Optical apparatus having resin encased stacked optical and semiconductor devices

Patent metadata

Field	Value
Publication number	US-9502455-B2
Application number	US-201514721010-A
Country	US
Kind code	B2
Filing date	May 26, 2015
Priority date	Nov 30, 2012
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A downsized, highly reliable optical apparatus is stably and easily manufactured with high productivity. The optical apparatus includes: an optical device having a principal surface including an optical unit; a transparent member disposed facing the optical unit; a semiconductor device disposed above a back surface of the optical device and electrically connected to the optical device, the back surface being opposite the principal surface; and a resin member provided in a region adjacent to the optical device and the semiconductor device above a surface of the transparent member, the surface of the transparent member facing the optical device.

First claim

What is claimed is:

1. An optical apparatus comprising:
an optical device having a principal surface including an optical unit;
a transparent member disposed facing the optical unit;
a semiconductor device disposed above a back surface of the optical device and electrically connected to the optical device, the back surface being opposite the principal surface;
a resin member provided in a region adjacent to the optical device and the semiconductor device above a surface of the transparent member, the surface of the transparent member facing the optical device;
a first electrode included in the principal surface of the optical device;
a second electrode, a third electrode, and a first wiring element provided on the surface of the transparent member that faces the optical device, the second electrode facing the first electrode, the third electrode being located in a more peripheral region of the optical apparatus than the second electrode, the first wiring element electrically connecting the second electrode and the third electrode;
a first protruding electrode (i) disposed between the first electrode and the second electrode and (ii) electrically connecting the first electrode and the second electrode;
a first penetrating electrode (i) provided in a more peripheral region of the resin member than the optical device and the semiconductor device, (ii) electrically connected to the optical device, and (iii) having one end connected to the third electrode; and
a second wiring element and an external electrode terminal provided above a surface of the resin member, the second wiring element being connected to another end of the first penetrating electrode, the surface of the resin member being on an opposite side of the resin member from the transparent member.

2. The optical apparatus according to claim 1 , wherein the resin member covers a side surface of the optical device, at least a part of the back surface of the optical device, and a side surface of the semiconductor device.

3. The optical apparatus according to claim 1 , wherein the resin member covers a side surface of the optical device, a side surface of the semiconductor device, and a part of a surface of the semiconductor device, the surface of the semiconductor device being opposite a circuit surface of the semiconductor device.

4. The optical apparatus according to claim 1 , further comprising:
a first electrode included in the principal surface of the optical device; and
an external electrode terminal provided above a surface of the resin member and electrically connected to the first electrode, the surface of the resin member being on an opposite side of the resin member from the transparent member.

5. The optical apparatus according to claim 4 , wherein the external electrode terminal is provided at a position that does not overlap with the semiconductor device as seen in a plan view of the principal surface of the optical device.

6. The optical apparatus according to claim 1 , wherein in the resin member, a portion that covers a region adjacent to the optical device and the semiconductor device and a portion that covers a region adjacent to the first protruding electrode are made from the same material.

7. The optical apparatus according to claim 1 , wherein the optical device is a solid-state imaging device.

8. The optical apparatus according to claim 1 , wherein the semiconductor device is disposed in alignment with a central portion of the transparent member.

9. The optical apparatus according to claim 1 , further comprising:
a fourth electrode, a fifth electrode, and a third wiring element provided on the back surface of the optical device, the fifth electrode being located in a more peripheral region of the optical apparatus than the fourth electrode, the third wiring element electrically connecting the fourth electrode and the fifth electrode;
a second protruding electrode via which the semiconductor device is flip-chip bonded to the fourth electrode; and
a second penetrating electrode provided in the resin member and having one end connected to the fifth electrode.

10. The optical apparatus according to claim 1 , wherein in the resin member, a portion that covers a region adjacent to the optical device and a portion that covers a region adjacent to the semiconductor device are made from the same material.

11. The optical apparatus according to claim 1 , further comprising a heat dissipating member (i) provided on the back surface of the optical device in the resin member and (ii) penetrating the resin member.

12. The optical apparatus according to claim 11 , further comprising
a first penetrating electrode (i) provided in a more peripheral region of the resin member than the optical device and the semiconductor device, and (ii) electrically connected to the optical device,
wherein the heat dissipating member has a diameter larger than a diameter of the first penetrating electrode.

Assignees

• Panasonic Corp

Inventors

• Akahoshi Toshitaka
• Yamashita Hiroki
• Dohi Shigefumi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/874

  On different surfaces · CPC title