Inline measurement of molding material thickness using terahertz reflectance

Patent metadata

Field	Value
Publication number	US-9508610-B2
Application number	US-201414499120-A
Country	US
Kind code	B2
Filing date	Sep 27, 2014
Priority date	Sep 27, 2014
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

A method including emitting a terahertz beam from a light source at a layer of molding material; detecting a reflectance of the beam; and determining a thickness of the layer of molding material. A system including a panel supporter operable to support a panel including a plurality of substrates arranged in a planar array; a light source operable to emit a terahertz beam at a panel on the panel supporter; a detector operable to detect a reflection of a terahertz beam emitted at a panel; and a processor operable to determine a thickness of a material on the panel based on a time delay for an emitted terahertz beam to be detected by the detector.

First claim

What is claimed is:

1. A method comprising:
emitting a terahertz beam from a light source at a layer of molding material comprising an organic resin on an integrated circuit substrate, wherein terahertz light can penetrate each of the molding material and the substrate producing a first reflectance at an air/molding material interface, a second reflectance at a molding material/substrate interface and a third reflectance from the substrate;
detecting the second reflectance of th…

Assignees

• Intel Corp

Inventors

• Liu Shuhong
• Ghosh Nilanjan Z
• Wang Zhiyong
• Goyal Deepak
• Gokhale Shripad
• Zhang Jieping

Classifications

• H10W74/10

  Electricity · mapped topic

• H10W72/0198

  Electricity · mapped topic

• H10W90/724

  Electricity · mapped topic

• H10W74/117

  Electricity · mapped topic

• H10P74/203 Primary

  Electricity · mapped topic