Joining method and joining component

Patent metadata

Field	Value
Publication number	US-9505084-B2
Application number	US-201214345031-A
Country	US
Kind code	B2
Filing date	Jul 10, 2012
Priority date	Sep 22, 2011
Publication date	Nov 29, 2016
Grant date	Nov 29, 2016

Abstract

In joining members to be joined ( 1, 1 ) by heating the members to be joined ( 1, 1 ) that are mated with intervening an insert ( 2 ) while applying opposing loads to the members to be joined ( 1, 1 ), so as to allow eutectic reaction to occur between the members to be joined ( 1, 1 ) and the insert ( 2 ) to discharge a eutectic melt from a joining plane along with an oxide film ( 1 a ) of the members to be joined, the members to be joined ( 1 ) are brought into contact with the insert ( 2 ) so that the oxide film ( 1 a ) is broken by a stress concentrating means previously provided at least one of joining portions breaks to produce a starting point of the eutectic reaction.

First claim

The invention claimed is:

1. A joining method comprising:
preparing two members to be joined, each of the two members to be joined having an oxide film disposed over a surface thereof,
preparing an insert including an uneven structure for breaking an oxide film, the uneven structure including at least one protrusion having an aspect ratio of greater than or equal to 0.001,
disposing the insert between the two members to be joined,
applying pressure to the two members to be joined to break the oxide film of the two members to be joined with the uneven structure of the insert, and
heating the two members to be joined to initiate a eutectic reaction between the two members to be joined and the insert, such that a eutectic melt produced by the eutectic reaction and the broken oxide film are discharged from between the two members to be joined.

2. The joining method according to claim 1 , wherein the protrusion comprises an approximately flat face.

3. The joining method according to claim 1 , wherein the protrusion comprises a linear shape.

4. The joining method according to claim 1 , wherein the protrusion comprises an approximately pointed shape.

5. The joining method according to claim 1 , wherein the protrusion comprises an approximately spherical shape.

6. The joining method according to claim 1 , wherein the uneven structure comprises a plurality of protrusions, and a height of the protrusions of the uneven structure is not less than a difference in vertical position of crests of all of the protrusions.

7. The joining method according to claim 1 , wherein the uneven structure has a pitch of 1 μm or more.

8. The joining method according to claim 7 , wherein the uneven structure has an aspect ratio of 0.1 or more and a pitch of 10 μm or more.

9. The joining method according to claim 1 , wherein the uneven structure comprises a plurality of protrusions with different shapes.

10. The joining method according to claim 1 , wherein preparing the insert comprises forming the uneven structure by plastic forming.

11. The joining method according to claim 1 , wherein the applied pressure is 30 MPa or less.

12. The joining method according to claim 1 , wherein the insert is made of foil material.

13. A component produced by the joining method according to claim 1 , wherein the two members to be joined are directly joined without an oxide film disposed between joined portions of the two members to be joined.

14. The component according to claim 13 , wherein a component derived from the insert is diffused in a vicinity of joining faces of the two members to be joined.

15. A joining structure produced by the joining method according to claim 1 , comprising:
a direct joining portion disposed between the two members to be joined, and
an indirect joining portion comprising a mixture of the oxide film of the two members to be joined and a product of the eutectic reaction,
wherein the direct joining portion and the indirect joining portion are randomly located on a joining interface.

Assignees

• Nakagawa Shigeyuki
• Uehara Yoshitaka
• Yamamoto Chika
• Miyamoto Kenji
• Nanbu Toshikazu
• Nissan Motor

Inventors

• Nakagawa Shigeyuki
• Uehara Yoshitaka
• Yamamoto Chika
• Miyamoto Kenji
• Nanbu Toshikazu

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• B23K20/026 Primary

  with diffusion of soldering material · CPC title