Infrared imaging device including drive and signal lines configured to electrically connect first and second substrates
US-11902696-B2 · Feb 13, 2024 · US
US9335217B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9335217-B2 |
| Application number | US-201414448877-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 31, 2014 |
| Priority date | Aug 1, 2013 |
| Publication date | May 10, 2016 |
| Grant date | May 10, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A MEMS sensor for detecting electromagnetic waves in a particular frequency range is provided. In a preferred embodiment, the MEMS sensor comprises a bottom substrate layer; a first electrode layer over the substrate layer; a pyroelectric layer over the first electrode layer; and a second electrode layer over the pyroelectric layer; wherein a top electrode layer is patterned with a periodic structure that has a periodicity less than or equal to target infrared wavelength.
Opening claim text (preview).
What is claimed is: 1. A MEMS sensor comprising: a substrate layer; a first electrode layer adjacent the substrate layer; a pyroelectric layer adjacent the first electrode layer; and a second electrode layer adjacent the pyroelectric layer, wherein the second electrode layer is patterned with a periodic structure that has a periodicity less than or equal to 8 μm. 2. The sensor of claim 1 , wherein the patterned periodic structure comprises a hole array structure. 3. The sensor of claim 1 , wherein the patterned periodic structure comprises a stripe structure. 4. The sensor of claim 1 , wherein the periodic structure has a periodicity less than or equal to a target infrared wavelength according to the equation P≦λ where P is periodicity and λ is target infrared wavelength. 5. The sensor of claim 1 , wherein the sensor is comprised of at least two sensor elements and each of the two sensor elements has a periodic structure patterned with different periodicities. 6. The sensors of claims 1 through 5 , wherein the pyroelectric layer comprises a material selected from the group consisting of PZT, ZnO, PVDF, AlN, and c-axis oriented AlN. 7. The sensor of claim 1 , wherein the first electrode layer has a thickness ranging from about 10 nm to about 1000 nm. 8. The sensor of claim 1 , wherein the first electrode layer comprises Molybdenum. 9. The sensor of claim 1 , wherein the pyroelectric layer comprises AlN. 10. The sensor of claim 1 , wherein the pyroelectric layer has a thickness according to the equation 2×t×n λ ≦λ where t is the pyroelectric film thickness, λ is the target infrared wavelength, and n λ is the index of the pyroelectric material at the target infrared wavelength. 11. The sensor of claim 1 , wherein the second electrode has a thickness ranging from about 10 nm to about 1000 nm. 12. The sensor of claim 1 , wherein the second electrode comprises Molybdenum. 13. The sensor of claim 3 , wherein the patterned periodic structure is a hole array and the diameter of a hole in the hole array is provided according to the equation r≧P×0.5 where r is the hole diameter and P is the periodicity of the patterned periodic structure. 14. The sensor of claim 1 , wherein the periodic structure comprises a stripe structure having a line/spacing (L/S) of about 1. 15. The sensor of claim 1 , wherein the second electrode layer is a top layer of the sensor. 16. The sensor of claim 1 , further comprising a second pyroelectric layer adjacent to the substrate layer. 17. The sensor of claim 1 , wherein the periodic structure has a periodicity less than or equal to 105% of a target infrared wavelength according to the equation P≦1.05*λ where P is periodicity and λ is target infrared wavelength. 18. A MEMS sensor element comprising: a substrate layer; a first electrode layer adjacent the substrate layer; a pyroelectric layer adjacent the first electrode layer; and a second electrode layer adjacent the pyroelectric layer, wherein the second electrode layer is patterned with a periodic structure that has a periodicity less than or equal to a target infrared wavelength. 19. A method of making a MEMS sensor element, the method comprising: forming a first electrode layer on a substrate; forming a pyroelectric layer adjacent the electrode layer; forming a second electrode layer adjacent the pyroelectric layer; and, patterning the second electrode layer of the MEMS sensor to have a patterned periodic structure with a periodicity less than or equal to a target infrared wavelength.
using capacitors, e.g. pyroelectric capacitors · CPC title
Infrared image sensors · CPC title
Manufacture or treatment of image sensors covered by group H10F39/12 · CPC title
Improve properties related to angular swinging, e.g. control resonance frequency · CPC title
having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.