Pyroelectric aluminum nitride MEMS infrared sensor with selective wavelength infrared absorber

US9335217B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9335217-B2
Application numberUS-201414448877-A
CountryUS
Kind codeB2
Filing dateJul 31, 2014
Priority dateAug 1, 2013
Publication dateMay 10, 2016
Grant dateMay 10, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

A MEMS sensor for detecting electromagnetic waves in a particular frequency range is provided. In a preferred embodiment, the MEMS sensor comprises a bottom substrate layer; a first electrode layer over the substrate layer; a pyroelectric layer over the first electrode layer; and a second electrode layer over the pyroelectric layer; wherein a top electrode layer is patterned with a periodic structure that has a periodicity less than or equal to target infrared wavelength.

First claim

Opening claim text (preview).

What is claimed is: 1. A MEMS sensor comprising: a substrate layer; a first electrode layer adjacent the substrate layer; a pyroelectric layer adjacent the first electrode layer; and a second electrode layer adjacent the pyroelectric layer, wherein the second electrode layer is patterned with a periodic structure that has a periodicity less than or equal to 8 μm. 2. The sensor of claim 1 , wherein the patterned periodic structure comprises a hole array structure. 3. The sensor of claim 1 , wherein the patterned periodic structure comprises a stripe structure. 4. The sensor of claim 1 , wherein the periodic structure has a periodicity less than or equal to a target infrared wavelength according to the equation P≦λ where P is periodicity and λ is target infrared wavelength. 5. The sensor of claim 1 , wherein the sensor is comprised of at least two sensor elements and each of the two sensor elements has a periodic structure patterned with different periodicities. 6. The sensors of claims 1 through 5 , wherein the pyroelectric layer comprises a material selected from the group consisting of PZT, ZnO, PVDF, AlN, and c-axis oriented AlN. 7. The sensor of claim 1 , wherein the first electrode layer has a thickness ranging from about 10 nm to about 1000 nm. 8. The sensor of claim 1 , wherein the first electrode layer comprises Molybdenum. 9. The sensor of claim 1 , wherein the pyroelectric layer comprises AlN. 10. The sensor of claim 1 , wherein the pyroelectric layer has a thickness according to the equation 2×t×n λ ≦λ where t is the pyroelectric film thickness, λ is the target infrared wavelength, and n λ is the index of the pyroelectric material at the target infrared wavelength. 11. The sensor of claim 1 , wherein the second electrode has a thickness ranging from about 10 nm to about 1000 nm. 12. The sensor of claim 1 , wherein the second electrode comprises Molybdenum. 13. The sensor of claim 3 , wherein the patterned periodic structure is a hole array and the diameter of a hole in the hole array is provided according to the equation r≧P×0.5 where r is the hole diameter and P is the periodicity of the patterned periodic structure. 14. The sensor of claim 1 , wherein the periodic structure comprises a stripe structure having a line/spacing (L/S) of about 1. 15. The sensor of claim 1 , wherein the second electrode layer is a top layer of the sensor. 16. The sensor of claim 1 , further comprising a second pyroelectric layer adjacent to the substrate layer. 17. The sensor of claim 1 , wherein the periodic structure has a periodicity less than or equal to 105% of a target infrared wavelength according to the equation P≦1.05*λ where P is periodicity and λ is target infrared wavelength. 18. A MEMS sensor element comprising: a substrate layer; a first electrode layer adjacent the substrate layer; a pyroelectric layer adjacent the first electrode layer; and a second electrode layer adjacent the pyroelectric layer, wherein the second electrode layer is patterned with a periodic structure that has a periodicity less than or equal to a target infrared wavelength. 19. A method of making a MEMS sensor element, the method comprising: forming a first electrode layer on a substrate; forming a pyroelectric layer adjacent the electrode layer; forming a second electrode layer adjacent the pyroelectric layer; and, patterning the second electrode layer of the MEMS sensor to have a patterned periodic structure with a periodicity less than or equal to a target infrared wavelength.

Assignees

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Classifications

  • using capacitors, e.g. pyroelectric capacitors · CPC title

  • Infrared image sensors · CPC title

  • Manufacture or treatment of image sensors covered by group H10F39/12 · CPC title

  • Improve properties related to angular swinging, e.g. control resonance frequency · CPC title

  • G01J5/0853Primary

    having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid · CPC title

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What does patent US9335217B2 cover?
A MEMS sensor for detecting electromagnetic waves in a particular frequency range is provided. In a preferred embodiment, the MEMS sensor comprises a bottom substrate layer; a first electrode layer over the substrate layer; a pyroelectric layer over the first electrode layer; and a second electrode layer over the pyroelectric layer; wherein a top electrode layer is patterned with a periodic str…
Who is the assignee on this patent?
Univ California
What technology area does this patent fall under?
Primary CPC classification G01J5/0853. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 10 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).