal diode.

Assignees

• Kruglick Ezekiel
• Empire Technology Dev Llc

Inventors

• Kruglick Ezekiel

Classifications

• F25B2321/001

  by using electro-caloric effects · CPC title

• H01L37/02 Primary

  Electricity · mapped topic

• F25B21/00

  Machines, plants or systems, using electric or magnetic effects · CPC title

• Y02B30/66

  Cross-Sectional Technologies · mapped topic

• H10N15/10 Primary

  Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point · CPC title