Thermoelectric generator

Patent metadata

Field	Value
Publication number	US-2016197260-A1
Application number	US-201514589553-A
Country	US
Kind code	A1
Filing date	Jan 5, 2015
Priority date	Jan 5, 2015
Publication date	Jul 7, 2016
Grant date	—

Abstract

A thermoelectric generator for powering a load includes a first mounting plate, a second mounting plate, and a plurality of semiconductors positioned between the first and the second mounting plates. The plurality of semiconductors includes one of positive-type or negative-type semiconductor material.

First claim

What is claimed is:

1 . A thermoelectric generator for powering a load, said thermo-electric generator comprising:
a first mounting plate; a second mounting plate; and a plurality of semiconductors positioned between said first and said second mounting plates to form a semiconductor layer, wherein said semiconductor layer comprises one of positive-type or negative-type semiconductors.

2 . The thermoelectric generator in accordance with claim 1 , wherein each semiconductor includes a diameter within a range of between approximately 0.001 millimeters and approximately 4.0 millimeters.

3 . The thermoelectric generator in accordance with claim 1 further comprising at least one mechanical fastener configured to couple said first mounting plate to said second mounting plate.

4 . The thermoelectric generator in accordance with claim 1 , wherein said first mounting plate comprises a top surface and a first plurality of side edges, and wherein said second mounting plate comprises a bottom surface and a second plurality of side edges, said thermoelectric generator further comprising an insulating material applied to at least one of said top and said bottom surfaces proximate said first and said second pluralities of side edges.

5 . The thermoelectric generator in accordance with claim 1 further comprising a conductive adhesive applied to at least one of said first and said second mounting plates.

6 . The thermoelectric generator in accordance with claim 1 further comprising:
a first layer of a conductive adhesive applied to said first mounting plate;
a second layer of said conductive adhesive applied to said second mounting plate;
a layer of resistive material coupled between said first and said second layers of conductive adhesive.

7 . The thermoelectric generator in accordance with claim 1 further comprising a support structure coupled to said first mounting plate, wherein said support structure comprises at least one radius of curvature such that said thermoelectric generator is curved based on the radius of curvature.

8 . The thermoelectric generator in accordance with claim 7 , wherein said first mounting plate is integral with said support structure.

9 . A method of assembling a thermoelectric generator, said method comprising:
applying a plurality of semiconductors to a first mounting plate to form a semiconductor layer, wherein said semiconductor layer comprises one of positive-type or negative-type semiconductors; positioning a second mounting plate such that the semiconductor layer is positioned between the first and second mounting plates; and coupling the first mounting plate to the second mounting plate.

10 . The method in accordance with claim 9 , wherein applying a plurality of semiconductors comprises applying a plurality semiconductors that each include a diameter within a range of between approximately 0.001 millimeters and approximately 4.0 millimeters.

11 . The method in accordance with claim 9 , wherein coupling the first mounting plate to the second mounting plate comprises coupling the first mounting plate to the second mounting plate using mechanical fastener.

12 . The method in accordance with claim 9 , wherein the first mounting plate includes a top surface and a first plurality of side edges, and wherein the second mounting plate includes a bottom surface and a second plurality of side edges, said method further comprising applying an insulating material to at least one of the top and bottom surfaces proximate the first and second pluralities of side edges.

13 . The method in accordance with claim 9 further comprising applying a conductive adhesive to at least one of the first and second mounting plates.

14 . The method in accordance with claim 9 , wherein applying a plurality of semiconductors comprises applying a mixture of the plurality of semiconductors and a non-conductive medium.

15 . The method in accordance with claim 9 further comprising:
applying a first layer of a conductive adhesive to the first mounting plate;
applying a second layer of the conductive adhesive to the second mounting plate; and
applying a layer of resistive material between the first and second layers of conductive adhesive.

16 . The method in accordance with claim 9 further comprising coupling at least one of the first mounting plate and the second mounting plate to a support structure.

17 . A thermoelectric generator system comprising:
a support structure; and a thermoelectric generator coupled to said support structure, said thermoelectric generator comprising:
a first mounting plate;
a second mounting plate; and
a plurality of semiconductors positioned between said first and said second mounting plates to form a semiconductor layer, wherein said semiconductor layer comprises one of positive-type or negative-type semiconductors.

18 . The thermoelectric generator system in accordance with claim 17 further comprising:
a first layer of a conductive adhesive applied to said first mounting plate;
a second layer of said conductive adhesive applied to said second mounting plate; and
a layer of resistive material coupled between said first and said second layers of conductive adhesive.

19 . The thermoelectric generator system in accordance with claim 17 , wherein said support structure comprises an aircraft component.

20 . The thermoelectric generator system in accordance with claim 17 , wherein said support structure comprises at least one radius of curvature such that said thermoelectric generator is curved based on the radius of curvature.

Assignees

• Boeing Co

Inventors

• Smith Shawn M
• Darmstadt Patrick R

Classifications

• H01L37/02 Primary

  Electricity · mapped topic

• H10N10/851 Primary

  comprising inorganic compositions · CPC title

• H10N10/17 Primary

  characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title

• H10N15/10 Primary

  Thermoelectric devices using thermal change of the dielectric constant, e.g. working above and below the Curie point · CPC title